Patents by Inventor Yosuke Nitta

Yosuke Nitta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240121898
    Abstract: A flexible printed circuit board according to an embodiment includes a base film and a first wire. The base film has a first surface. The first wire is disposed on the first surface. The first wire has a first layer and a second layer. The first layer is disposed on the first surface directly or indirectly. The second layer covers the first layer. In the first surface, a first groove is formed next to the first layer in a plan view. The second layer on a side surface of the first layer exists on a bottom surface and a side surface of the first groove.
    Type: Application
    Filed: May 27, 2022
    Publication date: April 11, 2024
    Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Yosuke FUKAYA, Koji NITTA, Daisuke SATO
  • Patent number: 11956630
    Abstract: A control device comprising, a control section configured to control an authentication process of performing a process related to device authentication together with at least one communication device on a basis of information included in a signal received through wireless communication with the communication device, wherein the control section performs control in such a manner that a signal including authentication information that is information to be used for the authentication process is transmitted to the communication device through the wireless communication, the authentication information varying depending on signal types, which are types of roles of signals to be transmitted to the communication device in the authentication process.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: April 9, 2024
    Assignee: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO
    Inventors: Yosuke Ohashi, Masateru Furuta, Yuki Kono, Shigenori Nitta
  • Publication number: 20240006437
    Abstract: While improving the bonding strength between a plurality of semiconductor substrates, the passage of noise from one of the plurality of semiconductor substrates to another is suppressed.
    Type: Application
    Filed: November 8, 2021
    Publication date: January 4, 2024
    Inventors: YOSUKE NITTA, NOBUTOSHI FUJII, SUGURU SAITO
  • Publication number: 20230395636
    Abstract: To provide a solid-state imaging device capable of further improving quality and reliability of the solid-state imaging device. Provided is a solid-state imaging device including: a first substrate; a second substrate laminated on the first substrate by direct bonding on a side opposite to a light incident side of the first substrate, the second substrate having a size different from a size of the first substrate; a third substrate provided on a side opposite to a light incident side of the second substrate; and an insulating layer formed between the first substrate and the third substrate, in which the third substrate includes a well formed on a light incident side of the third substrate.
    Type: Application
    Filed: September 15, 2021
    Publication date: December 7, 2023
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Kentaro AKIYAMA, Tatsumasa HIRATSUKA, Takahiro KAMEI, Yosuke NITTA
  • Publication number: 20230282661
    Abstract: A contact of a glass substrate with an on-chip lens is suppressed while suppressing occurrence of flare. A package includes a flattening film covering an on-chip lens formed on a light incidence side of a substrate having an element formed thereon, a transparent substrate formed on the light incidence side of the flattening film, a hollow portion formed in a region overlapping the on-chip lens when seen in a plan view with respect to at least one of between the flattening film and the transparent substrate and inside the transparent substrate, and a through-hole making the hollow portion communicate with the outside.
    Type: Application
    Filed: August 13, 2021
    Publication date: September 7, 2023
    Inventors: YOSUKE NITTA, NOBUTOSHI FUJII, SUGURU SAITO, YOICHI OOTSUKA
  • Publication number: 20220328549
    Abstract: The present disclosure relates to an imaging device, an electronic device, and a manufacturing method enabling to reduce a manufacturing cost. There are provided: a first semiconductor element including an imaging element configured to generate a pixel signal; and a second semiconductor element in which a first signal processing circuit and a second signal processing circuit that are configured to process the pixel signal are embedded by an embedded member. The first signal processing circuit has a structure including at least one more layer than the second signal processing circuit. There are further provided: a first wiring line that connects the first semiconductor element and the first signal processing circuit; and a second wiring line that connects the first signal processing circuit and the second signal processing circuit. The present disclosure can be applied to an imaging device.
    Type: Application
    Filed: August 27, 2020
    Publication date: October 13, 2022
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Yosuke NITTA, Yoshiya HAGIMOTO, Nobutoshi FUJII, Yuichi YAMAMOTO
  • Publication number: 20220181377
    Abstract: A semiconductor device (50) according to the present disclosure includes: a first substrate (20) configured to be individualized and include a first semiconductor circuit (LOG) including a first terminal (25); and a second substrate (10) configured to include a second semiconductor circuit (PIX) including a second terminal (16), in which the first terminal (25) and the second terminal (16) are joined, and the second substrate (10) includes: a first insulating layer (13) that is arranged above the second substrate (10), and a second insulating layer (14) that is arranged at least partially above the first insulating layer (13) and in which the second terminal (16) is arranged.
    Type: Application
    Filed: January 7, 2020
    Publication date: June 9, 2022
    Inventor: YOSUKE NITTA
  • Patent number: 7617047
    Abstract: A map information system is provided which includes an electronic pen which reads a dot pattern in a form where map images are shown, to output handwriting information, and a processing unit including an association module which associates the output handwriting information with one of the map images where the handwriting information is written and stores it in a storage unit, a search module which searches for the associated handwriting information and map image using information to specify the map image as a search key, a pattern assignment module which when acquiring print request information including information to specify the map images to be printed, newly assigns a dot pattern, and an output instruction module which issues an output instruction so as to cause an output unit to visually output data including the retrieved associated handwriting information and map image and the newly assigned dot pattern.
    Type: Grant
    Filed: May 25, 2006
    Date of Patent: November 10, 2009
    Assignee: Hitachi, Ltd.
    Inventors: Hiroko Sakamoto, Yosuke Nitta, Masumi Sato, Keisuke Otsuka
  • Publication number: 20070129887
    Abstract: A map information system is provided which includes an electronic pen which reads a dot pattern in a form where map images are shown, to output handwriting information, and a processing unit including an association module which associates the output handwriting information with one of the map images where the handwriting information is written and stores it in a storage unit, a search module which searches for the associated handwriting information and map image using information to specify the map image as a search key, a pattern assignment module which when acquiring print request information including information to specify the map images to be printed, newly assigns a dot pattern, and an output instruction module which issues an output instruction so as to cause an output unit to visually output data including the retrieved associated handwriting information and map image and the newly assigned dot pattern.
    Type: Application
    Filed: May 25, 2006
    Publication date: June 7, 2007
    Inventors: Hiroko Sakamoto, Yosuke Nitta, Masumi Sato, Keisuke Otsuka