Patents by Inventor Yosuke Saito

Yosuke Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240290813
    Abstract: An optical detection device including a through electrode is provided. The optical detection device includes a first semiconductor layer having a photoelectric conversion region, a first surface, and a second surface that is a light entrance surface, a second semiconductor layer with a third surface and a fourth surface, a second wiring layer overlapped with the third surface, a third wiring layer overlapped with the fourth surface, a first wiring layer with one surface overlapped with the first surface and another surface overlapped with one of the second wiring layer and the third wiring layer, a first conductor that has a first width, includes a first material, and penetrates the second semiconductor layer in a thickness direction, and a second conductor that has a second width smaller than the first width, includes a second material different from the first material, and penetrates the second semiconductor layer in the thickness direction.
    Type: Application
    Filed: June 16, 2022
    Publication date: August 29, 2024
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Masaki HANEDA, Kengo KOTOO, Yoshiki SHIRASU, Kazuki SHIMOMURA, Nobutoshi FUJII, Takaaki HIRANO, Yosuke FUJII, Takashi OINOUE, Suguru SAITO, Toshiyuki ISHIMARU, Keiji OHSHIMA, Shinichi IMAI, Takuya KUROTORI, Tomohiro SUGIYAMA, Ikue MITSUHASHI, Kenichi TOKUOKA
  • Publication number: 20240292641
    Abstract: A first semiconductor element according to an embodiment of the present disclosure includes: a first electrode; a second electrode disposed to be opposed the first electrode; and an organic semiconductor layer that is provided between the first electrode and the second electrode, and including an organic semiconductor material, the organic semiconductor material having a crystal density of greater than 1.26 g/cm3 and less than 1.50 g/cm3 in powder form by X-ray structure analysis, and a molecular weight of 1200 or less, and being available for vacuum deposition film formation.
    Type: Application
    Filed: June 22, 2022
    Publication date: August 29, 2024
    Inventors: Yasuharu UJIIE, Yuki NEGISHI, Yosuke SAITO, Mari ICHIMURA
  • Patent number: 12072658
    Abstract: A sheet laminator includes a thermal fixing roller pair, a first heater, a second heater, multiple temperature detectors, and a driver. The thermal fixing roller pair includes a first thermal fixing roller and a second thermal fixing roller facing the first thermal fixing roller. The thermal fixing roller pair thermally fixes and conveys a two-ply sheet and a sheet medium nipped between two sheets of the two-ply sheet. The first heater heats the first thermal fixing roller. The second heater heats the second thermal fixing roller. The multiple temperature detectors are at different positions along an axial direction of the thermal fixing roller pair. The multiple temperature detectors detect a surface temperature of the thermal fixing roller pair. The driver drives the thermal fixing roller pair.
    Type: Grant
    Filed: June 15, 2023
    Date of Patent: August 27, 2024
    Assignee: RICOH COMPANY, LTD.
    Inventors: Shota Yoshida, Keisuke Sugiyama, Yuichiro Kato, Kazuki Shimodate, Takaya Ochiai, Naoki Takai, Yosuke Saito
  • Publication number: 20240263054
    Abstract: Embodiments provide a resin composition, an adhesive member including a polymer derived from the resin composition, and a display device including the adhesive member. The resin composition includes a (meth)acrylate polymer that is synthesized with a first monomer, a photoinitiator, a (meth)acrylate monomer, and a urethane (meth)acrylate oligomer.
    Type: Application
    Filed: November 17, 2023
    Publication date: August 8, 2024
    Applicant: Samsung Display Co., Ltd.
    Inventor: Yosuke SAITO
  • Publication number: 20240253341
    Abstract: A sheet processing system includes a sheet processing device and a lamination processing device. The sheet processing device includes a sheet separator that separates a two-ply sheet and inserts an inner sheet between the two-ply sheet to form a first enclosed two-ply sheet. The lamination processing device bonds the first enclosed two-ply sheet, and bonds a second enclosed two-ply sheet in which the inner sheet is inserted outside the sheet separator. The sheet processing system includes a relay conveyor that conveys the first enclosed two-ply sheet from the sheet separator to the lamination processing device attachable to a sheet feeder to directly feed the second enclosed two-ply sheet to the lamination processing device. The sheet processing device includes a cord holder to hold the power cord of the lamination processing device at a position where feeding and ejecting the two-ply sheet after bonding the two-ply sheet are not hindered.
