Patents by Inventor You Shimazaki

You Shimazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device fabricating apparatus and semiconductor device fabricating method
    Patent number: 7365441
    Abstract: A semiconductor device fabricating method comprises a substrate forming step of forming a plurality of separate conductive pads 20 on an adhesive layer included in an adhesive sheet 50, and a semiconductor chip mounting step of bonding semiconductor chips to the adhesive sheet 50 with surfaces thereof not provided with any electrodes in contact with the adhesive sheet 50, and electrically connecting electrodes 11 formed on the semiconductor chips 10 and upper parts of the conductive pads 20 with wires 30. The semiconductor chips 10, the wires 30 and the conductive pads 20 are sealed in a sealing resin molding 40, and then the adhesive sheet 50 is separated from the sealing resin molding 40. Each of the conductive pads 20 has a reduced part 20b, and a jutting part 20a jutting out from the reduced part 20b. The conductive pads 20 having such construction can be firmly bonded to the sealing resin molding 40.
    Type: Grant
    Filed: February 28, 2006
    Date of Patent: April 29, 2008
    Assignees: Dai Nippon Printing Co., Ltd., Nitto Denko Corporation
    Inventors: Chikao Ikenaga, You Shimazaki, Masachika Masuda, Kazuhito Hosokawa, Takuji Okeyui, Keisuke Yoshikawa, Kazuhiro Ikemura
  • Semiconductor device fabricating apparatus and semiconductor device fabricating method
    Publication number: 20060145363
    Abstract: A semiconductor device fabricating method comprises a substrate forming step of forming a plurality of separate conductive pads 20 on an adhesive layer included in an adhesive sheet 50, and a semiconductor chip mounting step of bonding semiconductor chips to the adhesive sheet 50 with surfaces thereof not provided with any electrodes in contact with the adhesive sheet 50, and electrically connecting electrodes 11 formed on the semiconductor chips 10 and upper parts of the conductive pads 20 with wires 30. The semiconductor chips 10, the wires 30 and the conductive pads 20 are sealed in a sealing resin molding 40, and then the adhesive sheet 50 is separated from the sealing resin molding 40. Each of the conductive pads 20 has a reduced part 20b, and a jutting part 20a jutting out from the reduced part 20b. The conductive pads 20 having such construction can be firmly bonded to the sealing resin molding 40.
    Type: Application
    Filed: February 28, 2006
    Publication date: July 6, 2006
    Applicants: DAI NIPPON PRINTING CO., LTD., NITTO DENKO CORPORATION
    Inventors: Chikao Ikenaga, You Shimazaki, Masachika Masuda, Kazuhito Hosokawa, Takuji Okeyui, Keisuke Yoshikawa, Kazuhiro Ikemura
  • Semiconductor device fabricating apparatus and semiconductor device fabricating method
    Patent number: 7064011
    Abstract: A semiconductor device fabricating method comprises a substrate forming step of forming a plurality of separate conductive pads 20 on an adhesive layer included in an adhesive sheet 50, and a semiconductor chip mounting step of bonding semiconductor chips to the adhesive sheet 50 with surfaces thereof not provided with any electrodes in contact with the adhesive sheet 50, and electrically connecting electrodes 11 formed on the semiconductor chips 10 and upper parts of the conductive pads 20 with wires 30. The semiconductor chips 10, the wires 30 and the conductive pads 20 are sealed in a sealing resin molding 40, and then the adhesive sheet 50 is separated from the sealing resin molding 40. Each of the conductive pads 20 has a reduced part 20b, and a jutting part 20a jutting out from the reduced part 20b. The conductive pads 20 having such construction can be firmly bonded to the sealing resin molding 40.
    Type: Grant
    Filed: February 20, 2004
    Date of Patent: June 20, 2006
    Assignees: Dai Nippon Printing Co., Ltd., Nitto Denko Corporation
    Inventors: Chikao Ikenaga, You Shimazaki, Masachika Masuda, Kazuhito Hosokawa, Takuji Okeyui, Keisuke Yoshikawa, Kazuhiro Ikemura
  • Semiconductor device fabricating apparatus and semiconductor device fabricating method
    Publication number: 20040164387
    Abstract: A semiconductor device fabricating method comprises a substrate forming step of forming a plurality of separate conductive pads 20 on an adhesive layer included in an adhesive sheet 50, and a semiconductor chip mounting step of bonding semiconductor chips to the adhesive sheet 50 with surfaces thereof not provided with any electrodes in contact with the adhesive sheet 50, and electrically connecting electrodes 11 formed on the semiconductor chips 10 and upper parts of the conductive pads 20 with wires 30. The semiconductor chips 10, the wires 30 and the conductive pads 20 are sealed in a sealing resin molding 40, and then the adhesive sheet 50 is separated from the sealing resin molding 40. Each of the conductive pads 20 has a reduced part 20b, and a jutting part 20a jutting out from the reduced part 20b. The conductive pads 20 having such construction can be firmly bonded to the sealing resin molding 40.
    Type: Application
    Filed: February 20, 2004
    Publication date: August 26, 2004
    Applicants: Dai Nippon Printing Co., Ltd., Nitto Denko Corporation
    Inventors: Chikao Ikenaga, You Shimazaki, Masachika Masuda, Kazuhito Hosokawa, Takuji Okeyui, Keisuke Yoshikawa, Kazuhiro Ikemura