Abstract: A secondary battery includes a cell body having an electrode assembly disposed therein; and an electrode tab extending from each electrode of the electrode assembly to an outside of the cell body in a specified direction, and having at least one flexed part at an intermediate portion thereof.

Abstract: Disclosed is a laser processing apparatus and method for enhancing processing efficiency of an object by means of a polygon mirror. The laser processing apparatus includes a laser generator outputting a laser beam with a predetermined diameter, a polygon mirror rotating on an axis with plural reflection planes to reflect the laser beam incident on the reflection planes from the laser generator, in which the number of the reflection planes is set in order that the laser beam can cover at least two reflection planes of the polygon mirror, and a lens condensing and irradiating the laser beam reflected from the polygon mirror. According to the present invention, it is able to improve the processing efficiency and product yield of an object by dividing the laser beam into the plurality to be incident on the reflection planes of the polygon mirror and repeatedly processing the object in low energy by means of the divided laser beam.

Abstract: A chip scale marker including a laser system, a wafer holder supporting a wafer to be processed, and a camera moving above the wafer holder by being connected to an X-Y stage and monitoring the wafer supported on a center hole of the wafer holder, the chip scale marker includes a unit detachably arranged on a laser beam path from the laser system and reducing power density of a laser beam, and a screen arranged on a center hole of the wafer holder and indicating a position where a laser beam from the laser system is irradiated.

Abstract: Disclosed is a laser processing apparatus and method for enhancing processing efficiency of an object by means of a polygon mirror. The laser processing apparatus includes a laser generator outputting a laser beam with a predetermined diameter, a polygon mirror rotating on an axis with plural reflection planes to reflect the laser beam incident on the reflection planes from the laser generator, in which the number of the reflection planes is set in order that the laser beam can cover at least two reflection planes of the polygon mirror, and a lens condensing and irradiating the laser beam reflected from the polygon mirror. According to the present invention, it is able to improve the processing efficiency and product yield of an object by dividing the laser beam into the plurality to be incident on the reflection planes of the polygon mirror and repeatedly processing the object in low energy by means of the divided laser beam.

Abstract: The disclosure is directed to a laser processing apparatus employing a polygon mirror, capable of processing an object efficiently. The apparatus is comprised of a laser generator for emitting a laser beam, a polygon mirror rotating at the axis and having a plurality of reflection planes which reflect the laser beam incident thereon from the laser generator, and a lens irradiating the laser beam on an object, e.g., a wafer, that is settled on a stage, after condensing the laser beam reflected from the polygon mirror. In applying the laser beam to the wafer in accordance with a rotation of the polygon mirror, the stage on which the wafer is settled moves to enhance a relative scanning speed of the laser beam, which enables an efficient cutout operation for the wafer. As it uses only the laser beam to cutout the wafer, there is no need to change any additional devices, which improves a processing speed and cutout efficiency.

Abstract: A chip scale marker includes a laser system performing laser marking, a wafer holder on which a wafer subject to the laser marking is mounted, the wafer holder comprising a vacuum plate disposed at a center of the wafer holder for sucking the wafer and a wafer rotating unit provided at a circumference of the vacuum plate and having an open area facing the laser system, a camera disposed above the wafer holder to photograph the wafer, and a warpage removing unit provided above the wafer holder for removing warpage from the wafer.

Abstract: A chip scale marker including a laser system, a wafer holder supporting a wafer to be processed, and a camera moving above the wafer holder by being connected to an X-Y stage and monitoring the wafer supported on a center hole of the wafer holder, the chip scale marker includes a unit detachably arranged on a laser beam path from the laser system and reducing power density of a laser beam, and a screen arranged on a center hole of the wafer holder and indicating a position where a laser beam from the laser system is irradiated.

Abstract: A method and apparatus for calibrating a marking position in a chip scale marker are provided. The method includes: (a) placing a screen which is equivalent in shape to the wafer on a wafer holder for holding the wafer; (b) irradiating a laser beam at a predetermined target point on the screen, and measuring the position of the laser beam by a camera being moved above the target point; (c) transmitting the measured position information to a controller; (d) repeating steps (b) and (c) at a plurality of predetermined points; (e) comparing the transmitted position information with the target point; and (f) calibrating the position of the laser beam irradiated on the wafer by adjusting mirrors of the galvano scanner in the event that a deviation between the position information and the target point falls beyond a predetermined value.

