Abstract: A non-mechanical fluid level sensor based on light communication channel (LCC) technology. In a preferred embodiment, one end of the LCC is connected to a signal source while another end is connected to a sensor. The LCC is dipped in a fluid container and a signal propagates and undergoes internal reflection through the LCC towards one of its ends which is connected to the sensor. The fluid level is detected preferably by measuring the intensity of the signal reflected with the LCC that reaches a sensor. Different fluid levels preferably correspond to linearly varying detected signal intensities. A main LCC bus may communicate remotely with the sensor without wiring or other electrical connectors.

Abstract: A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge 92, 178.

Abstract: A method to solder flex circuits by diode laser. First and second flex circuits composed of polymer flex substrate are provided. Each flex circuit has a top and a bottom side and at least one contact trace embedded in its surface. An area of solder is provided on the contact trace of at least one of the flex circuits and the flex circuits are positioned so that the contact traces of each flex circuit are substantially aligned. A laser beam is positioned to heat the contact trace to melt the solder and fuse the contacts.

Abstract: A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge 92, 178.

Abstract: A multi-layer circuit board with heat pipes and a method forming a multi-layer circuit board with heat pipes is disclosed. The circuit board includes a heat pump which communicates with the heat pipe to circulate an amount of cooling material within the heat pipe effective to efficiently dissipate heat from the circuit board.

Abstract: A multi-layer circuit board with heat pipes and a method for forming a multi-layer circuit board with heat pipes is disclosed. The method includes forming channels in a first and second pre-circuit assembly and attaching the first pre-circuit assembly to the second pre-circuit assembly such that the channels cooperatively form a heat pipe.

Abstract: This invention relates generally to the development of and a method of fabricating a fiber optic micro-light source and sensor (50). An optical fiber micro-light source (50) is presented whose aperture is extremely small yet able to act as an intense light source. Light sources of this type have wide ranging applications, including use as micro-sensors (22) in NSOM. Micro-sensor light sources have excellent detection limits as well as photo stability, reversibility, and millisecond response times. Furthermore, a method for manufacturing a micro optical fiber light source is provided. It involves the photo-chemical attachment of an optically active material onto the end surface of an optical fiber cable which has been pulled to form an end with an extremely narrow aperture. More specifically, photopolymerization has been applied as a means to photo-chemically attach an optically active material (60). This process allows significant control of the size of the micro light source (50).

Abstract: This invention relates generally to the development of and a method of fabricating a micro optical fiber light source. An optical fiber micro-light source is presented whose aperture is extremely small yet able to act as an intense light source. Light sources of this type have wide ranging applications, including use as micro-sensors in NSOM. Micro-sensor light sources have excellent detection limits as well as photo stability, reversibility, and millisecond response times. Furthermore, a method for manufacturing a micro optical fiber light source is provided. It involves the photo-chemical attachment of an optically active material onto the end surface of an optical fiber cable which has been pulled to form an end with an extremely narrow aperture. More specifically, photopolymerization has been applied as a means to photo-chemically attach an optically active material. This process allows significant control of the size of the micro light source.