    Type: Application
    Filed: January 18, 2024
    Publication date: August 1, 2024
    Applicant: Ricoh Company, Ltd.
    Inventors: Kazuki SHIMODATE, Naoki TAKAI, Yuichiro KATO, Sho ASANO, Ruki MIDORIKAWA, Yosuke SAITO
  • Publication number: 20240258736
    Abstract: An embodiment includes a main body holding pin groups and partition walls partitioning adjacent signal pins from each other, each of the signal pins has a fixing part located on a mount part side and fixed to a substrate, tip parts located on an insertion-extraction part side and serving as a free end, and a contact part provided between the fixing part and the tip parts and configured to be in electrical contact with electrodes of a device, and the adjacent tip parts are located via an opening.
    Type: Application
    Filed: January 30, 2023
    Publication date: August 1, 2024
    Inventors: Toshiyasu ITO, Yosuke TAKAI, Masaaki SAITO
  • Publication number: 20240260284
    Abstract: A photoelectric conversion device according to an embodiment of the present disclosure includes: a first electrode (11); a second electrode disposed to face the first electrode (11); a photoelectric conversion layer (13) provided between the first electrode (11) and the second electrode, the photoelectric conversion layer (13) including fullerenes or fullerene derivatives; a first electric charge block layer (12A) provided between the first electrode (11) and the photoelectric conversion layer (13), the first electric charge block layer (12A) including an organic material having an HOMO level that is deeper by 1 eV or higher and an LUMO level ranging from 3.7 eV to 4.8 eV inclusive, with respect to a work function of the first electrode (11); and a second electric charge block layer (12B) provided between the first electric charge block layer (12A) and the photoelectric conversion layer (13), the second electric charge block layer (12B) including the fullerenes or the fullerene derivatives.
    Type: Application
    Filed: February 22, 2022
    Publication date: August 1, 2024
    Inventors: YOSUKE SAITO, YUSHIRO NAKAGOME, MASATO KANNO
  • Publication number: 20240260285
    Abstract: There is provided a solid-state image sensor, a solid-state imaging device, an electronic apparatus, and a method of manufacturing a solid-state image sensor capable of improving characteristics. There is provided a solid-state image sensor including a stacked structure that includes a semiconductor substrate, a first photoelectric converter provided above the semiconductor substrate and converting light into charges, and a second photoelectric converter provided above the first photoelectric converter and converting light into charges, where the first photoelectric converter and the second photoelectric converter include a photoelectric conversion stacked structure in which a common electrode a photoelectric conversion film, and a readout electrode are stacked so that the first photoelectric converter and the second photoelectric converter are in a line-symmetrical relationship with each other with a vertical plane perpendicular to a stacking direction of the stacked structure as an axis of symmetry.
    Type: Application
    Filed: April 9, 2024
    Publication date: August 1, 2024
    Applicants: SONY GROUP CORPORATION, SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Hideaki TOGASHI, Iwao YAGI, Masahiro JOEI, Fumihiko KOGA, Kenichi MURATA, Shintarou HIRATA, Yosuke SAITO, Akira FURUKAWA
  • Publication number: 20240246329
    Abstract: A sheet separation device for separating two sheets of a two-ply sheet, in which the two sheets are overlapped and a part of the two sheets are joined, and inserting at least one sheet medium between the two sheets includes an upper surface, an ejection tray, and a conveyor. A lamination fixing device that laminates the two-ply sheet including the at least one sheet medium inserted between the two sheets is to be mounted on the upper surface. The ejection tray is disposed on the upper surface. The two-ply sheet laminated and ejected from an ejection port of the lamination fixing device is to be stacked on the ejection tray. The conveyor is coupled to the lamination fixing device to convey the two-ply sheet including the at least one sheet medium from the sheet separation device to the lamination fixing device.
    Type: Application
    Filed: January 22, 2024
    Publication date: July 25, 2024
    Applicant: Ricoh Company, Ltd.
    Inventors: Naoki TAKAI, Ruki MIDORIKAWA, Kazuki SHIMODATE, Yuichiro KATO, Sho ASANO, Yosuke SAITO
  • Publication number: 20240240054
    Abstract: Embodiments provide a photocurable resin composition that includes at least one (meth)acrylate oligomer including a (meth)acrylic group at a terminus and an aliphatic ring group at a side chain, at least one photoinitiator, at least one (meth)acrylate monomer, and at least one urethane (meth)acrylate oligomer. Embodiments also provide a display device which includes an adhesive member including a polymer derived from the photocurable resin composition.
