Abstract: A housing for an electronic device is provided. The housing includes a substrate made of a light-transmittable ceramic. The substrate has an outer surface and an opposite inner surface defining at least one recess configured with patterns or symbols. An opaque layer is formed on the inner surface to prevent light penetrating through the substrate except through the at least one recess.

Abstract: A keypad assembly, comprising: a main body made of metal, the main body defining a plurality of slots and the slots enclosing a plurality of pressing buttons thereon, each pressing button defining at least one symbol slot, the main body having a contact surface and a operating surface; and a light-transmissive filling member, the filling member defining a plurality of protruding strips and the protruding strips enclosing a plurality of button areas thereon, each button area having at least one symbol block protruding therefrom, the filling member bonding to the contact surface with the protruding strips and the symbol blocks respectively engaging in the corresponding slots and the symbol slots. A method for making the present keypad assembly is also described.

Abstract: A device housing for an electronic device is provided. The device housing includes a substrate and assembling members protruding from the substrate. The substrate includes a fiber member, a metal member embedded within the fiber member, and a transparent resin layer formed on the fiber member. The fiber member defines openings. The assembling members extend through the openings and connect with the metal member. A method for making the present device housing is also provided.

Abstract: A housing for an electronic device is provided. The housing includes a substrate made of a light-transmittable ceramic. The substrate has an outer surface and an opposite inner surface defining at least one recess configured with patterns or symbols. An opaque layer is formed on the inner surface to prevent light penetrating through the substrate except through the at least one recess.

Abstract: A housing for electronic device, comprising: a substrate, the substrate having an outer surface; a metallic coating formed on at least the outer surface of the substrate, the metallic coating defining a plurality of grooves thereon and forming a pattern; and a metal pattern layer formed in the grooves. A method for making the present housing is also provided.

Abstract: A method for inlaying a gold ornament is disclosed. A substrate is provided which has an outer surface. A groove is defined in the substrate through the outer surface. A gold ornament is manufactured. The gold ornament has substantially the same shape as the groove. The gold ornament is placed in the groove wherein is positioned with metallic solder. Then the substrate is heated, whereby the melting and subsequent cooling of the solder bonds the gold ornament to the substrate. A housing for electronic device inlaid with a gold ornament made by the present method is also provided.

Abstract: A keypad assembly, comprising: a main body made of metal, the main body defining a plurality of slots and the slots enclosing a plurality of pressing buttons thereon, each pressing button defining at least one symbol slot, the main body having a contact surface and a operating surface; and a light-transmissive filling member, the filling member defining a plurality of protruding strips and the protruding strips enclosing a plurality of button areas thereon, each button area having at least one symbol block protruding therefrom, the filling member bonding to the contact surface with the protruding strips and the symbol blocks respectively engaging in the corresponding slots and the symbol slots. A method for making the present keypad assembly is also described.