Patents by Inventor Yosuke Nishikawa

Yosuke Nishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240100826
    Abstract: A power supply control apparatus comprises a first power supply supplying power to a controller and a second power supply supplying power to an operation unit and a power controller. The operation unit receives an operation for switching the first power supply on and off. The power controller is operable to turn on the first power supply according to the signal from a timer or the operation by the operation unit, and to turn off the first power supply according to a state of the controller. The controller, upon at least either of the operation by the operation unit or the signal from the timer, performs a setting to the timer of a time at which to turn on the power from the first power supply or a time at which to turn off the power from the first power supply.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 28, 2024
    Inventors: TAKAHIRO AIDA, YOSUKE EZUMI, TAKUHIRO OGUSHI, YUKINORI NISHIKAWA, HIDEYUKI UEKI
  • Patent number: 11936217
    Abstract: An electric power supply system includes an electric power reception apparatus and an electric power supply apparatus adapted to supply electric power to the electric power reception apparatus when the electric power reception apparatus is placed on the electric power supply apparatus. The electric power supply apparatus includes a plurality of electric power supply units adapted to supply electric power by electromagnetic induction to the electric power reception apparatus. A selection unit of the electric power supply apparatus selects, from the total plurality of electric power supply units, a plurality of electric power supply units whose location corresponds to a position where the electric power reception apparatus is placed, and a control unit controls the supply of electric power such that electric power is supplied to the electric power reception apparatus from the selected plurality of electric power supply units.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: March 19, 2024
    Assignee: Sony Group Corporation
    Inventors: Yosuke Kozuma, Shinpei Nishikawa, Shinji Kimura, Yusuke Hori, Goro Mikano, Yuuki Iwasaki, Shigetoshi Onitsuka
  • Patent number: 10400347
    Abstract: To provide a conductive member capable of suppressing an increase in contact resistance, and a production method therefor. To solve the problem by providing a conductive member having a Ni plating layer 3 on the surface of contact parts 2 provided on a substrate 1, an arithmetic average roughness Sa of the surface of the Ni plating layer 3 being 20 nm or more. In the Ni plating layer 3, the full width half maximum of a peak at the position of a Ni (200) plane in an x-ray diffraction diagram is preferably 0.6 or less, and an indentation hardness HIT of the Ni plating layer 3 is preferably 5000 n/mm2 or less.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: September 3, 2019
    Assignee: NIPPON LIGHT METAL COMPANY, LTD.
    Inventors: Yosuke Nishikawa, Sayuri Shimizu, Shinichiro Sumi
  • Publication number: 20180298510
    Abstract: [Problem] To provide a conductive member capable of suppressing an increase in contact resistance, and a production method therefor. [Solution] To solve the problem by providing a conductive member having a Ni plating layer 3 on the surface of contact parts 2 provided on a substrate 1, an arithmetic average roughness Sa of the surface of the Ni plating layer 3 being 20 nm or more. In the Ni plating layer 3, the full width half maximum of a peak at the position of a Ni (200) plane in an x-ray diffraction diagram is preferably 0.6 or less, and an indentation hardness HIT of the Ni plating layer 3 is preferably 5000 n/mm2 or less.
    Type: Application
    Filed: August 5, 2016
    Publication date: October 18, 2018
    Inventors: Yosuke NISHIKAWA, Sayuri SHIMIZU, Shinichiro SUMI
  • Patent number: 9825377
    Abstract: A conductive member of the present invention includes: a metallic conductive base material including a joining region to be joined to another conductive member when the conductive member is used; and a conductive-auxiliary-coating-agent layer for imparting conductivity and an oxidation preventing property to a joining section between the joining region and another conductive member when the conductive member is used, the conductive-auxiliary-coating-agent layer being formed by applying a conductive auxiliary coating agent to the joining region of the conductive base material, in which the joining region of the conductive base material has a surface roughness of 0.6 ?m or less in terms of an arithmetic mean roughness Ra specified in JISB0601 (1994).
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: November 21, 2017
    Assignee: NIPPON LIGHT METAL COMPANY, LTD.
    Inventors: Yosuke Nishikawa, Manabu Okubo, Yuichi Tamaki, Kei Iwasaki
  • Publication number: 20160064836
    Abstract: Provided is a conductive member that includes a joining section excellent in conductivity and oxidation preventing property, the conductive member being capable of stably keeping contact resistance low even in the case where a contact surface pressure is low when joined to another conductive member, and being capable of being joined to another conductive member simply and quickly.
    Type: Application
    Filed: May 29, 2014
    Publication date: March 3, 2016
    Applicant: NIPPON LIGHT METAL COMPANY, LTD.
    Inventors: Yosuke NISHIKAWA, Manabu OKUBO, Yuichi TAMAKI, Kei IWASAKI
  • Publication number: 20150044493
    Abstract: Provided are: a method of anchoring Sn powder that allows a Sn coating layer exhibiting excellent adhesion property and excellent heat cycle property to be adhered to and deposited on a surface of an aluminum substrate by means of a cold spray process, which is low in device cost and is high in productivity; and an electrically-conductive aluminum member produced by the method. The method of anchoring Sn powder onto an aluminum substrate is a method of anchoring Sn powder onto a surface of an aluminum substrate including depositing and anchoring Sn powder to form a Sn coating layer on the surface of the aluminum substrate by means of a cold spray process, the method including spraying the Sn powder onto the aluminum substrate under spray conditions of an operating gas temperature of 60° C. or less, an operating gas pressure of 0.30 MPa or more, and a spray distance between a spray gun nozzle and the aluminum substrate of from 5 to 30 mm.
    Type: Application
    Filed: March 19, 2013
    Publication date: February 12, 2015
    Applicant: NIPPON LIGHT METAL COMPANY, LTD
    Inventors: Ryo Yoshida, Hisashi Hori, Yosuke Nishikawa, Sayuri Shimizu
  • Publication number: 20140308602
    Abstract: Provided are a collector plate for a fuel cell, which has low contact resistance and excellent corrosion resistance, and can be reliably used for a long period of time, while exhibiting excellent cost performance, and a method of producing the collector plate for a fuel cell. A collector plate for a fuel cell (1), which is provided on both ends of a cell stack in which a plurality of fuel cell units are stacked and is used for collecting current, includes: an aluminum substrate (2) formed of aluminum or an aluminum alloy; and an Ni plating film (4); a noble metal plating film (5) including one or more noble metals selected from the group consisting of Pd, Pt, Ag, Rh, Ir, Os, and Ru; and an Au plating film (6), the films being formed on one surface of the aluminum substrate (2).
    Type: Application
    Filed: October 18, 2012
    Publication date: October 16, 2014
    Applicant: Nippon Light Metal Company, Ltd.
    Inventors: Yosuke Nishikawa, Yoshiyuki Hatazawa, Yoshihiro Taguchi, Toshihiro Nakagawa, Atsushi Oota