Patents by Inventor You-Cheng LIN

You-Cheng LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250056851
    Abstract: A semiconductor device includes a first channel region, a second channel region, and a first insulating fin, the first insulating fin being interposed between the first channel region and the second channel region. The first insulating fin includes a lower portion and an upper portion. The lower portion includes a fill material. The upper portion includes a first dielectric layer on the lower portion, the first dielectric layer being a first dielectric material, a first capping layer on the first dielectric layer, the first capping layer being a second dielectric material, the second dielectric material being different than the first dielectric material, and a second dielectric layer on the first capping layer, the second dielectric layer being the first dielectric material.
    Type: Application
    Filed: October 28, 2024
    Publication date: February 13, 2025
    Inventors: Jen-Hong Chang, Yi-Hsiu Liu, You-Ting Lin, Chih-Chung Chang, Kuo-Yi Chao, Jiun-Ming Kuo, Yuan-Ching Peng, Sung-En Lin, Chia-Cheng Chao, Chung-Ting Ko
  • Publication number: 20240006587
    Abstract: The present invention discloses a lead-acid battery electrode plate for preventing lead-acid battery from lead (II) sulfate crystal growth piercing and enhancing the battery formation efficiency. The lead-acid battery electrode plate comprises an electricity collector layer as an electric current channel, and two air permeable layers respectively placed on both sides of the electricity collector layer, wherein non-metallic sheet materials having porous structures are used as air-permeable channel of the air-permeable layers, and the first air-permeable layer is the same as or different from the second air-permeable layer.
    Type: Application
    Filed: June 28, 2023
    Publication date: January 4, 2024
    Inventors: SHU-HUEI HSIEH, Hual-Jen WU, Chu-Ting HSIEH, Cun-Hao XIAO, You-Cheng LIN, Zhi-Xuan YAN, Jyun-Wel LIN, Chia-Yu HSIEH, Bo-Jun LIU, Shang-Rong LI