Abstract: A ceramic electronic component includes a ceramic body and first and second outer electrodes. The first and second outer electrodes respectively include first and second resin-containing electrode layers and first and second Ni plating layers. The first and second Ni plating layers are respectively provided on the first and second resin-containing electrode layers. When a thickness of the first or second Ni plating layer is t1 and a distance by which a portion of the first or second Ni plating layer that is in contact with the second principal surface extends in the length direction is t2, t2/t1 is less than about 1.

Abstract: A ceramic electronic component includes a ceramic body and first and second outer electrodes. The first and second outer electrodes respectively include first and second resin-containing electrode layers and first and second Ni plating layers. The first and second Ni plating layers are respectively provided on the first and second resin-containing electrode layers. When a thickness of the first or second Ni plating layer is t1 and a distance by which a portion of the first or second Ni plating layer that is in contact with the second principal surface extends in the length direction is t2, t2/t1 is less than about 1.

Abstract: A message control program of an embodiment causes a monitoring apparatus to further function as a plurality of message control unit configured to individually controlling a communication method of a message transmitted from each internal application unit. Each message control unit receives a message containing a message type and service name from the internal application unit. Each message control unit specifies communication method identification information from a file based on the message type and service name in the received message. Each message control unit changes the communication method of the received message based on the specified communication method identification information, and sends the message to a common bus.

Abstract: A conductive resin paste that includes a conductive component and a resin component, where the conductive component includes at least Ag and Cu, and the proportion of the Ag to the total amount of the Ag and Cu included in the conductive component falls within the range of 11.6 mass % to 28.8 mass %. As the conductive component, an Ag-coated Cu powder is used which has a Cu powder with a surface at least partially coated with Ag.

Abstract: A report creation system according to one embodiment creates a report indicative of a condition of a cooperative service in which a plurality of services are made to cooperate, the plurality of services being provided by a plurality of service providing apparatuses including at least one service providing apparatus in another company. The report creation creates the report, based on the first log information and the error occurrence information collected by each of the information collection apparatuses, and second log information of each of the services collected from each of the service providing apparatuses.

Abstract: A ceramic electronic component includes a ceramic body and first and second outer electrodes. The first and second outer electrodes respectively include first and second resin-containing electrode layers and first and second Ni plating layers. The first and second Ni plating layers are respectively provided on the first and second resin-containing electrode layers. When a thickness of the first or second Ni plating layer is t1 and a distance by which a portion of the first or second Ni plating layer that is in contact with the second principal surface extends in the length direction is t2, t2/t1 is less than about 1.

Abstract: A ceramic electronic component includes a ceramic body and first and second outer electrodes. The first and second outer electrodes are located on the ceramic body. The first outer electrode includes a first resin electrode layer, and the second outer electrode includes a second resin electrode layer. Each of the resin electrode layers includes a conductive material and a resin. The moisture content of the resin electrode layers is about 0.005 mass % or less.

Abstract: A security adapter apparatus according to embodiments includes a reception unit, a first manipulation unit, a delivery unit, and a transmission unit. The reception unit receives a request message that specifies a service name from the external application unit. The first manipulation unit searches the first storage unit based on the service name in the received request massage and manipulates the request message so that the request message contains an application name resulting from the search as a destination. The delivery unit delivers the manipulated request message to a first common bus. The transmission unit transmits a transmission message to the external application unit when the transmission message is received from one of the internal application units via a bus connection adaptor and the first common bus.

Abstract: A message control program of an embodiment causes a monitoring apparatus to further function as a plurality of message control unit configured to individually controlling a communication method of a message transmitted from each internal application unit. Each message control unit receives a message containing a message type and service name from the internal application unit. Each message control unit specifies communication method identification information from a file based on the message type and service name in the received message. Each message control unit changes the communication method of the received message based on the specified communication method identification information, and sends the message to a common bus.

Abstract: A bus connection apparatus according to an embodiment includes a bus connection unit configured to connect an internal application unit and a common bus. The bus connection unit receives, from an external application unit via the common bus, a request message which designates a service name and a destination. The bus connection unit specifies element names from a file based on the service name in the request message. The bus connection unit processes the request message by calling and executing respective element programs based on the element names. The bus connection unit extracts data from the request message processed by a first processing unit, and sends the data to an internal application unit corresponding to the service name or destination in the request message.