Patents by Inventor Yosuke Noda
Yosuke Noda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240098901Abstract: A light-emitting module includes one or more light-emitting devices, and a wiring substrate. Each of the light-emitting devices includes light-emitting elements, and a package including a lower surface having a wiring region. The wiring substrate includes a metal portion, an electrode portion, and an insulating portion, and defines one or more first through holes. The mounting surface of the wiring substrate includes a first region where the metal portion defines an uppermost surface, a second region where the electrode portion defines an uppermost surface, and a third region where the insulating portion defines an uppermost surface. The first region and the second region are separated from each other by the third region. A boundary of each of the first through holes is defined in the first region. The wiring region of each of the light-emitting devices is bonded to the electrode portion of the wiring substrate.Type: ApplicationFiled: September 12, 2023Publication date: March 21, 2024Inventors: Shota TAKASE, Masanori UEMURA, Masakazu SAKAMOTO, Yosuke NODA
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Patent number: 11864317Abstract: A method of manufacturing a circuit substrate includes forming, in an insulating substrate and circuit patterns that are provided on a first surface and a second surface of the insulating substrate, a through-hole penetrating the insulating substrate and the circuit patterns, where the circuit patterns contain Cu as a main component. The method includes filling, in the through-hole, an electrically conductive paste that is a melting-point shift electrically conductive paste including Sn—Bi solder powder, Cu powder, and resin, and forming a protrusion obtained by causing the electrically conductive paste to protrude from the through-hole. The method further includes performing pressure treatment on the protrusion near the through-hole; and performing heat treatment on the insulating substrate whose protrusion is subjected to the pressure treatment and causing the circuit patterns and the electrically conductive paste to be electrically connected with each other.Type: GrantFiled: December 1, 2020Date of Patent: January 2, 2024Assignee: NICHIA CORPORATIONInventors: Masaaki Katsumata, Koji Taguchi, Norifumi Sasaoka, Yosuke Noda
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Publication number: 20230199964Abstract: A method for manufacturing a circuit board includes: providing a first board including a post portion, and a second board defining an opening portion extending through a base material, the base material including a circuit pattern disposed on a first surface and an adhesive member disposed on a side of a second surface; and bonding the first board and the second board using the adhesive member by pressurizing and heating the first board and the second board in a state of the post portion being inserted in the opening portion and a top surface of the post portion being exposed from the second board. In a plan view, the second board includes a base material exposed portion. In the bonding, the adhesive member melted by the pressurizing and the heating is disposed between a lateral surface of the post portion and the second board.Type: ApplicationFiled: December 19, 2022Publication date: June 22, 2023Inventors: Yosuke NODA, Masaaki KATSUMATA, Masakazu SAKAMOTO
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Publication number: 20210084763Abstract: A method of manufacturing a circuit substrate includes forming, in an insulating substrate and circuit patterns that are provided on a first surface and a second surface of the insulating substrate, a through-hole penetrating the insulating substrate and the circuit patterns, where the circuit patterns contain Cu as a main component. The method includes filling, in the through-hole, an electrically conductive paste that is a melting-point shift electrically conductive paste including Sn—Bi solder powder, Cu powder, and resin, and forming a protrusion obtained by causing the electrically conductive paste to protrude from the through-hole. The method further includes performing pressure treatment on the protrusion near the through-hole; and performing heat treatment on the insulating substrate whose protrusion is subjected to the pressure treatment and causing the circuit patterns and the electrically conductive paste to be electrically connected with each other.Type: ApplicationFiled: December 1, 2020Publication date: March 18, 2021Applicant: NICHIA CORPORATIONInventors: Masaaki KATSUMATA, Koji TAGUCHI, Norifumi SASAOKA, Yosuke NODA
