Abstract: A method for curing an adhesive composition includes: arranging an adhesive composition that transmits laser light of a first wavelength in contact with a surface of a first adherend that contains, at least at its surface, a first light-to-heat conversion material that generates heat by absorbing laser light of the first wavelength; and curing the adhesive composition by irradiating the adhesive composition and the first adherend with laser light of the first wavelength. In a method for manufacturing a bonded structure, a first bonded structure is manufactured by bonding the adhesive composition to the first adherend by using the method for curing an adhesive composition.

Abstract: With a view to simultaneously achieving reduction in sputter adhesion to an electronic article and improvement in durability required for maintenance of a film, the electronic article (10) has a film (3) which is formed on the surface of an underlayer member (1) and which is composed of a calcined and cured product of a film solution of a binder resin comprising a fluorine-based resin and a ceramic filler, wherein the fluorine-based resin is distributed increasingly more in the film (3) toward the surface on the side opposite to the underlayer member (1).

Abstract: A method for curing an adhesive composition includes: arranging an adhesive composition that transmits laser light of a first wavelength in contact with a surface of a first adherend that contains, at least at its surface, a first light-to-heat conversion material that generates heat by absorbing laser light of the first wavelength; and curing the adhesive composition by irradiating the adhesive composition and the first adherend with laser light of the first wavelength. In a method for manufacturing a bonded structure, a first bonded structure is manufactured by bonding the adhesive composition to the first adherend by using the method for curing an adhesive composition.

Abstract: The present invention provides a method with which curing can be carried out in a short time without a heat load on an adherend and a cured product having stable quality can be obtained. The resin composition curing method in accordance with the present invention includes the step (a) of directly and/or indirectly irradiating, with laser light, a resin composition (A) which contains (i) an epoxy resin, (ii) an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core, (iii) a filler, and (iv) a color material.

Abstract: The present invention provides a resin composition which can be cured in a short time without a heat load on an adherend and with which a cured product having stable quality can be obtained. The resin composition in accordance with the present invention contains (i) a bisphenol A epoxy resin, (ii) an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core, (iii) a filler, and (iv) a color material.

Abstract: The present invention provides a method with which curing can be carried out in a short time without a heat load on an adherend and a cured product having stable quality can be obtained. The resin composition curing method in accordance with the present invention includes the step (a) of directly and/or indirectly irradiating, with laser light, a resin composition (A) which contains (i) an epoxy resin, (ii) an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core, (iii) a filler, and (iv) a color material.

Abstract: The present invention provides a resin composition which can be cured in a short time without a heat load on an adherend and with which a cured product having stable quality can be obtained. The resin composition in accordance with the present invention contains (i) a bisphenol A epoxy resin, (ii) an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core, (iii) a filler, and (iv) a color material.

Abstract: The present invention provides a resin composition for producing an optical component in which resin composition respective of a (meth)acrylic equivalent and a content of a repeating unit represented by the general formula (1) are adjusted to given ranges, an optical component which is made of the resin composition, and an image display device. The resin composition of the present invention for producing an optical component is arranged such that the resin composition contains at least one kind of compound whose molecule contains the repeating unit represented by the general formula (1) and at least one (meth)acryloyl group and the (meth)acrylic equivalent and the content of the repeating unit meet the given ranges.

Abstract: The present invention provides a resin composition for producing an optical component in which resin composition respective of a (meth)acrylic equivalent and a content of a repeating unit represented by the general formula (1) are adjusted to given ranges, an optical component which is made of the resin composition, and an image display device. The resin composition of the present invention for producing an optical component is arranged such that the resin composition contains at least one kind of compound whose molecule contains the repeating unit represented by the general formula (1) and at least one (meth)acryloyl group and the (meth)acrylic equivalent and the content of the repeating unit meet the given ranges.