Patents by Inventor You Chang Tseng

You Chang Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame and the method to fabricate thereof
    Patent number: 10256118
    Abstract: A method to form an electrical component, the method comprising: providing a first lead and a second lead; forming a first conductive pillar and a second conductive pillar on a first portion of the top surface of the first lead and a first portion of the top surface of the second lead, respectively, wherein a second portion of the top surface of the first lead, a second portion of the top surface of the second lead, the first conductive pillar, and the second conductive pillar form a 3D space, wherein at least one device is disposed in said 3D space and electrically connected to the at least one device to the first conductive pillar and the second conductive pillar.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: April 9, 2019
    Assignee: CYNTEC CO., LTD.
    Inventors: Chia Pei Chou, Lang-Yi Chiang, Jih-Hsu Yeh, You Chang Tseng
  • Lead Frame and the Method to Fabricate Thereof
    Publication number: 20180269073
    Abstract: A method to form an electrical component, the method comprising: providing a first lead and a second lead; forming a first conductive pillar and a second conductive pillar on a first portion of the top surface of the first lead and a first portion of the top surface of the second lead, respectively, wherein a second portion of the top surface of the first lead, a second portion of the top surface of the second lead, the first conductive pillar, and the second conductive pillar form a 3D space, wherein at least one device is disposed in said 3D space and electrically connected to the at least one device to the first conductive pillar and the second conductive pillar.
    Type: Application
    Filed: May 7, 2018
    Publication date: September 20, 2018
    Inventors: Chia Pei Chou, Lang-Yi Chiang, Jih-Hsu Yeh, You Chang Tseng
  • Leadframe and the method to fabricate thereof
    Patent number: 9991136
    Abstract: The present invention discloses a leadframe in which two conductive pillars with a high aspect ratio and the corresponding two leads of the leadframe form a 3D space for accommodating at least one device. A first lead and a second lead are spaced apart from each other. A first conductive pillar is formed on the first lead by disposing a first via on the first lead, wherein at least one first conductive material is filled inside the first via to form the first conductive pillar. A second conductive pillar is formed on the second lead by disposing a second via on the second lead, wherein at least one second conductive material is filled inside the second via to form the second conductive pillar. The first lead, the second lead, the first conductive pillar, and the second conductive pillar form a 3D space for accommodating at least one device, wherein the at least one device is electrically connected to the first conductive pillar and the second conductive pillar.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: June 5, 2018
    Assignee: CYNTEC CO., LTD.
    Inventors: Chia Pei Chou, Lang-Yi Chiang, Jih-Hsu Yeh, You Chang Tseng
  • LEADFRAME AND THE METHOD TO FABRICATE THEREOF
    Publication number: 20170323799
    Abstract: The present invention discloses a leadframe in which two conductive pillars with a high aspect ratio and the corresponding two leads of the leadframe form a 3D space for accommodating at least one device. A first lead and a second lead are spaced apart from each other. A first conductive pillar is formed on the first lead by disposing a first via on the first lead, wherein at least one first conductive material is filled inside the first via to form the first conductive pillar. A second conductive pillar is formed on the second lead by disposing a second via on the second lead, wherein at least one second conductive material is filled inside the second via to form the second conductive pillar. The first lead, the second lead, the first conductive pillar, and the second conductive pillar form a 3D space for accommodating at least one device, wherein the at least one device is electrically connected to the first conductive pillar and the second conductive pillar.
    Type: Application
    Filed: May 10, 2017
    Publication date: November 9, 2017
    Inventors: CHIA PEI CHOU, LANG-YI CHIANG, JIH-HSU YEH, You Chang Tseng
  • Leadframe and the method to fabricate thereof
    Patent number: 9691633
    Abstract: The present invention discloses a leadframe in which two conductive pillars with high aspect ratio and the corresponding two leads of the leadframe forms a 3D space for accommodating at least one device. A first lead and a second lead are spaced apart from each other. A first conductive pillar is formed on the first lead by disposing a first via on the first lead, wherein at least one first conductive material is filled inside the first via to form the first conductive pillar. A second conductive pillar is formed on the second lead by disposing a second via on the second lead, wherein at least one second conductive material is filled inside the second via to form the second conductive pillar. The first lead, the second lead, the first conductive pillar, and the second conductive pillar form a 3D space for accommodating at least one device, wherein the at least one device is electrically connected to the first conductive pillar and the second conductive pillar.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: June 27, 2017
    Assignee: CYNTEC CO., LTD.
    Inventors: Chia Pei Chou, Lang-Yi Chiang, Jih-Hsu Yeh, You Chang Tseng
  • LEADFRAME AND THE METHOD TO FABRICATE THEREOF
    Publication number: 20150027770
    Abstract: The present invention discloses a leadframe in which two conductive pillars with high aspect ratio and the corresponding two leads of the leadframe forms a 3D space for accommodating at least one device. A first lead and a second lead are spaced apart from each other. A first conductive pillar is formed on the first lead by disposing a first via on the first lead, wherein at least one first conductive material is filled inside the first via to form the first conductive pillar. A second conductive pillar is formed on the second lead by disposing a second via on the second lead, wherein at least one second conductive material is filled inside the second via to form the second conductive pillar. The first lead, the second lead, the first conductive pillar, and the second conductive pillar form a 3D space for accommodating at least one device, wherein the at least one device is electrically connected to the first conductive pillar and the second conductive pillar.
    Type: Application
    Filed: July 22, 2014
    Publication date: January 29, 2015
    Inventors: CHIA PEI CHOU, LANG-YI CHIANG, JIH-HSU YEH, You Chang Tseng