Patents by Inventor You-Jin Oh

You-Jin Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190345600
    Abstract: The present invention relates to a method of manufacturing a superabsorbent polymer absorber containing metal nanoparticles and an application of the superabsorbent polymer absorber which is manufactured by the same and has antibacterial, sterilization, far infrared ray emission, prevention of blood oxidation, and mineral releasing functions. Specifically, the present invention relates to a technique in which metal nanoparticles such as copper, brass, bronze, silver, gold, germanium, and zinc are formed on the superabsorbent polymer by using a water-free manufacturing method, then, when the superabsorbent polymer absorbs water, the metal nanoparticles are naturally and uniformly dispersed, thereby allowing the superabsorbent polymer to exhibit inherent properties of the metal nanoparticles, and an application thereof.
    Type: Application
    Filed: April 19, 2019
    Publication date: November 14, 2019
    Inventors: Seok Keun Koh, You Jin Oh, Hyung Deok Kim
  • Patent number: 9905436
    Abstract: A method for manufacturing a wafer level fan-out package includes attaching a semiconductor chip on a partial area of an IO pattern formed on one surface of a wafer, forming a first passivation layer on surfaces of the semiconductor chip and the wafer, forming an RDL (redistribution layer) that is electrically conducted with the IO pattern and the semiconductor chip, in a partial area of a top surface of the first passivation layer, and forming a second passivation layer on the top surface of the first passivation layer and a partial surface of the RDL.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: February 27, 2018
    Assignee: STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD.
    Inventors: You Jin Oh, Eun Dong Kim, Jong Won Lee, Jai Kyoung Choi
  • Publication number: 20170092510
    Abstract: A method for manufacturing a wafer level fan-out package includes attaching a semiconductor chip on a partial area of an IO pattern formed on one surface of a wafer, forming a first passivation layer on surfaces of the semiconductor chip and the wafer, forming an RDL (redistribution layer) that is electrically conducted with the IO pattern and the semiconductor chip, in a partial area of a top surface of the first passivation layer, and forming a second passivation layer on the top surface of the first passivation layer and a partial surface of the RDL.
    Type: Application
    Filed: February 25, 2016
    Publication date: March 30, 2017
    Inventors: You Jin OH, Eun Dong KIM, Jong Won LEE, Jai Kyoung CHOI
  • Patent number: 8093350
    Abstract: Disclosed is a coordination polymer crystal with porous metal-organic frameworks (MOFs), in which, while a crystal state of the coordination polymer crystal is maintained, an additional material selected from the group consisting of an organic compound, a metal cluster, and an organometallic compound is chemically bonded to the coordination polymer crystal. Therefore it is possible easily adsorb and store more guest molecules regardless of a change in an ambient temperature or pressure due to the chemically bonded additional material.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: January 10, 2012
    Assignee: Insilicotech Co., Ltd
    Inventors: Dong-Hyun Jung, Min-Kyoung Kim, Dae-Jin Kim, Tae-Bum Lee, Seung-Hoon Choi, Ji-Hye Yoon, Sang-Beom Choi, You-Jin Oh, Min-Jeong Seo, Ja-Heon Kim, Byoung-Ho Won, Ki-Hang Choi
  • Publication number: 20100174047
    Abstract: Disclosed is a coordination polymer crystal with porous metal-organic frameworks (MOFs), in which, while a crystal state of the coordination polymer crystal is maintained, an additional material selected from the group consisting of an organic compound, a metal cluster, and an organometallic compound is chemically bonded to the coordination polymer crystal. Therefore it is possible easily adsorb and store more guest molecules regardless of a change in an ambient temperature or pressure due to the chemically bonded additional material.
    Type: Application
    Filed: November 30, 2007
    Publication date: July 8, 2010
    Applicant: Insilicotech Co., Ltd.
    Inventors: Dong-Hyun Jung, Min-Kyoung Kim, Dea-Jin Kim, Tae-Bum Lee, Seung-Hoon Choi, Ji-Hye Yoon, Sang-Beom Choi, You-Jin Oh, Min-Jeong Seo, Ja-Heon Kim, Byoung-Ho Won, Ki-Hang Choi