Abstract: A wire bonding apparatus including a joining machine unit for joining a wire to a subject device, a measurement unit for measuring the connection state between the subject device and the wire, and a control unit for controlling the operation of the entire apparatus. An AC-C measurement circuit of the measurement unit includes an AC power supply, an equivalent capacitance circuit that creates an essentially the same capacitance as the capacitance component of the joining machine unit before bonding, a differential circuit that finds the difference between the capacitance of the joining machine unit after bonding and the capacitance of the equivalent capacitance circuit, an amplification circuit, a rectification circuit, an AID conversion circuit, a judgment unit that judges the connection state, and an output unit.

Abstract: A wire bonding apparatus 10 including a joining machine unit 20 for joining a wire to a subject device 4, a measurement unit 50 for measuring the connection state between the subject device 4 and the wire 24, and a control unit 40 for controlling the operation of the entire apparatus. An AC-C measurement circuit 60 of the measurement unit 50 includes an AC power supply 62, an equivalent capacitance circuit 64 that creates an essentially the same capacitance as the capacitance component of the joining machine unit 20 before bonding, a differential circuit 68 that finds the difference between the capacitance of the joining machine unit 20 after bonding and the capacitance of the equivalent capacitance circuit 64, an amplification circuit 70, a rectification circuit 72, an AID conversion circuit 74, a judgment unit 80 that judges the connection state, and an output unit 90.