Abstract: A light emitting display device and a method for fabricating the same. The light emitting display device includes a substrate, a first electrode arranged on the substrate, a first insulating film arranged on the substrate and including a first opening that exposes a portion of the first electrode, a second insulating film arranged on the first insulating film and including a second opening that exposes the first opening, a light emitting layer including a light emitting material arranged on the exposed portion of first electrode while also being in contact with the first insulating film and a second electrode arranged on the light emitting layer, wherein a difference in wetting between the first electrode and the first insulating film with respect to the light emitting material is lower than a difference in wetting between the first electrode and the second insulating film with respect to the light emitting material.

Abstract: An organic light emitting diode display is disclosed. In one aspect, the display includes a pixel electrode formed on a substrate and a pixel defining layer on the pixel electrode, the pixel defining layer having an opening exposing a part of the pixel electrode, and a stepped side wall of the opening. The display also includes an organic emission layer on the pixel electrode in the opening of the pixel defining layer and a common electrode covering the organic emission layer and the pixel defining layer. The pixel defining layer has a stepped side wall of the opening.

Abstract: An organic light emitting display includes a substrate, a first electrode disposed on the substrate, a pixel definition layer disposed on the substrate to partition a pixel area, a first common layer disposed on the first electrode, a protrusion pattern that includes a plurality of protrusions disposed on the first common layer and spaced apart from each other, a light emitting layer disposed on the first common layer in the pixel area, and a second electrode disposed on the light emitting layer.

Abstract: A thin film forming apparatus and a thin film forming method using the same are disclosed. In one aspect, the thin film forming apparatus comprises a mask that includes a blocking portion and an opening. It also includes an etching source that jets an etching gas through the opening of the mask to etch a thin film according to a pattern. The mask includes a gas blower for blowing a gas around the opening so that the etching gas does not penetrate into a thin film area corresponding to the block portion. When the thin film forming apparatus is used, a normal residual area of a thin film may be safely preserved and patterning may be accurately performed. Thus, the quality of a product manufactured by using the thin film forming apparatus may be improved.

Abstract: A deposition apparatus includes deposition sources, a deposition chamber, a mask assembly, and a transfer unit. The mask assembly includes a support member, a shutter member, and a drive member. The support member has a first opening configured to allow the deposition materials to pass through while supporting the base substrate on which the passed-through deposition materials are deposited. The shutter member is accommodated in the support member and has a second opening smaller than the first opening. The drive member is configured to change a position of the second opening with respect to the base substrate in accordance with the movement of the mask assembly.

Abstract: A deposition apparatus may uniformly control deposited quantities of a plurality of depositing sources by efficiently determining an abnormal depositing source. The deposition apparatus may reduce loss of materials by exactly determining an abnormal depositing source. The deposition apparatus includes: a plurality of depositing sources spraying a deposition material; a substrate holder fixing a substrate to face the depositing source; a depositing source shutter disposed at one side of the depositing source and opening and closing an passage of each depositing source; and a main shutter disposed between the depositing source and the substrate fixed to the substrate holder and depositing a part of the deposition material on the substrate through the main shutter.

Abstract: A substrate centering device for an organic material deposition system comprises: a plurality of substrate support holders configured to be reciprocally movable in a facing direction within an organic material deposition chamber and supporting both side portions of a substrate loaded by a robot; a substrate centering unit configured to be reciprocally movable at each of the substrate support holders and centering the substrate by guiding both side portions of the substrate; and a plurality of substrate clampers configured to be reciprocally movable in a vertical direction at each of the substrate support holders, and clamping the substrate that has been centered by the substrate centering unit.

Abstract: A substrate bonding apparatus includes a vacuum chamber having a bonding space where a first substrate and a second substrates are bonded together, a first pump for sucking air of the bonding space at a first intensity, a second pump for sucking the air of the bonding space at a second intensity greater than the first intensity, a nitrogen supply for supplying nitrogen to the bonding space, a sensor for sensing the pressure of the bonding space; and a controller for controlling the first pump, the second pump, and the nitrogen supply.

Abstract: An apparatus for depositing an organic material and a depositing method thereof, wherein a deposition process is performed with respect to a second substrate while transfer and alignment processes are performed with respect to a first substrate in a chamber, so that loss of an organic material wasted in the transfer and alignment processes can be reduced, thereby maximizing material efficiency and minimizing a processing tack time. The apparatus includes a chamber having an interior divided into a first substrate deposition area and a second substrate deposition area, an organic material deposition source transferred to within ones of the first and second substrate deposition areas to spray particles of an organic material onto respective ones of first and second substrates and a first transferring unit to rotate the organic material deposition source in a first direction from one of the first and second substrate deposition areas to an other of the first and second substrate deposition areas.

Abstract: A substrate centering device for an organic material deposition system comprises: a plurality of substrate support holders configured to be reciprocally movable in a facing direction within an organic material deposition chamber and supporting both side portions of a substrate loaded by a robot; a substrate centering unit configured to be reciprocally movable at each of the substrate support holders and centering the substrate by guiding both side portions of the substrate; and a plurality of substrate clampers configured to be reciprocally movable in a vertical direction at each of the substrate support holders, and clamping the substrate that has been centered by the substrate centering unit.