    Type: Application
    Filed: November 2, 2023
    Publication date: July 18, 2024
    Applicant: Samsung Display Co., Ltd.
    Inventor: Yosuke SAITO
  • Publication number: 20240239092
    Abstract: A lamination processing system includes a sheet separation device, a lamination fixing device, and a conveyor. The sheet separation device separates a two-ply sheet to insert a sheet medium between two sheets of the two-ply sheet to form an enclosed two-ply sheet. The lamination fixing device includes an inlet port and a heater. The conveyor conveys the enclosed two-ply sheet from the sheet separation device to the lamination fixing device in a conveyance direction. The conveyor includes a conveyance passage and a guide. The conveyance passage guides the enclosed two-ply sheet from the sheet separation device toward the lamination fixing device. The guide guides the enclosed two-ply sheet to the inlet port. The guide forms a space accommodatable a deflected part of the enclosed two-ply sheet formed by a difference in a conveyance speed of the enclosed two-ply sheet between the sheet separation device and the lamination fixing device.
    Type: Application
    Filed: December 8, 2023
    Publication date: July 18, 2024
    Applicant: Ricoh Company, Ltd.
    Inventors: Yosuke SAITO, Yuichiro KATO, Sho ASANO, Ruki MIDORIKAWA, Naoki TAKAI, Kazuki SHIMODATE
  • Publication number: 20240237373
    Abstract: A solid-state imaging element according to an embodiment of the present disclosure includes: a photoelectric conversion layer including first semiconductor nanoparticles; and a buffer layer including second semiconductor nanoparticles. A p-n junction surface is formed at an interface between the photoelectric conversion layer and the buffer layer. A product of a carrier concentration and a film thickness of the buffer layer is larger than a product of a carrier concentration of the photoelectric conversion layer and a diffusion length of a minority carrier, and a thickness of a depletion region formed in the photoelectric conversion layer is maximized.
    Type: Application
    Filed: April 27, 2022
    Publication date: July 11, 2024
    Inventors: Michinori SHIOMI, Syuuiti TAKIZAWA, Yuta OKABE, Osamu ENOKI, Yosuke SAITO
  • Publication number: 20240218105
    Abstract: A resin composition includes: at least one (meth)acrylate oligomer having a glass transition temperature of about 110° ° C. to about 140° C.; at least one (meth)acrylate monomer including a (meth)acryloyl group; at least one urethane (meth)acrylate oligomer, and at least one photoinitiator. The resin composition has a shear viscosity of about 8 mPa·s to about 50 mPa·s, which is measured by a JIS Z8803 method at a temperature of about 25° C.
    Type: Application
    Filed: November 6, 2023
    Publication date: July 4, 2024
    Inventor: Yosuke SAITO
  • Patent number: 12027542
    Abstract: A solid-state imaging element with pixel transistors and wires capable of efficiently outputting and transferring a pixel signal from a stacked photoelectric conversion film while suppressing an increase in manufacturing cost, and a manufacturing method thereof are provided.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: July 2, 2024
    Assignee: SONY GROUP CORPORATION
    Inventors: Masahiro Joei, Kenichi Murata, Fumihiko Koga, Iwao Yagi, Shintarou Hirata, Hideaki Togashi, Yosuke Saito
  • Publication number: 20240190121
    Abstract: A laminating system sandwiches a sheet medium in a two-ply sheet in which two sheets are overlapped and partially joined together and applies heat and pressure to bond the two-ply sheet. The laminating system includes a sheet separating device, a laminate-fixing device, and a conveyor. The sheet separating device separates the two sheets of the two-ply sheet and sandwiches the sheet medium between the two sheets. The laminate-fixing device heats and presses the two-ply sheet sandwiching the sheet medium. The conveyor conveys the two-ply sheet sandwiching the sheet medium from the sheet separating device to the laminate-fixing device. The laminate-fixing device is disposed above the sheet separating device.
    Type: Application
    Filed: December 4, 2023
    Publication date: June 13, 2024
    Applicant: Ricoh Company, Ltd.
