Patents by Inventor You-Ai LI

You-Ai LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cable connector assembly with multi-layered circuit board
    Patent number: 9774111
    Abstract: A cable assembly comprises a male connector plug, a circuit board and a cable. The circuit board has a first surface conductive layer and a second surface conductive layer that each include a plurality of front side pads and a plurality of rear side pads. The front side pads comprise four front side power pads soldered to four power terminals. The rear side pads comprise one rear side power pad and a soldering area of the rear side power pad is larger than a soldering area of the front side power pad. The circuit board is further at least provided with a first middle conductive layer positioned between the first surface conductive layer and the second surface conductive layer and a plurality of vias extending between layers.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: September 26, 2017
    Assignee: Molex, LLC
    Inventors: Sheng Liang, Guang-Rong Xiao, You-Ai Li, Gang Nie
  • CABLE ASSEMBLY
    Publication number: 20160365673
    Abstract: A cable assembly comprises a male connector plug, a circuit board and a cable. The circuit board has a first surface conductive layer and a second surface conductive layer that each include a plurality of front side pads and a plurality of rear side pads. The front side pads comprise four front side power pads soldered to four power terminals. The rear side pads comprise one rear side power pad and a soldering area of the rear side power pad is larger than a soldering area of the front side power pad. The circuit board is further at least provided with a first middle conductive layer positioned between the first surface conductive layer and the second surface conductive layer and a plurality of vias extending between layers.
    Type: Application
    Filed: June 7, 2016
    Publication date: December 15, 2016
    Applicant: Molex, LLC
    Inventors: Sheng LIANG, Guang-Rong XIAO, You-Ai LI, Gang NIE