Patents by Inventor Yosuke Takubo
Yosuke Takubo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230300515Abstract: Provided is to achieve high call quality and improve wearability. A wireless earphone 1 includes a driver unit (50), a first microphone (80), a second microphone (90), and a housing (10) that accommodates the driver unit (50), the first microphone (80), and the second microphone (90). The housing (10) includes a first accommodating portion (13) that accommodates the first microphone (80), a second accommodating portion (14) that accommodates the second microphone (90), and a main body (11) that is connected to each of the first accommodating portion (13) and the second accommodating portion (14). The first accommodating portion (13) is projectingly provided from the main body (11). The second accommodating portion (14) is projectingly provided from the main body (11) in a direction different from a projecting direction of the first accommodating portion (13).Type: ApplicationFiled: May 19, 2021Publication date: September 21, 2023Inventor: Yosuke TAKUBO
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Publication number: 20230167359Abstract: The silyl phosphine compound of the present invention is represented by the formula (1) and has an arsenic content of not more than 1 ppm. The process for producing a silyl phosphine compound of the present invention is a process comprising mixing a basic compound, a silylating agent and phosphine to obtain a solution containing a silyl phosphine compound, removing a solvent from the solution to obtain a concentrated solution of a silyl phosphine compound, and distilling the concentrated solution, wherein an arsenic content in the phosphine is adjusted to not more than 1 ppm by volume in terms of arsine. The process for producing InP quantum dots of the present invention uses, as a phosphorus source, a silyl phosphine compound represented by the formula (1) and having an arsenic content of not more than 1 ppm by mass. (For definition of R, see the specification.Type: ApplicationFiled: January 10, 2023Publication date: June 1, 2023Applicant: Nippon Chemical Industrial Co., Ltd.Inventors: Yosuke Takubo, Ken Tamura, Kazuhiro Nakatsui
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Patent number: 11578266Abstract: The silyl phosphine compound of the present invention is represented by the formula (1) and has an arsenic content of not more than 1 ppm. The process for producing a silyl phosphine compound of the present invention is a process comprising mixing a basic compound, a silylating agent and phosphine to obtain a solution containing a silyl phosphine compound, removing a solvent from the solution to obtain a concentrated solution of a silyl phosphine compound, and distilling the concentrated solution, wherein an arsenic content in the phosphine is adjusted to not more than 1 ppm by volume in terms of arsine. The process for producing InP quantum dots of the present invention uses, as a phosphorus source, a silyl phosphine compound represented by the formula (1) and having an arsenic content of not more than 1 ppm by mass. (For definition of R, see the specification.Type: GrantFiled: March 20, 2019Date of Patent: February 14, 2023Assignee: NIPPON CHEMICAL INDUSTRIAL CO., LTD.Inventors: Yosuke Takubo, Ken Tamura, Kazuhiro Nakatsui
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Patent number: 11512103Abstract: The silyl phosphine compound is represented by the following general formula (1). A content of a compound represented by the following general formula (2) is not more than 0.3 mol %. In the general formula (1), each R is independently an alkyl group having not less than 1 and not more than 5 carbon atoms or an aryl group having not less than 6 and not more than 10 carbon atoms. In the general formula (2), R is the same as in the general formula (1).Type: GrantFiled: January 28, 2021Date of Patent: November 29, 2022Assignee: NIPPON CHEMICAL INDUSTRIAL CO., LTD.Inventors: Yosuke Takubo, Ken Tamura
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Publication number: 20220109922Abstract: An earpiece whose inner cylinder is not crushed when the earpiece is inserted into an ear canal of a user is provided. An earpiece according to the present invention includes an inner cylinder 1 that includes one open end and the other open end and is attached to a sound conduit C of an earphone E, and an outer cylinder 2 connected to the one end of the inner cylinder and extending in an umbrella shape toward the other end of the inner cylinder so as to cover an outer surface 1b of the inner cylinder. The inner cylinder includes a fitting part 11 into which a tip of the sound conduit is fitted, and a sound guide part 12 configured to guide sound wave from the sound conduit to an ear canal.Type: ApplicationFiled: January 29, 2020Publication date: April 7, 2022Inventor: Yosuke TAKUBO
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Publication number: 20210171551Abstract: The silyl phosphine compound is represented by the following general formula (1). A content of a compound represented by the following general formula (2) is not more than 0.3 mol %. In the general formula (1), each R is independently an alkyl group having not less than 1 and not more than 5 carbon atoms or an aryl group having not less than 6 and not more than 10 carbon atoms. In the general formula (2), R is the same as in the general formula (1).Type: ApplicationFiled: January 28, 2021Publication date: June 10, 2021Applicant: Nippon Chemical Industrial Co., Ltd.Inventors: Yosuke Takubo, Ken Tamura
