Abstract: This photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond, and (C) a photopolymerization initiator, in which the photosensitive resin composition has an absorbance with respect to light at a wavelength of 365 nm per 1 ?m of thickness of more than 0.0041 and 0.0130 or less.

Abstract: A photosensitive resin composition of one aspect of the present disclosure is a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a sensitizer, in which the binder polymer has a structural unit derived from an acrylic acid and a structural unit derived from styrene or a styrene derivative, and an absorbance of the photosensitive resin composition per 1 ?m of thickness with respect to light having a wavelength of 365 nm is 0.0030 to 0.0120.

Abstract: A photosensitive element according to the present disclosure can be produced by a method including a step of forming a photosensitive layer on a support film using a photosensitive resin composition and a step of bonding a winding outer surface of a protective film having a roll shape onto the photosensitive layer, and includes a support film, a photosensitive layer provided on one surface of the support film, and a protective film provided on a surface of the photosensitive layer opposite to the support film, and the protective film has a weld line on a surface opposite to the photosensitive layer.

Abstract: One aspect of the present disclosure relates to a photosensitive element including a support film containing a lubricant and a photosensitive layer formed on a first surface of the support film, in which a number of lubricants having a particle size of 1.0 ?m or more contained in the first surface of the support film is 10 or less per 0.0225 mm2.

Abstract: A pattern inspection method includes: a coordinate measuring step for measuring the coordinates of a contour of a pattern on a target substrate, which is either a printed circuit board or a semiconductor package substrate for mounting of semiconductor elements on which the pattern is formed; and an inspection step for inspecting the pattern based on the coordinates. A target substrate selection method includes: a coordinate measuring step for measuring the coordinates of a contour of a pattern on a target substrate, which is either a printed circuit board or a semiconductor package substrate for mounting of semiconductor elements on which the pattern is formed; an inspection step for inspecting the pattern based on the measured coordinates; and an evaluation step for evaluating the pattern based on an inspection result in the inspection step.

Abstract: A photosensitive element according to the present disclosure can be produced by a method including a step of forming a photosensitive layer on a support film using a photosensitive resin composition and a step of bonding a winding outer surface of a protective film having a roll shape onto the photosensitive layer, and includes a support film, a photosensitive layer provided on one surface of the support film, and a protective film provided on a surface of the photosensitive layer opposite to the support film, and the protective film has a weld line on a surface opposite to the photosensitive layer.