Patents by Inventor You-Jeong JEONG

You-Jeong JEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Seat ventilation blower and seat ventilation system having the same
    Patent number: 11637473
    Abstract: A seat ventilation blower may include a first housing; a second housing coupled and assembled to the first housing; an impeller inserted inside the first housing or the second housing, the impeller configured to rotate; and a circuit board body having a motor assembly coupled to the impeller to rotate the impeller wherein the circuit board body is configured to control operation of the motor assembly and installed in the housing when the first and second housings are coupled and assembled together.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: April 25, 2023
    Assignees: Hyundai Motor Company, Kia Motors Corporation, INZICONTROLS CO., LTD., Hyundai Transys Inc.
    Inventors: Ju-Hyun Kim, Sang-Uk Yu, Doo-Ri Kim, Yo-Han Kim, Byung-Jae Lee, Byung-Yong Choi, Seon-Chae Na, Ho-Sub Lim, Jin-Hyuk Kim, Young-Dae Hong, You-Jeong Jeong, Sang-Kyung Koh
  • Channel cover for ventilation seat and method of manufacturing same
    Patent number: 11124098
    Abstract: Provided is a channel cover for a ventilation seat, the channel cover including a ventilation passage blocking layer which has the shape of a plate that extends in the planar direction and of which a lower surface is positioned on an upper portion of a seat frame; an adhesion layer which extends in the planar direction, of which both upper and lower surfaces have an adhesive property, of which the lower surface is adhered to an upper surface of the ventilation passage blocking layer, and in the upper surface of which a cutting line for separating a release paper sheet is formed; and a non-woven fabric layer which covers an air flow path groove, a lower surface of which is adhered to an upper surface of the adhesion layer, a lateral end portion of which extends more outward than the cutting line, and which covers the cutting line from above.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: September 21, 2021
    Assignee: HYUNDAI TRANSYS INCORPORATED
    Inventors: Ho Sub Lim, You Jeong Jeong
  • CHANNEL COVER FOR VENTILATION SEAT AND METHOD OF MANUFACTURING SAME
    Publication number: 20200317097
    Abstract: Provided is a channel cover for a ventilation seat, the channel cover including a ventilation passage blocking layer which has the shape of a plate that extends in the planar direction and of which a lower surface is positioned on an upper portion of a seat frame; an adhesion layer which extends in the planar direction, of which both upper and lower surfaces have an adhesive property, of which the lower surface is adhered to an upper surface of the ventilation passage blocking layer, and in the upper surface of which a cutting line for separating a release paper sheet is formed; and a non-woven fabric layer which covers an air flow path groove, a lower surface of which is adhered to an upper surface of the adhesion layer, a lateral end portion of which extends more outward than the cutting line, and which covers the cutting line from above.
    Type: Application
    Filed: March 30, 2020
    Publication date: October 8, 2020
    Inventors: Ho Sub LIM, You Jeong JEONG
  • SEAT VENTILATION BLOWER AND SEAT VENTILATION SYSTEM HAVING THE SAME
    Publication number: 20200282881
    Abstract: A seat ventilation blower may include a first housing; a second housing coupled and assembled to the first housing; an impeller inserted inside the first housing or the second housing, the impeller configured to rotate; and a circuit board body having a motor assembly coupled to the impeller to rotate the impeller wherein the circuit board body is configured to control operation of the motor assembly and installed in the housing when the first and second housings are coupled and assembled together.
    Type: Application
    Filed: November 21, 2019
    Publication date: September 10, 2020
    Inventors: Ju-Hyun Kim, Sang-Uk Yu, Doo-Ri Kim, Yo-Han Kim, Byung-Jae Lee, Byung-Yong Choi, Seon-Chae Na, Ho-Sub Lim, Jin-Hyuk Kim, Young-Dae Hong, You-Jeong Jeong, Sang-Kyung Koh
  • Wafer supporting structure, intermediate structure of a semiconductor package including the wafer supporting structure
    Patent number: 9076701
    Abstract: A wafer supporting structure includes a supporting substrate for supporting a wafer, a release layer for detaching the wafer from the supporting substrate, and an adhesive layer for attaching the wafer to the supporting substrate.
    Type: Grant
    Filed: January 3, 2014
    Date of Patent: July 7, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jun-Won Han, Jae-Hyun Kim, Tae-Hoon Kim, Ho-Geun Lee, You-Jeong Jeong, Jung-Sik Choi
  • WAFER SUPPORTING STRUCTURE, INTERMEDIATE STRUCTURE OF A SEMICONDUCTOR PACKAGE INCLUDING THE WAFER SUPPORTING STRUCTURE
    Publication number: 20140183728
    Abstract: A wafer supporting structure includes a supporting substrate for supporting a wafer, a release layer for detaching the wafer from the supporting substrate, and an adhesive layer for attaching the wafer to the supporting substrate.
    Type: Application
    Filed: January 3, 2014
    Publication date: July 3, 2014
    Inventors: Jun-Won HAN, Jae-Hyun KIM, Tae-Hoon KIM, Ho-Geun LEE, You-Jeong JEONG, Jung-Sik CHOI