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Patent number: 10887988Abstract: A method of manufacturing a circuit substrate including forming, in an insulating substrate and circuit patterns that are provided on a first surface and a second surface of the insulating substrate, a through-hole penetrating the insulating substrate and the circuit patterns, where the circuit patterns contain Cu as a main component. The method including filling, in the through-hole, an electrically conductive paste that is a melting-point shift electrically conductive paste including Sn—Bi solder powder, Cu powder, and resin, and forming a protrusion obtained by causing the electrically conductive paste to protrude from the through-hole. The method further including performing pressure treatment on the protrusion near the through-hole; and performing heat treatment on the insulating substrate whose protrusion is subjected to the pressure treatment and causing the circuit patterns and the electrically conductive paste to be electrically connected with each other.Type: GrantFiled: September 25, 2019Date of Patent: January 5, 2021Assignee: NICHIA CORPORATIONInventors: Masaaki Katsumata, Koji Taguchi, Norifumi Sasaoka, Yosuke Noda
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Publication number: 20200100360Abstract: A method of manufacturing a circuit substrate including forming, in an insulating substrate and circuit patterns that are provided on a first surface and a second surface of the insulating substrate, a through-hole penetrating the insulating substrate and the circuit patterns, where the circuit patterns contain Cu as a main component. The method including filling, in the through-hole, an electrically conductive paste that is a melting-point shift electrically conductive paste including Sn—Bi solder powder, Cu powder, and resin, and forming a protrusion obtained by causing the electrically conductive paste to protrude from the through-hole. The method further including performing pressure treatment on the protrusion near the through-hole; and performing heat treatment on the insulating substrate whose protrusion is subjected to the pressure treatment and causing the circuit patterns and the electrically conductive paste to be electrically connected with each other.Type: ApplicationFiled: September 25, 2019Publication date: March 26, 2020Applicant: NICHIA CORPORATIONInventors: Masaaki KATSUMATA, Koji TAGUCHI, Norifumi SASAOKA, Yosuke NODA
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Molded product, clothing, production process for laminate, and production process for molded product
Patent number: 9238345Abstract: A molded product obtained by molding a laminate which comprises a stretchable substrate made of a sheet-shaped synthetic resin foam and including multiple slits, and a stretchable surfacing material affixed to at least one surface of the substrate, wherein the substrate is bonded to the surfacing material in a state that at least some of the slits are kept opened.Type: GrantFiled: November 5, 2010Date of Patent: January 19, 2016Assignee: BRIDGESTONE CORPORATIONInventors: Yosuke Noda, Kazuhiro Tsuchiya, Yasuyuki Kabeya -
MOLDED PRODUCT, CLOTHING, PRODUCTION PROCESS FOR LAMINATE, AND PRODUCTION PROCESS FOR MOLDED PRODUCT
Publication number: 20120225257Abstract: A molded product obtained by molding a laminate which comprises a stretchable substrate made of a sheet-shaped synthetic resin foam and including multiple slits, and a stretchable surfacing material affixed to at least one surface of the substrate, wherein the substrate is bonded to the surfacing material in a state that at least some of the slits are kept opened.Type: ApplicationFiled: November 5, 2010Publication date: September 6, 2012Applicant: BRIDGESTONE CORPORATIONInventors: Yosuke Noda, Kazuhiro Tsuchiya, Yasuyuki Kabeya -
Patent number: 7424728Abstract: A disk drive is provided for restraining deterioration of the verticality of the optical axis of an optical pickup in relation to the surface of the disk when the side of the disk to be scanned for the recording and/or reproducing action is alternated from one side to the other side, in recording and/or reproducing data signals on both sides of the disk. The disk drive (1) includes a turn table (11) on which a disk D is rotatably supported, a pickup (12) for recording and/or reproducing data signals on both sides of the disk D rotated by the turn table (11), and a disk tray (31) for transferring the disk D between a recording and reproducing position which confronts the turn table (11) and a loading and unloading position at the outside of the disk drive (1). A turning movement mechanism is provided for turning the turn table (11) and the pickup (12) at once from a first position which confronts the one side of the disk D to a second position which confronts the other side of the disk D or vice versa.Type: GrantFiled: October 29, 2004Date of Patent: September 9, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yuji Ariyoshi, Yosuke Noda, Norikatsu Yoshida, Tatsuro Nishi
