Abstract: A semiconductor structure and a method of fabricating therefor are disclosed. A second contact pad (500) is arranged lateral to a first contact pad (420) in an interconnect structure (400). As a result, during fabrication of the interconnect structure (400), the first contact pad (420) will not be present alone in a large bland area, due to the presence of the second contact pad (500). Thus, a pattern feature for the first contact pad (420) will not be over-resolved, increasing formation accuracy of the first contact pad (420) and thus guaranteeing good electrical transmission performance of the resulting interconnect structure (400).

Abstract: An electronic device including a hinge module, a first body, a second body, and a flexible display assembled to the first body and the second body is provided. Each of the first body and the second body is pivoted and slidably connected to the hinge module, and a cover of the hinge module is exposed out of the first body and the second body. The first body and the second body are rotated relatively via the hinge module to bend or flatten the flexible display, when the flexible display is bending from a flat state, a bending portion of the flexible display leans against the cover and pushes the cover away from the first body and the second body.

Abstract: Systems and methods for generating, distributing, and using performance mode BIOS configurations are disclosed. Each performance mode BIOS configuration can be a unique set of BIOS setting values that have been established to optimize a particular performance parameter or set of performance parameters, such as boot speed or operating system installation speed. Based on a given hardware configuration and/or set of performance parameters, one or more performance mode BIOS configurations can be packaged and transferred to a memory of a BMC in the form of one or more configuration payloads. The BIOS Setup Utility can display all configuration payloads, such as listed by the type of performance mode (e.g., “Boot Speed Performance Mode” and “OS Installation Performance Mode”), that are available in the BMC memory and allow a user to overwrite the memory containing the current BIOS configuration with a selected configuration payload.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: A method includes depositing a first passivation layer over a conductive feature, wherein the first passivation layer has a first dielectric constant, forming a capacitor over the first passivation layer, and depositing a second passivation layer over the capacitor, wherein the second passivation layer has a second dielectric constant greater than the first dielectric constant. The method further includes forming a redistribution line over and electrically connecting to the capacitor, depositing a third passivation layer over the redistribution line, and forming an Under-Bump-Metallurgy (UBM) penetrating through the third passivation layer to electrically connect to the redistribution line.

Abstract: A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded to a first side of the interposer, an encapsulant on the first side of the interposer encircling the semiconductor die, a substrate bonded to the a second side of the interposer, an underfill between the interposer and the substrate, and one or more of dam structures on the substrate. The one or more dam structures may be disposed adjacent respective corners of the interposer and may be in direct contact with the underfill. The coefficient of thermal expansion of the one or more of dam structures may be smaller than the coefficient of thermal expansion of the underfill.

Abstract: A transmission system for an aircraft powerplant includes a transmission shaft is provided. An input end of the transmission shaft is sleeved with a driven gear, one end of the driven gear is axially limited, and the other end of the transmission shaft is configured to connect a rotating member; and an end of the driven gear is in transmission connection with a stop hub, the stop hub is in transmission connection with an overload clutch, the overload clutch is in transmission connection with the transmission shaft, an end of the overload clutch away from the stop hub abuts against one end of a disc spring member, the other end of the disc spring member is axially limited, and a force value of the overload clutch is a fixed value.

Abstract: The present disclosure provides a device for conveying and dispersing a silicon wafer (100). The device for conveying and dispersing a silicon wafer (100) includes: a conveying component (20) configured for conveying a plurality of silicon wafers (200); a clamping component (10) disposed at two sides of the conveying component (20), the clamping component (10) being capable of clamping and conveying the plurality of silicon wafers (200); and a spraying component (30) disposed on the clamping component (10), wherein after the plurality of silicon wafers (200) are conveyed to an end of the conveying component (20) proximal to the spraying component (30) via the conveying component (20) and the clamping component (10), the spraying component (30) is capable of spraying water on the plurality of silicon wafers (200) to separate adjacent two of the plurality of silicon wafers (200).

Abstract: Disclosed is a method for adaptive identification of erroneous GPS observed value, including: acquiring positioning information of a vehicle from a GPS sensor, and extracting first observed value data; acquiring posture information and speed information of the vehicle to acquire dead reckoning trajectory data of the vehicle; eliminating the erroneous GPS observed values based on respective data on data status value, heading significant bit, the number of satellites used and horizontal dilution of precision in the first observed value data to obtain second observed value data; constructing pose graph data based on the second observed value data and acquiring processing result information; analyzing and optimizing the processing result information to eliminate the erroneous GPS observed values of which the cost function exceeds a preset cost function threshold to obtain third observed value data; and constructing a high-precision map based on the third observed value data and three-dimensional scene map data.

Abstract: A turnaround mechanism of silicon wafers is provided. The turnaround mechanism includes a material frame, a supporting component, a second clamping component. The frame is provided with a material tank. The supporting component includes at least one first clamping component, and each of the at least one first clamping component is configured to clamp or release a support. The second clamping component includes two first rotating shafts disposed oppositely and two second clamping members, the two first rotating shafts are rotatably connected to the material frame, the two second clamping members are correspondingly disposed on the two first rotating shafts respectively, and each of the two second clamping members can rotate with a corresponding first rotating shaft, enabling the two second clamping members to move toward each other to clamp the silicon wafers to be separated.

