Patents by Inventor You-seop Lee

You-seop Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040145621
    Abstract: A method of expelling a fluid includes filling a nozzle with a fluid using a capillary force, generating an ion wind by ionizing air near an outlet of the nozzle, and expelling the fluid from the nozzle as the ion wind decreases a pressure around the outlet of the nozzle. An ink-jet printhead utilizing the method includes a manifold formed in a passageway plate to supply ink, a nozzle to be supplied with ink formed in a nozzle plate provided on the passageway plate, and a ground electrode and a source electrode arranged near an outlet of the nozzle, the ground electrode and the source electrode forming an electric field due to an application of a voltage thereto and ionizing air near the outlet of the nozzle to produce an ion wind to decrease a pressure near the outlet of the nozzle to expel the ink contained in the nozzle.
    Type: Application
    Filed: January 15, 2004
    Publication date: July 29, 2004
    Inventors: You-seop Lee, Yong-soo Oh, Seung-joo Shin
  • Publication number: 20040075707
    Abstract: A monolithic ink-jet printhead includes a substrate having an ink chamber to be supplied with ink to be ejected on a front surface thereof, a manifold for supplying ink to the ink chamber on a rear surface thereof, and an ink channel in communication with the ink chamber and the manifold, a nozzle plate including a plurality of passivation layers stacked on the substrate and a heat dissipating layer overlying the passivation layers, the nozzle plate having a nozzle penetrating the nozzle plate, a heater formed between adjacent passivation layers and located above the ink chamber for heating the ink to be supplied within the ink chamber, and a conductor provided between adjacent passivation layers, the conductor being electrically connected to the heater for applying current across the heater, wherein the heat dissipating layer is made of a thermally conductive metal for dissipating heat from the heater.
    Type: Application
    Filed: October 14, 2003
    Publication date: April 22, 2004
    Inventors: Su-Ho Shin, Yong-Soo Oh, Keon Kuk, Hyung-Taek Lim, Chang-Seung Lee, Seung-Ju Shin, Min-Soo Kim, You-Seop Lee