Patents by Inventor You-Di Liao

You-Di Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220226545
    Abstract: The present invention pertains to methods of coating antimicrobial peptides on the biomaterial and the biomaterial coated thereby. The coating solution described herein comprises one or more antimicrobial peptides (AMPs) dissolved in a buffer containing an anionic surfactant, wherein the AMPs are amphipathic and cationic.
    Type: Application
    Filed: April 16, 2020
    Publication date: July 21, 2022
    Inventors: You-Di LIAO, Dan-Wei WANG, Eden WU, Shih-Han WANG, Wen-Hung TANG
  • Patent number: 7109015
    Abstract: The present invention provides methionine aminopeptidases (MetAPs) with a broad substrate range, particularly those capable of removing the N-terminal Met from bulky or acidic penultimate residues. In preferred embodiments, these MetAPs have mutations at the 233, 206 and/or 168 positions of SEQ ID NO:1. Preferably, amino acids at these residues are substituted with glycine or threonine. Also provided are cells comprising the MetAPs, DNA encoding the MetAPs, and methods of using the MetAPs.
    Type: Grant
    Filed: March 29, 2004
    Date of Patent: September 19, 2006
    Assignee: Academia Sinica
    Inventor: You-Di Liao
  • Publication number: 20050214899
    Abstract: The present invention provides methionine aminopeptidases (MetAPs) with a broad substrate range, particularly those capable of removing the N-terminal Met from bulky or acidic penultimate residues. In preferred embodiments, these MetAPs have mutations at the 233, 206 and/or 168 positions of SEQ ID NO:1. Preferably, amino acids at these residues are substituted with glycine or threonine. Also provided are cells comprising the MetAPs, DNA encoding the MetAPs, and methods of using the MetAPs.
    Type: Application
    Filed: March 29, 2004
    Publication date: September 29, 2005
    Applicant: Academia Sinica
    Inventor: You-Di Liao