Patents by Inventor Yosuke IWAMOTO

Yosuke IWAMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal head and thermal printer
    Patent number: 11731433
    Abstract: A thermal head includes a head base, a wiring board, a plurality of recessed portions, a contact portion, a plurality of drive ICs, a plurality of wire members, and a resin member. The head base includes a substrate. The wiring board is located adjacent to the head base. The plurality of recessed portions are located adjacent to the head base. The contact portion is located between the recessed portions adjacent to each other, and the substrate and the wiring board are in contact with each other at the contact portion. The plurality of drive ICs are located on the first surface of the wiring board so as to face one by one the plurality of recessed portions. The plurality of wire members are located across the recessed portions and electrically connect the substrate and the drive ICs. The resin member seals the plurality of wire members and the plurality of drive ICs.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: August 22, 2023
    Assignee: KYOCERA CORPORATION
    Inventors: Narito Kaji, Yosuke Iwamoto, Ryohei Matsubara
  • THERMAL HEAD AND THERMAL PRINTER
    Publication number: 20220396081
    Abstract: A thermal head includes a head base, a wiring board, a plurality of recessed portions, a contact portion, a plurality of drive ICs, a plurality of wire members, and a resin member. The head base includes a substrate. The wiring board is located adjacent to the head base. The plurality of recessed portions are located adjacent to the head base. The contact portion is located between the recessed portions adjacent to each other, and the substrate and the wiring board are in contact with each other at the contact portion. The plurality of drive ICs are located on the first surface of the wiring board so as to face one by one the plurality of recessed portions. The plurality of wire members are located across the recessed portions and electrically connect the substrate and the drive ICs. The resin member seals the plurality of wire members and the plurality of drive ICs.
    Type: Application
    Filed: November 19, 2020
    Publication date: December 15, 2022
    Inventors: Narito KAJI, Yosuke IWAMOTO, Ryohei MATSUBARA