Abstract: Lithium secondary batteries are disclosed. In an embodiment, a lithium secondary battery includes an anode including an anode active material that includes carbon-based active material particles including carbon, the carbon-based active material particles having a Brunauer-Emmett-Teller (BET) specific surface area of 3.0 m2/g to 5.0 m2/g and an average particle diameter (D50) of 5?m to 7.5 ?m, a cathode facing the anode, and a non-aqueous electrolyte solution including a non-aqueous organic solvent that includes a propionate-based organic solvent including propionate and a lithium salt. A content of the propionate-based organic solvent relative to a total volume of the non-aqueous organic solvent is 55 vol % or more.

Abstract: The present invention relates to a context-based QA generation architecture, and an object of the present invention is to generate diverse QA pairs from a single context. To achieve the object, the present invention includes a latent variable generating network including at least one encoder and an artificial neural network (Multi-Layer Perceptron: MLP) and configured to train the artificial neural network using a first context, a first question, and a first answer, and generate a second question latent variable and a second answer latent variable by applying the trained artificial neural network to a second context, an answer generating network configured to generate a second answer by decoding the second answer latent variable, and a question generating network configured to generate a second question based on a second context and the second answer.

Abstract: Provided is a display device including a display panel, an optical sensor, a timing controller, a scan driver, a data driver, and an image controller. The timing controller controls an image refresh rate of the display panel based on a refresh rate control signal. Thus, the display device provides improved visibility.

Abstract: A composite pad and a battery cell assembly and a battery module including the composite pad are disclosed. In some implementations, the battery cell assembly comprises a plurality of battery cells arranged in a direction, and one or more pads, each pad disposed between two adjacent battery cells of the plurality of battery cells, at least one of the one or more pads including a pad body with elasticity, and a heat generating part coupled to the pad body and connected to an edge of the at least one of the one or more pads and configured to generate heat upon application of electric power to the heat generating part.

Abstract: A stack package includes a first package having a first semiconductor chip and a first encapsulation member which seals the first semiconductor chip. A second package is stacked on the first package, and includes a second semiconductor chip and a second encapsulation member which seals the second semiconductor chip. Flexible conductors are disposed within the first encapsulation member of the first package in such a way as to electrically connect the first package and the second package.

Abstract: A stack package includes a first package having a first semiconductor chip and a first encapsulation member which seals the first semiconductor chip. A second package is stacked on the first package, and includes a second semiconductor chip and a second encapsulation member which seals the second semiconductor chip. Flexible conductors are disposed within the first encapsulation member of the first package in such a way as to electrically connect the first package and the second package.

Abstract: A stack package includes a first package having a first semiconductor chip and a first encapsulation member which seals the first semiconductor chip. A second package is stacked on the first package, and includes a second semiconductor chip and a second encapsulation member which seals the second semiconductor chip. Flexible conductors are disposed within the first encapsulation member of the first package in such a way as to electrically connect the first package and the second package.

Abstract: A stack semiconductor package includes a first insulation member having engagement projections and a second insulation member formed having engagement grooves into which the engagement projections are to be engaged. First conductive members are disposed in the first insulation member and have portions which are exposed on the engagement projections. Second conductive members are disposed in the second insulation member in such a way as to face the first conductive members and have portions which are exposed in the engagement grooves. A first semiconductor chip is disposed within the first insulation member and is electrically connected to the first conductive members. A second semiconductor chip is disposed in the second insulation member and is electrically connected to the second conductive members.

Abstract: A stack package includes a first package having a first semiconductor chip and a first encapsulation member which seals the first semiconductor chip. A second package is stacked on the first package, and includes a second semiconductor chip and a second encapsulation member which seals the second semiconductor chip. Flexible conductors are disposed within the first encapsulation member of the first package in such a way as to electrically connect the first package and the second package.

Abstract: A stack semiconductor package includes a first insulation member having engagement projections and a second insulation member formed having engagement grooves into which the engagement projections are to be engaged. First conductive members are disposed in the first insulation member and have portions which are exposed on the engagement projections. Second conductive members are disposed in the second insulation member in such a way as to face the first conductive members and have portions which are exposed in the engagement grooves. A first semiconductor chip is disposed within the first insulation member and is electrically connected to the first conductive members. A second semiconductor chip is disposed in the second insulation member and is electrically connected to the second conductive members.