Abstract: An electronic component mounting apparatus in which an electronic component may be checked to provide highly accurate and efficient electronic component mounting. The apparatus includes a camera unit fixed on a head support and images an electronic component absorbed or to be absorbed onto a nozzle. The camera unit contains a camera module including a camera obtaining an image, a first lighting section disposed adjacently on a side of the camera closer to the nozzle and emitting light toward an imaging region of the camera, a second lighting section disposed adjacently on a side of the camera farther from the nozzle and emitting light toward the imaging region of the camera, and a baffle; and a bracket fixed on the head support and supporting the camera, the first lighting section, the second lighting section and the baffle.