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Patent number: 10934316Abstract: The process for producing a silyl phosphine compound of the present invention comprises a first step of mixing a solvent having a relative dielectric constant of not more than 4, a basic compound, a silylating agent and phosphine to obtain a solution containing a silyl phosphine compound, a second step of removing the solvent from the solution containing a silyl phosphine compound to obtain a concentrated solution of a silyl phosphine compound, and a third step of distilling the concentrated solution of a silyl phosphine compound to obtain the silyl phosphine compound. The silyl phosphine compound of the present invention is a silyl phosphine compound represented by the following general formula (1), wherein a content of a compound represented by the following general formula (2) is not more than 0.5 mol %. (For explanatory notes of the formulas, see the specification.Type: GrantFiled: September 19, 2017Date of Patent: March 2, 2021Assignee: NIPPON CHEMICAL INDUSTRIAL CO., LTD.Inventors: Yosuke Takubo, Ken Tamura
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Publication number: 20210002548Abstract: The silyl phosphine compound of the present invention is represented by the formula (1) and has an arsenic content of not more than 1 ppm. The process for producing a silyl phosphine compound of the present invention is a process comprising mixing a basic compound, a silylating agent and phosphine to obtain a solution containing a silyl phosphine compound, removing a solvent from the solution to obtain a concentrated solution of a silyl phosphine compound, and distilling the concentrated solution, wherein an arsenic content in the phosphine is adjusted to not more than 1 ppm by volume in terms of arsine. The process for producing InP quantum dots of the present invention uses, as a phosphorus source, a silyl phosphine compound represented by the formula (1) and having an arsenic content of not more than 1 ppm by mass. (For definition of R, see the specification.Type: ApplicationFiled: March 20, 2019Publication date: January 7, 2021Applicant: Nippon Chemical Industrial Co., Ltd.Inventors: Yosuke Takubo, Ken Tamura, Kazuhiro Nakatsui
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Publication number: 20190263845Abstract: The process for producing a silyl phosphine compound of the present invention comprises a first step of mixing a solvent having a relative dielectric constant of not more than 4, a basic compound, a silylating agent and phosphine to obtain a solution containing a silyl phosphine compound, a second step of removing the solvent from the solution containing a silyl phosphine compound to obtain a concentrated solution of a silyl phosphine compound, and a third step of distilling the concentrated solution of a silyl phosphine compound to obtain the silyl phosphine compound. The silyl phosphine compound of the present invention is a silyl phosphine compound represented by the following general formula (1), wherein a content of a compound represented by the following general formula (2) is not more than 0.5 mol %. (For explanatory notes of the formulas, see the specification.Type: ApplicationFiled: September 19, 2017Publication date: August 29, 2019Applicant: Nippon Chemical Industrial Co., Ltd.Inventors: Yosuke Takubo, Ken Tamura
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Patent number: D872706Type: GrantFiled: July 18, 2018Date of Patent: January 14, 2020Assignee: AUDIO-TECHNICA CORPORATIONInventors: Yosuke Takubo, Shohei Araki
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Patent number: D873237Type: GrantFiled: January 18, 2018Date of Patent: January 21, 2020Assignee: Audio-Technica CorporationInventors: Hiromichi Ozawa, Yosuke Takubo, Shohei Araki
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Patent number: D876429Type: GrantFiled: June 19, 2018Date of Patent: February 25, 2020Assignee: AUDIO-TECHNICA CORPORATIONInventors: Aya Mashimo, Yosuke Takubo, Daichi Yamakawa, Shohei Araki
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Patent number: D893458Type: GrantFiled: February 14, 2019Date of Patent: August 18, 2020Assignee: Audio-Technica CorporationInventor: Yosuke Takubo
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Patent number: D905016Type: GrantFiled: October 12, 2018Date of Patent: December 15, 2020Assignee: AUDIO-TECHNICA CORPORATIONInventors: Yosuke Takubo, Yutaro Kumagai
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Patent number: D924850Type: GrantFiled: October 24, 2019Date of Patent: July 13, 2021Assignee: AUDIO-TECHNICA CORPORATIONInventors: Yosuke Takubo, Takashi Nara, Jin Kuramoto
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Patent number: D934840Type: GrantFiled: October 24, 2019Date of Patent: November 2, 2021Assignee: Audio-Technica CorporationInventors: Yosuke Takubo, Takashi Nara, Jin Kuramoto
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Patent number: D934841Type: GrantFiled: October 24, 2019Date of Patent: November 2, 2021Assignee: AUDIO-TECHNICA CORPORATIONInventors: Yosuke Takubo, Takashi Nara, Jin Kuramoto
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Patent number: D1002585Type: GrantFiled: November 23, 2021Date of Patent: October 24, 2023Assignee: Audio-Technica CorporationInventors: Yosuke Takubo, Hiroaki Kokubun, Yutaro Kumagai