Patents by Inventor You-Liang LAI

You-Liang LAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8451078
    Abstract: A CMOS-MEMS switch structure is disclosed. The CMOS-MEMS switch structure includes a first substrate, a second substrate, a first cantilever beam, and a second cantilever beam. The first and second substrates are positioned opposite each other. The first cantilever beam is provided on the first substrate, extends from the first substrate toward the second substrate, and bends downward. Likewise, the second cantilever beam is provided on the second substrate, extends from the second substrate toward the first substrate, and bends downward. The first and second substrates are movable toward each other to connect a first top surface of the first cantilever beam and a second top surface of the second cantilever beam, and away from each other so that the first top surface of the first cantilever beam and the second top surface of the second cantilever beam are disconnected, thereby closing or opening the CMOS-MEMS switch structure.
    Type: Grant
    Filed: June 15, 2011
    Date of Patent: May 28, 2013
    Assignees: National Chip Implementation Center, National Applied Research Laboratories
    Inventors: You-Liang Lai, Ying-Zong Juang, Hann-Huei Tsai, Sheng-Hsiang Tseng, Chin-Fong Chiu
  • Publication number: 20120279838
    Abstract: A CMOS-MEMS switch structure is disclosed. The CMOS-MEMS switch structure includes a first substrate, a second substrate, a first cantilever beam, and a second cantilever beam. The first and second substrates are positioned opposite each other. The first cantilever beam is provided on the first substrate, extends from the first substrate toward the second substrate, and bends downward. Likewise, the second cantilever beam is provided on the second substrate, extends from the second substrate toward the first substrate, and bends downward. The first and second substrates are movable toward each other to connect a first top surface of the first cantilever beam and a second top surface of the second cantilever beam, and away from each other so that the first top surface of the first cantilever beam and the second top surface of the second cantilever beam are disconnected, thereby closing or opening the CMOS-MEMS switch structure.
    Type: Application
    Filed: June 15, 2011
    Publication date: November 8, 2012
    Applicant: National Chip Implementation Center National Applied Research Laboratories.
    Inventors: You-Liang LAI, Ying-Zong JUANG, Hann-Huei TSAI, Sheng-Hsiang TSENG, Chin-Fong CHIU