Abstract: A camera module is provided with: an imaging element which is formed in a rectangular shape and has a plurality of pads provided to a back surface opposite from an imaging surface; a substrate where, on the same plane, a plurality of linear conductors are lined up in parallel and have an insulating coating in a rectangular shape such that the side of one end and the other end in the direction of extension of the conductors is shorter than one side of the imaging element, the conductors at the one end and the other end being exposed at a plate surface front and/or back; and a low-melting-point electroconductive material for connecting, to each of the pads, the conductors of the one end that are exposed due to one end surface of the substrate being abutted against the back surface.

Abstract: This camera module comprises: an imaging element which is formed in a rectangular shape and to which is provided a plurality of pads on the rear, which is the reverse side from the image capture surface; a wire positioning/fixing body which fixes together a plurality of parallel wires extending in a direction approximately perpendicular to the rear surface, and has each of the conductors of the wires protrude from the opposing end surface which is parallel to the rear surface in accordance with to each of the pads; and electro-conductive materials which conduct electricity from the tip of the conductors to each of the plurality of pads.

Abstract: A camera module is provided with: an imaging element which is formed in a rectangular shape and has a plurality of pads provided to a back surface opposite from an imaging surface; a substrate where, on the same plane, a plurality of linear conductors are lined up in parallel and have an insulating coating in a rectangular shape such that the side of one end and the other end in the direction of extension of the conductors is shorter than one side of the imaging element, the conductors at the one end and the other end being exposed at a plate surface front and/or back; and a low-melting-point electroconductive material for connecting, to each of the pads, the conductors of the one end that are exposed due to one end surface of the substrate being abutted against the back surface.

Abstract: A culture vent plug, a lid body kit, and a frame body for the culture vent plug are provided having a configuration which prevents air permeability from lowering when a vessel opening portion is blocked and excellent in cleanability and sterilizability. A vent plug body capable of securing ventilation between inside and outside a culture vessel; and a frame body including a holding portion holding the vent plug body, and an attachment portion capable of being attached to and detached from a vessel opening of the culture vessel are included, and the vent plug body is held by the holding portion so as to be capable of being repeatedly attached to and detached from the frame body.