Patents by Inventor Yosuke KOMA

Yosuke KOMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240424271
    Abstract: A microneedle structure of the present invention comprises: a liquid-impermeable base material that has a through-hole; a liquid-absorbable absorbent material that fills the through-hole; a needle-shaped portion that is provided on one surface side of the base material and has a flow channel formed therein; and a functional member that is provided on the other surface side of the base material. The needle-shaped portion and the absorbent material are connected to each other, and the absorbent material and the functional member are connected to each other.
    Type: Application
    Filed: June 30, 2022
    Publication date: December 26, 2024
    Inventors: Yosuke KOMA, Beomjoon KIM, JongHo PARK
  • Publication number: 20240180465
    Abstract: Microneedle structure of the present invention includes a needle-shaped portion on one surface side of a base material. The base material has fluid permeability in its thickness direction. The needle-shaped portion is composed of a composition that contains a low-melting-point resin having a melting point of 150° C. or lower. The needle-shaped portion has a surface and an interior that are formed with hole portions. The method for producing a microneedle structure of the present invention includes a bonding step of heating a composition containing a low-melting-point resin having a melting point of 150° C. or lower to bond the heated low-melting-point resin and the base material. Thus, the microneedle structure and the method for producing the microneedle structure are provided, in which the influence of high temperature on the base material is reduced and the degree of freedom in selecting the base material is high.
    Type: Application
    Filed: March 31, 2022
    Publication date: June 6, 2024
    Inventor: Yosuke KOMA
  • Publication number: 20240044369
    Abstract: A device EA that manufactures a projection-bearing body having a structure in which projections CV are formed on a bearing sheet BS comprises: a material transfer unit 10 that executes a material transfer step of transferring a base material BM containing a plastic material PM; a material support unit 20 that executes a material support step of supporting the base material BM transferred by the material transfer unit 10, by a support member 22 having a support surface 22A in which recesses 22B corresponding to the projections CV are formed; and a press unit 30 that executes a pressing step of pressing the base material BM in a direction toward the support surface 22A to fill the plastic material PM in the recesses 22B and forming the projections CV from the plastic material PM. In the base material BM, the plastic material PM is stacked on one surface of the bearing sheet BS.
    Type: Application
    Filed: September 12, 2023
    Publication date: February 8, 2024
    Applicant: LINTEC CORPORATION
    Inventor: Yosuke KOMA
  • Publication number: 20240001625
    Abstract: A device EA that manufactures a projection-bearing body CB in which projections CV are formed comprises: a material support unit 20 that executes a material support step of supporting a base material BM, by a support member 22 having a support surface 22A in which recesses 22B corresponding to the projections CV are formed; a press unit 30 that executes a pressing step of pressing the base material BM in a direction toward the support surface 22A to fill the plastic material PM in the recesses 22B and forming the projections CV from the plastic material to form the projection-bearing body CB; and a separating unit 60 that executes a separating step of separating the projection-bearing body CB from the support member 22. The support member 22 has a structure dividable into a plurality of support members, and the separating unit 60 includes an individually separating unit 63 that separates the divided first and second support member 22?, 22? individually from the projection-bearing body CB.
    Type: Application
    Filed: September 12, 2023
    Publication date: January 4, 2024
    Applicant: LINTEC CORPORATION
    Inventor: Yosuke KOMA
  • Patent number: 10450485
    Abstract: A pressure sensitive adhesive sheet is provided which comprises a pressure sensitive adhesive layer formed of a pressure sensitive adhesive composition. The pressure sensitive adhesive composition contains an aliphatic polycarbonate and a pressure sensitive adhesive resin other than the aliphatic polycarbonate. The pressure sensitive adhesive sheet can be reduced in the adhesive strength at desired timing by a novel mechanism of action so that the release of an adherend becomes easy. The above pressure sensitive adhesive composition preferably contains an acid/base generator that generates an acid or a base by applying energy.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: October 22, 2019
    Assignees: LINTEC CORPORATION, SUMITOMO SEIKA CHEMICALS CO., LTD.
    Inventors: Yosuke Koma, Yutaka Nanashima, Yoshitomo Ono, Kiyoshi Nishioka, Shizuka Hachiken
  • Publication number: 20180298238
    Abstract: A pressure sensitive adhesive sheet is provided which comprises a pressure sensitive adhesive layer formed of a pressure sensitive adhesive composition. The pressure sensitive adhesive composition contains an aliphatic polycarbonate and a pressure sensitive adhesive resin other than the aliphatic polycarbonate. The pressure sensitive adhesive sheet can be reduced in the adhesive strength at desired timing by a novel mechanism of action so that the release of an adherend becomes easy. The above pressure sensitive adhesive composition preferably contains an acid/base generator that generates an acid or a base by applying energy.
    Type: Application
    Filed: October 12, 2016
    Publication date: October 18, 2018
    Inventors: Yosuke KOMA, Yutaka NANASHIMA, Yoshitomo ONO, Kiyoshi NISHIOKA, Shizuka HACHIKEN
  • Patent number: 9905451
    Abstract: As a semiconductor-related-member processing sheet which can stably achieve to enhance the removability of the semiconductor-related-member processing sheet and to suppress the reliability degradation of members comprising chips manufactured from a semiconductor-related member using the semiconductor-related-member processing sheet, there is provided a semiconductor-related-member processing sheet, comprising a base material and a pressure sensitive adhesive layer provided on or above one surface of the base material, wherein the pressure sensitive adhesive layer comprises one or more types of energy ray polymerizable compounds having an energy ray polymerizable functional group, wherein at least one type of the energy ray polymerizable compounds is a polymerizable branched polymer that is a polymer having a branched structure, wherein a contact angle on a measurement target surface is 40° or less when measured using a water droplet under an environment of 25° C. and a relative humidity of 50%.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: February 27, 2018
    Assignee: LINTEC CORPORATION
    Inventors: Yosuke Koma, Takuo Nishida, Misaki Sakamoto
  • Publication number: 20160372358
    Abstract: As a semiconductor-related-member processing sheet which can stably achieve to enhance the removability of the semiconductor-related-member processing sheet and to suppress the reliability degradation of members comprising chips manufactured from a semiconductor-related member using the semiconductor-related-member processing sheet, there is provided a semiconductor-related-member processing sheet, comprising a base material and a pressure sensitive adhesive layer provided on or above one surface of the base material, wherein the pressure sensitive adhesive layer comprises one or more types of energy ray polymerizable compounds having an energy ray polymerizable functional group, wherein at least one type of the energy ray polymerizable compounds is a polymerizable branched polymer that is a polymer having a branched structure, wherein a contact angle on a measurement target surface is 40° or less when measured using a water droplet under an environment of 25° C. and a relative humidity of 50%.
    Type: Application
    Filed: March 2, 2015
    Publication date: December 22, 2016
    Inventors: Yosuke KOMA, Takuo NISHIDA, Misaki SAKAMOTO