Abstract: A chip scale marker including a laser system, a wafer holder supporting a wafer to be processed, and a camera moving above the wafer holder by being connected to an X-Y stage and monitoring the wafer supported on a center hole of the wafer holder, the chip scale marker includes a unit detachably arranged on a laser beam path from the laser system and reducing power density of a laser beam, and a screen arranged on a center hole of the wafer holder and indicating a position where a laser beam from the laser system is irradiated.

Abstract: A chip scale marker includes a laser system performing laser marking, a wafer holder on which a wafer subject to the laser marking is mounted, the wafer holder comprising a vacuum plate disposed at a center of the wafer holder for sucking the wafer and a wafer rotating unit provided at a circumference of the vacuum plate and having an open area facing the laser system, a camera disposed above the wafer holder to photograph the wafer, and a warpage removing unit provided above the wafer holder for removing warpage from the wafer.

Abstract: A chip scale marker including a laser system, a wafer holder supporting a wafer to be processed, and a camera moving above the wafer holder by being connected to an X-Y stage and monitoring the wafer supported on a center hole of the wafer holder, the chip scale marker includes a unit detachably arranged on a laser beam path from the laser system and reducing power density of a laser beam, and a screen arranged on a center hole of the wafer holder and indicating a position where a laser beam from the laser system is irradiated.

Abstract: A laser system for a dual wavelength of 1064/532 nm includes a laser oscillator oscillating a laser beam, a second harmonic generation module receiving the laser beam from the laser oscillator and generating a second harmonic wavelength, and a reflection mirror detachably arranged between the oscillator and the second harmonic generation module to reflect the laser beam oscillated by the laser oscillator in one direction when installed on a laser beam path. The laser system oscillates a laser beam having a 1064 nm wavelength when the reflection mirror is installed on the laser beam path and a laser beam having a 532 nm wavelength when the reflection mirror is detached from the laser beam path.

Abstract: Provided is a chip scale marker and a marking method. The method for marking, using a chip scale marker, wherein a laser beam is irradiated from a laser source on the wafer chips via a galvano scanner and an f-theta lens, the method comprising: (a) measuring position information of a plurality of points on the wafer; (b) transmitting the measured position information to a controller; (c) calculating a deviation between a marking distance between the f-theta lens and the point on the wafer surface and a focus distance of the f-theta lens from the transmitted position information; and (d) if the deviation is greater than a predetermined value in the step (c), calibrating the wafer chip to be positioned at the focus distance of the f-theta lens.

Abstract: Provided is a chip scale marker and a marking method. The method for marking, using a chip scale marker, wherein a laser beam is irradiated from a laser source on the wafer chips via a galvano scanner and an f-theta lens, the method comprising: (a) measuring position information of a plurality of points on the wafer; (b) transmitting the measured position information to a controller; (c) calculating a deviation between a marking distance between the f-theta lens and the point on the wafer surface and a focus distance of the f-theta lens from the transmitted position information; and (d) if the deviation is greater than a predetermined value in the step (c), calibrating the wafer chip to be positioned at the focus distance of the f-theta lens.

Abstract: The laser welding system including a welding frame for receiving a first steel plate to be welded thereupon, at least one first clamping member to be installed above the welding frame, for fixing the first steel plate received on the welding frame, at least one second clamping member for fixing a second steel plate to be welded in close vicinity to a position at which the first steel plate is to be engaged with and welded with the second steel plate, an anvil on which the second steel plate is received, for moving the second steel plate to the position at which the first steel plate is to be engaged with and welded with the second steel plate, and a laser welding head for welding the first and second steel plates at the position at which the first steel plate is to be welded with the second steel plate. The first and second clamping members and anvil are operated by air bags.

Abstract: A method and apparatus for calibrating a marking position in a chip scale marker are provided. The method includes: (a) placing a screen which is equivalent in shape to the wafer on a wafer holder for holding the wafer; (b) irradiating a laser beam at a predetermined target point on the screen, and measuring the position of the laser beam by a camera being moved above the target point; (c) transmitting the measured position information to a controller; (d) repeating steps (b) and (c) at a plurality of predetermined points; (e) comparing the transmitted position information with the target point; and (f) calibrating the position of the laser beam irradiated on the wafer by adjusting mirrors of the galvano scanner in the event that a deviation between the position information and the target point falls beyond a predetermined value.