Patents by Inventor You Funada

You Funada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5377081
    Abstract: The size precision of a surface mountable electronic part is improved and a production thereof is simplified. The surface mountable electronic part is constructed such that a circuit substrate is housed in a shield case of which an end side is open, and the shield case is a resin case having a shield film. A connection pattern is formed on the inner surface of the case, with one end of the connection pattern being disposed so as to correspond to an external connection land of the circuit substrate, and with the other end of the connection pattern extending to the open end of the case.
    Type: Grant
    Filed: October 2, 1992
    Date of Patent: December 27, 1994
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Tatsuo Bizen, Atsushi Inoue, You Funada, Masao Uno, Toshio Hata, Kouichi Kongo
  • Patent number: 5359315
    Abstract: A selected inductance can be provided by a three-layer structural spiral inductor having an inductor conductive part disposed between two ground electrodes within an electric insulating substrate. This is carried out by eliminating a particular portion of one of those ground electrodes formed on the outer surface of the substrate until a desired inductance is obtained, beginning at a portion of such electrode corresponding to an exposed part of a through hole joint which is electrically connected to an inner peripheral end of a spiral inductor conductive part.
    Type: Grant
    Filed: May 29, 1992
    Date of Patent: October 25, 1994
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Atsushi Inoue, Tatsuo Bizen, You Funada, Takashi Hiroshima