Patents by Inventor Yosuke Sakurai

Yosuke Sakurai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device structural body and electronic device
    Publication number: 20050029666
    Abstract: A semiconductor device, in which a solder layer bonding chip parts and wiring members are enclosed with the resin layer, and the solder layer is comprised of a compound body in which metal powder is distributed in the matrix metal, is disclosed. When a semiconductor device in which the chip parts are installed in the wiring member with the solders, the soldering part is sealed with the resin is mounted secondly on the external wiring member, the outflow of the solders and the short circuit due to the outflow, the disconnections, and the displacement of the chip parts can be prevented.
    Type: Application
    Filed: August 27, 2002
    Publication date: February 10, 2005
    Inventors: Yasutoshi Kurihara, Yoshimasa Takahashi, Tsuneo Endoh, Mikio Negishi, Masashi Yamaura, Hirokazu Nakajima, Yosuke Sakurai, Hironori Kodama