Abstract: The present disclosure provides a device for conveying and dispersing a silicon wafer (100). The device for conveying and dispersing a silicon wafer (100) includes: a conveying component (20) configured for conveying a plurality of silicon wafers (200); a clamping component (10) disposed at two sides of the conveying component (20), the clamping component (10) being capable of clamping and conveying the plurality of silicon wafers (200); and a spraying component (30) disposed on the clamping component (10), wherein after the plurality of silicon wafers (200) are conveyed to an end close to the spraying component (30) of the conveying component (20) via the conveying component (20) and the clamping component (10), the spraying component (30) is capable of spraying water on the plurality of silicon wafers (200) to separate adjacent two of the plurality of silicon wafers (200).

Abstract: An image stitching apparatus, an image processing chip and an image stitching method are provided. The image stitching apparatus includes a motion detection circuit, a determination circuit and a stitching circuit. The motion detection circuit performs motion detection on an overlapping area between a first image and a second image that are to undergo stitching to obtain a motion area having a moving object in the overlapping area. The determination circuit calculates a target stitching line using a constraint of avoiding the motion area. The stitching circuit stitches the first image and the second image according to the target stitching line to obtain a stitched image.

Abstract: Disclosed is a method for adaptive identification of erroneous GPS observed value, including: acquiring positioning information of a vehicle from a GPS sensor, and extracting first observed value data; acquiring posture information and speed information of the vehicle to acquire dead reckoning trajectory data of the vehicle; eliminating the erroneous GPS observed values based on respective data on data status value, heading significant bit, the number of satellites used and horizontal dilution of precision in the first observed value data to obtain second observed value data; constructing pose graph data based on the second observed value data and acquiring processing result information; analyzing and optimizing the processing result information to eliminate the erroneous GPS observed values of which the cost function exceeds a preset cost function threshold to obtain third observed value data; and constructing a high-precision map based on the third observed value data and three-dimensional scene map data.

Abstract: An image stitching method and an image stitching device for stitching a first image and a second image are presented. The image stitching method includes: calculating, according to pixel values of the first image and the second image in an overlapping area, a plurality of costs respectively corresponding to a plurality of positions in the overlapping area; calculating, according to the plurality of costs and relative distances between the plurality of positions, a plurality of forward regularized cumulative costs respectively corresponding to the plurality of positions in the overlapping area; determining a seam in the overlapping area according to the plurality of forward regularized cumulative costs, wherein the seam includes a plurality of stitching positions; and stitching the first image and the second image on the basis of the seam to generate a stitched image.

Abstract: A present invention discloses an image stitching method and an image stitching device for stitching a first image and a second image. The image stitching method includes: calculating, according to pixel values of the first image and the second image in an overlapping area, a plurality of costs respectively corresponding to a plurality of positions in the overlapping area; calculating, according to the plurality of costs and relative distances between the plurality of positions, a plurality of forward regularized cumulative costs respectively corresponding to the plurality of positions in the overlapping area; determining a seam in the overlapping area according to the plurality of forward regularized cumulative costs, wherein the seam includes a plurality of stitching positions; and stitching the first image and the second image on the basis of the seam to generate a stitched image.

Abstract: Disclosed herein is a new and improved therapy for the treatment of cancer, which comprises the step of altering cell membrane lipid composition by treating a cancer cell with an enzyme inhibitor which inhibits enzymes regulating the cholesterol biosynthetic pathway. One preferred protein target in the cholesterol biosynthetic pathway to inhibit is oxidosqualene cyclase. In some forms, inhibitors of one or more pathways are combined with an existing chemotherapeutic agent to combat drug resistance and enhance the therapeutic efficacy of conventional therapy.

Abstract: The invention provides a method for transferring cells to carriers, including: (a) providing a hydrophobic cell culture container or a cell culture container coated with a hydrophobic material on a bottom thereof; (b) adding carriers which are more hydrophilic than the hydrophobic cell culture container or hydrophobic materials and a culture medium containing cells into the hydrophobic cell culture container or the cell culture container coated with the hydrophobic material on the bottom thereof; and (c) culturing the cells, wherein the cells attach to the carriers and grow.

Abstract: The present invention identifies the cholesterol biosynthetic pathway, including the enzyme oxidosqualene cyclase, as new protein targets for anti-tumor therapeutics. The present invention further provides a class of oxidosqualene cyclase inhibitors containing a tertiary amine linked with aromatic ring structures, as a new class of anticancer agents. Compounds disclosed herein have been tested in 19 cell lines including breast cancer, prostate cancer, lung cancer (including drug-resistant lung cancer H69AR), colon cancer, ovarian cancer (including drug-resistant OVCAR-3), and pancreatic cancer cells, as wells as in human breast and prostate xenograft tumor growth in nude mice, and have been shown to be active.

Abstract: A method for culturing microtissue is provided. The method includes steps of: (a) forming a pattern microarray on a hydrophobic film; (b) adhering the hydrophobic film to a carrier; (c) disposing a plurality of cells on the hydrophobic film for culturing depending on the pattern microarray, and forming a plurality of hair follicle microtissues.

Abstract: The present invention discloses a method for forming a porous bio-mimicking scaffold. At first, at least two types of solutions are provided where at least one of the solutions is a bio-mimicking scaffold solution comprising a bio-mimicking scaffold and at least one of the solutions is a pore forming solution comprising a pore forming material having at least one corresponding specific solvent. Then, a filling process is performed to fill the solutions into different needles of a blending injection device. Following that, an electrospinning process is performed to form a composite material. Each material type for forming the composite material is selected from the group consisting of the following: fiber, particle, and combination of fiber and particle. Finally, a removing process using the solvent to dissolve the pore forming material is performed to thereby form a porous bio-mimicking scaffold.