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Patent number: 7251817Abstract: The disk transfer device according to the present invention includes a disk tray for holding the disk during the disk transfer action and a tray driving mechanism for driving the tray forward and backward between a first position which is the retracted location of the tray corresponding to a turn table in a disk drive and a second position which is the loading and unloading location of the disk outwardly of the disk drive, wherein the disk tray comprises a main tray for supporting one side of the disk and a sub tray provided separately of the main tray for holding the other side of the disk, the main tray and the sub tray are joined to each other to have a pocket for accommodating partially the disk.Type: GrantFiled: December 18, 2002Date of Patent: July 31, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yuji Ariyoshi, Osamu Ataguchi, Yosuke Noda
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Patent number: 7213252Abstract: A disk transfer device including a disk tray for holding a disk during the disk transfer action and a tray driving mechanism for driving the tray forward and backward between a first position which is the retracted location of the tray corresponding to a turntable in a disk drive and a second position which is the loading and unloading location of the disk outwardly of the disk drive. The disk tray is provided with a large diameter support region and a small diameter support region which is stepped down by a predetermined distance from the large diameter support region. A plurality of claws capable of engaging with the peripheral edge of the lower side of a small size disk are provided on the outer periphery of the small diameter support region.Type: GrantFiled: December 18, 2002Date of Patent: May 1, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Osamu Ataguchi, Yuji Ariyoshi, Yosuke Noda
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Patent number: 6918130Abstract: An optical disk drive according to the present invention includes, a drive base (10); a traverse base (20) having a turntable (5), a first motor (3) for turntable drive, an optical pickup (6) and a drive mechanism thereof; and an intermediate base (80) disposed between the two bases, so as to swing vertically relative to the drive base and support the traverse base through an elastic body. A drive power transfer path switching mechanism is provided for switching the path through which drive power from a second motor 4 can be driven in forward and reverse directions to supply drive power to the loading drive mechanism and a pickup drive mechanism, so as to make it possible to perform a disk loading operation, a disk rotating operation and a pickup driving operation by 2 motors, and to make it possible to achieve both absorbing vibration from outside and suppressing vibration generated by the rotating operation of the turntable.Type: GrantFiled: September 14, 2001Date of Patent: July 12, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yuji Ariyoshi, Yosuke Noda, Michinori Hashizume, Kiyoshi Ishioka
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Publication number: 20050125812Abstract: The disk transfer device according to the present invention includes a disk tray for holding the disk during the disk transfer action and a tray driving mechanism for driving the tray forward and backward between a first position which is the retracted location of the tray corresponding to a turn table in a disk drive and a second position which is the loading and unloading location of the disk outwardly of the disk drive, wherein the disk tray comprises a main tray for supporting one side of the disk and a sub tray provided separately of the main tray for holding the other side of the disk, the main tray and the sub tray are joined to each other to have a pocket for accommodating partially the disk.Type: ApplicationFiled: December 18, 2002Publication date: June 9, 2005Inventors: Yuji Ariyoshi, Osamu Ataguchi, Yosuke Noda
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Publication number: 20050105356Abstract: The disk transfer device according to the present invention includes a disk tray for holding the disk during the disk transfer action and a tray driving mechanism for driving the tray forward and backward between a first position which is the retracted location of the tray corresponding to a turntable in a disk drive and a second position which is the loading and unloading location of the disk outwardly of the disk drive, wherein the disk tray is provided with a large diameter support region and a small diameter support region which is stepped down by a predetermined distance from the large diameter support region, wherein claws capable of engaging with the peripheral edge of the lower side of a small size disk are provided on the outer periphery of the small diameter support region, wherein when the small size disk is loaded onto the turntable, a peripheral edge retained by the claws climb over the claws, thereby, the small size disk is transferred toward the clamper, and it is pinched and held between the dType: ApplicationFiled: December 18, 2002Publication date: May 19, 2005Inventors: Osamu Ataguchi, Yuji Ariyoshi, Yosuke Noda