    Inventors: Ruki MIDORIKAWA, Kazuki SHIMODATE, Yuichiro KATO, Naoki TAKAI, Sho ASANO, Yosuke SAITO
  • Publication number: 20240164122
    Abstract: To provide a photoelectric conversion element that can improve image quality. Provided is a photoelectric conversion element including at least a first electrode, a work function control layer, a photoelectric conversion layer, an oxide semiconductor layer, and a second electrode in this order, and further including a third electrode, in which the third electrode is provided apart from the second electrode and is provided facing the photoelectric conversion layer via an insulating layer, and the work function control layer contains a larger amount of oxygen than an amount of oxygen satisfying a stoichiometric composition.
    Type: Application
    Filed: August 21, 2023
    Publication date: May 16, 2024
    Inventors: SHINTAROU HIRATA, MASAHIRO JOEI, KENICHI MURATA, MASASHI BANDO, YOSUKE SAITO, RYOSUKE SUZUKI
  • Patent number: 11985837
    Abstract: To provide a photoelectric conversion element capable of further improving performance in a photoelectric conversion element using an organic semiconductor material. The photoelectric conversion element includes a first electrode and a second electrode arranged to face each other, and a photoelectric conversion layer 17 provided between the first electrode and the second electrode, in which the photoelectric conversion layer 17 includes a first organic semiconductor material and a second organic semiconductor material, and at least one of the first organic semiconductor material or the second organic semiconductor material is an organic molecule having a HOMO volume fraction of 0.15 or less or a LUMO volume fraction of 0.15 or less.
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: May 14, 2024
    Assignees: Sony Corporation, Sony Semiconductor Solutions Corporation
    Inventors: Shinnosuke Hattori, Hajime Kobayashi, Sae Miyaji, Masato Kanno, Miki Kimijima, Yuta Hasegawa, Toshio Nishi, Takashi Kawashima, Yosuke Saito, Yuta Inaba
  • Publication number: 20240145517
    Abstract: Provided is a solid-state image capturing element including a semiconductor substrate and first and second photoelectric conversion parts configured to convert light into electric charge. The first and the second photoelectric conversion parts each have a laminated structure including an upper electrode, a lower electrode, a photoelectric conversion film sandwiched between the upper electrode and the lower electrode, and an accumulation electrode facing the upper electrode through the photoelectric conversion film and an insulating film.
    Type: Application
    Filed: December 19, 2023
    Publication date: May 2, 2024
    Applicants: SONY GROUP CORPORATION, SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Kenichi MURATA, Masahiro JOEI, Fumihiko KOGA, Iwao YAGI, Shintarou HIRATA, Hideaki TOGASHI, Yosuke SAITO, Shingo TAKAHASHI
  • Patent number: 11974444
    Abstract: There is provided a solid-state image sensor, a solid-state imaging device, an electronic apparatus, and a method of manufacturing a solid-state image sensor capable of improving characteristics. There is provided a solid-state image sensor including a stacked structure that includes a semiconductor substrate, a first photoelectric converter provided above the semiconductor substrate and converting light into charges, and a second photoelectric converter provided above the first photoelectric converter and converting light into charges, where the first photoelectric converter and the second photoelectric converter include a photoelectric conversion stacked structure in which a common electrode, a photoelectric conversion film, and a readout electrode are stacked so that the first photoelectric converter and the second photoelectric converter are in a line-symmetrical relationship with each other with a vertical plane perpendicular to a stacking direction of the stacked structure as an axis of symmetry.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: April 30, 2024
    Assignees: SONY CORPORATION, SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Hideaki Togashi, Iwao Yagi, Masahiro Joei, Fumihiko Koga, Kenichi Murata, Shintarou Hirata, Yosuke Saito, Akira Furukawa
  • Publication number: 20240128747
    Abstract: A backup power supply device includes: a storage battery charged with power from an external power supply; charge switches for charging the storage batter; discharge switches that are made from a field-effect transistor and that discharge the storage battery to a load device; a control unit for controlling the charge switches and the discharge switches; and a discharge suppression section connected in series to the discharge switches. The discharge suppression section suppresses leakage of current from the storage battery only when the control unit charges the storage battery, and the battery voltage exceeds an input voltage and the difference voltage between the battery voltage and the input voltage is less than a prescribed value.
    Type: Application
    Filed: February 7, 2022
    Publication date: April 18, 2024
    Inventors: Kenji KITAMURA, Shun MOCHIZUKI, Yosuke SAITO