Abstract: A substrate centering device for an organic material deposition system comprises: a plurality of substrate support holders configured to be reciprocally movable in a facing direction within an organic material deposition chamber and supporting both side portions of a substrate loaded by a robot; a substrate centering unit configured to be reciprocally movable at each of the substrate support holders and centering the substrate by guiding both side portions of the substrate; and a plurality of substrate clampers configured to be reciprocally movable in a vertical direction at each of the substrate support holders, and clamping the substrate that has been centered by the substrate centering unit.

Abstract: The present invention discloses an electrostatic chuck sucking and supporting a substrate with an electrostatic force and an OLED manufacturing apparatus having the same. The electrostatic chuck includes an insulating plate having at least one opening penetrating a center thereof, a pair of electrodes mounted on the insulating plate, a first controller applying a voltage to the pair of electrodes, and an electrostatic charge removing unit disposed near the insulating plate and emitting ions into the at least one opening to remove electrostatic charges distributed around a side of the insulating plate.

Abstract: Disclosed is a frit sealing apparatus and method of using the same, the apparatus being capable of irradiating infrared rays only to a frit portion of a substrate. The apparatus includes a first chamber, a second chamber positioned inside the first chamber, a lamp positioned inside the second chamber, a stage positioned outside the first chamber to receive and fix a first mother substrate and a second mother substrate, an emitting part formed in the first chamber and the second chamber and positioned to direct heat supplied by the lamp to the stage. The apparatus also includes a mask positioned over the substrates, the mask including one or more transmitting portions positioned over regions containing the frit, and one or more interrupting portions positioned at other regions.

Abstract: A substrate bonding apparatus includes a vacuum chamber having a bonding space where a first substrate and a second substrates are bonded together, a first pump for sucking air of the bonding space at a first intensity, a second pump for sucking the air of the bonding space at a second intensity greater than the first intensity, a nitrogen supply for supplying nitrogen to the bonding space, a sensor for sensing the pressure of the bonding space; and a controller for controlling the first pump, the second pump, and the nitrogen supply.

Abstract: A substrate centering device for an organic material deposition system comprises: a plurality of substrate support holders configured to be reciprocally movable in a facing direction within an organic material deposition chamber and supporting both side portions of a substrate loaded by a robot; a substrate centering unit configured to be reciprocally movable at each of the substrate support holders and centering the substrate by guiding both side portions of the substrate; and a plurality of substrate clampers configured to be reciprocally movable in a vertical direction at each of the substrate support holders, and clamping the substrate that has been centered by the substrate centering unit.

Abstract: A laser irradiation apparatus includes a plurality of laser heads from which a laser is irradiated, can adjust arranged intervals of the laser heads, and moves freely to irradiate the laser along a shape of a subject. A laser oscillator oscillates a laser. A plurality of laser heads linearly irradiate the laser oscillated by the laser oscillator. A first driving means adjusts arranged intervals of the laser heads, and moves the laser heads in an X direction. A second driving means moves the laser heads in a Y direction different from the X direction.

Abstract: A deposition apparatus including a plurality of reaction chambers, and a method of controlling the deposition apparatus. The deposition apparatus includes a first chamber to deposit a first deposition material onto a deposition body, a second chamber to deposit a second and different deposition material onto the deposition body, a third chamber to deposit the first deposition material onto the deposition body, a transfer chamber connected to the first through third chambers, the transfer chamber to transfer the deposition body to ones of the first through third chambers and a control unit to transport the deposition body from the transfer chamber to ones of the first through third chambers.

Abstract: An apparatus for depositing an organic material and a depositing method thereof, wherein a deposition process is performed with respect to a second substrate while transfer and alignment processes are performed with respect to a first substrate in a chamber, so that loss of an organic material wasted in the transfer and alignment processes can be reduced, thereby maximizing material efficiency and minimizing a processing tack time. The apparatus includes a chamber having an interior divided into a first substrate deposition area and a second substrate deposition area, an organic material deposition source transferred to within ones of the first and second substrate deposition areas to spray particles of an organic material onto respective ones of first and second substrates and a first transferring unit to rotate the organic material deposition source in a first direction from one of the first and second substrate deposition areas to an other of the first and second substrate deposition areas.

Abstract: Provided is an evaporating apparatus that deposits a deposition material onto a treatment object. The evaporating apparatus includes a base, a deposition source, and first and second correction units. The deposition source deposits the deposition material onto the treatment object. The base is disposed separately from the treatment object. The deposition source is placed on a surface of the base. The first and second correction units located between the deposition source and the treatment object. The first and second correction units are disposed on outer regions of the deposition source and face each other. Each of the first and second correction units rotates to control the thickness of a layer formed by the deposition material deposited on the treatment object.

Abstract: The present invention discloses an electrostatic chuck sucking and supporting a substrate with an electrostatic force and an OLED manufacturing apparatus having the same. The electrostatic chuck includes an insulating plate having at least one opening penetrating a center thereof, a pair of electrodes mounted on the insulating plate, a first controller applying a voltage to the pair of electrodes, and an electrostatic charge removing unit disposed near the insulating plate and emitting ions into the at least one opening to remove electrostatic charges distributed around a side of the insulating plate.