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Publication number: 20050097584Abstract: A disk drive is provided for restraining deterioration of verticality of the optical axis of an optical pickup in relation to the surface of the disk when the side of the disk to be scanned for the recording and/or reproducing action is alternated from one side to the other side, in recording and/or reproducing data signals on both sides of the disk.Type: ApplicationFiled: October 29, 2004Publication date: May 5, 2005Inventors: Yuji Ariyoshi, Yosuke Noda, Norikatsu Yoshida, Tatsuro Nishi
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Patent number: 6852763Abstract: A polyurethane foam compound for an ink holder, characterized in that it comprises a polyol and an isocyanate as main components, and also a crosslinking agent; an ink holder, characterized in that it is prepared by foaming, curing and crosslinking the compound; a method for securing the close contact of an ink holder, which comprises using the above described ink holder, and placing the ink holder in an ink tank for containing an ink in a manner such that the ink holder is attached to the inner wall of the ink tank.Type: GrantFiled: June 19, 2001Date of Patent: February 8, 2005Assignee: Bridgestone CorporationInventor: Yosuke Noda
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Publication number: 20040044092Abstract: A polyurethane foam compound for an ink holder, characterized in that it comprises a polyol and an isocyanate as main components, and also a crosslinking agent; an ink holder, characterized in that it is prepared by foaming, curing and crosslinking the compound; a method for securing the close contact of an ink holder, which comprises using the above described ink holder, and placing the ink holder in an ink tank for containing an ink in a manner such that the ink holder is attached to the inner wall of the ink tank.Type: ApplicationFiled: April 11, 2003Publication date: March 4, 2004Inventor: Yosuke Noda
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Patent number: 6529468Abstract: For providing an optical disk driving device that is capable of accurately performing recording and reproduction of even disks that include warpage without the provision of a tilt mechanism, a clamper is comprised of a central clamper portion for pinching and holding a disk between the clamper and a turntable, and an outer clamper portion for abutting against an outer periphery of the disk and pressurizing the same in case the disk includes any warpage to thereby correct the warpage. It is accordingly possible to restrict an angle formed between a light beam and an information surface of the disk to be within a specified value for accurately performing reproduction.Type: GrantFiled: December 14, 2000Date of Patent: March 4, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yosuke Noda, Yuji Ariyoshi, Katsuhiko Koshino, Kiyoshi Ishioka, Masanori Onishi
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Publication number: 20020163870Abstract: An optical disk drive according to the present invention comprises, a drive base (10); a traverse base (20) having a turntable (5), a first motor (3) for turntable drive, an optical pickup (6) and drive mechanism thereof; and an intermediate base (80) disposed between the two bases, swings vertically to relative to the drive base and supports the traverse base through an elastic body, and being provided with a drive power transfer path switching mechanism for switching the path through which drive power from a second motor 4 can be driven in forward and reverse to supply drive power to the loading drive mechanism and a pickup drive mechanism, so as to make possible to perform a disk loading operation, a disk rotating operation and a pickup driving operation by 2 motors, and to make possible to achieve both of absorbing vibration from outside and suppressing vibration generated by the rotating operation of the turntable.Type: ApplicationFiled: May 14, 2002Publication date: November 7, 2002Inventors: Yuji Ariyoshi, Yosuke Noda, Michinori Hashizume, Kiyoshi Ishioka
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Publication number: 20010004342Abstract: For providing a optical disk driving device that is capable of accurately performing recording and reproduction also of disks including warpage without the provision of a tilt mechanism, a clamper is comprised of a central clamper portion for pinching and holding a disk with a turntable, and an outer clamper portion for abutting against an outer periphery of the disk and pressurizing the same in case the disk includes any warpage to thereby correct the warpage, if present, through pressurizing; it is accordingly possible to restrict an angle formed between a light beam and an information surface of the disk to be within a specified value for accurately performing reproduction.Type: ApplicationFiled: December 14, 2000Publication date: June 21, 2001Inventors: Yosuke Noda, Yuji Ariyoshi, Katsuhiko Koshino, Kiyoshi Ishioka, Masanori Onishi