Patents by Inventor You Tang
You Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240066660Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation.Type: ApplicationFiled: November 9, 2023Publication date: February 29, 2024Inventors: Haosheng Wu, Hari Soundararajan, Jianshe Tang, Shou-Sung Chang, Brian J. Brown, Yen-Chu Yang, You Wang, Rajeev Bajaj
-
Patent number: 11256743Abstract: Methods, systems, apparatuses, and computer program products are provided for intermixing expressions with other types of data in input controls. A system includes a processor and a memory that stores program code configured to be executed by the processor. The program code comprises a step configuration interface configured to receive, via a same input control, an expression as a first segment and a different type of data from an expression as a second segment. The program code further comprises a logic generator configured to generate a serialized representation that includes a serialized version of the first segment and a serialized version of the second segment.Type: GrantFiled: January 11, 2018Date of Patent: February 22, 2022Assignee: MICROSOFT TECHNOLOGY LICENSING, LLCInventors: Stephen Siciliano, Charles W. Lamanna, You Tang, Nitish Kumar Meena, Jeffrey S. Hollan, Balasubramanian Shyamsundar, Priti Sambandam
-
Publication number: 20180285476Abstract: Methods, systems, apparatuses, and computer program products are provided for intermixing expressions with other types of data in input controls. A system includes a processor and a memory that stores program code configured to be executed by the processor. The program code comprises a step configuration interface configured to receive, via a same input control, an expression as a first segment and a different type of data from an expression as a second segment. The program code further comprises a logic generator configured to generate a serialized representation that includes a serialized version of the first segment and a serialized version of the second segment.Type: ApplicationFiled: January 11, 2018Publication date: October 4, 2018Inventors: Stephen Siciliano, Charles W. Lamanna, You Tang, Nitish Kumar Meena, Jeffrey S. Hollan, Balasubramanian Shyamsundar, Priti Sambandam
-
Publication number: 20170311439Abstract: A printed circuit board including a series-wound inductor and two capacitors to reduce the susceptibility of a printed circuit board to simultaneous switching noise includes a ground layer; a power layer defining a slot loop to isolate a metal plate within, and a via hole coupled between the metal plate and the ground layer. An electronic device with the printed circuit board is also disclosed.Type: ApplicationFiled: June 24, 2016Publication date: October 26, 2017Inventor: SHAO-YOU TANG
-
Publication number: 20150329919Abstract: Provided is a method of selecting a patient diagnosed with HCC as a candidate for IFN-? therapy, by detecting the level of microRNA-26 expression in a sample obtained from the patient.Type: ApplicationFiled: August 4, 2015Publication date: November 19, 2015Applicants: THE OHIO STATE UNIVERSITY, FUDAN UNIVERSITY, The Government of the United States of America as represented by the Secretary of the Department ofInventors: Xin W. Wang, Junfang Ji, Carlo M. Croce, Hui-Chuan Sun, Zhao-You Tang
-
Patent number: 9173283Abstract: A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bounded by the first bonding pad, and a second signal via in a central portion of a space bounded by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground via are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots.Type: GrantFiled: December 18, 2013Date of Patent: October 27, 2015Assignee: ShenZhen Goldsun Network Intelligence Technology Co., Ltd.Inventors: Shao-You Tang, Po-Chuan Hsieh
-
Patent number: 9148947Abstract: An EBG (electromagnetic bandgap) device with a stacked structure includes a first ground plane, a first power plane, a via, a second power plane, a second ground plane; a third power plane, and several ground vias. The first ground plane, the second power plane, and the second ground plane are connected through the several ground vias. The ground vias and the second power plane do not have actually electrical connection. The first ground plane, the first power plane, the second power plane, and the via form a first EBG structure and the first ground plane, the second ground plane, the third power plane and the several ground vias form a second EBG structure.Type: GrantFiled: August 21, 2013Date of Patent: September 29, 2015Assignee: ShenZhen Treasure City Technology Co., LTD.Inventor: Shao-You Tang
-
Patent number: 9125923Abstract: It is disclosed herein that expression of microRNA-26 is decreased in hepatocellular (HCC) tumor tissue relative to non-cancerous tissue, and that a low level of microRNA-26 is associated with a poor clinical outcome. It is also disclosed herein that a low expression level of microRNA-26 is correlated with a favorable response to interferon (IFN)-? therapy in HCC patients. Thus, provided herein is a method of predicting the clinical outcome of a patient diagnosed with HCC comprising detecting the level of microRNA-26 expression in a sample obtained from the patient. Also provided is a method of selecting a patient diagnosed with HCC as a candidate for IFN-? therapy, comprising detecting the level of microRNA-26 expression in a sample obtained from the patient. A method of identifying therapeutic agents for the treatment of HCC, comprising screening candidate agents in vitro to select an agent that increases expression of microRNA-26 in HCC cells are also provided.Type: GrantFiled: June 11, 2009Date of Patent: September 8, 2015Assignees: The Ohio State University, Fudan University, The United States of America as Represented by the Secretary of the Dept. of Health and Human ServicesInventors: Xin W. Wang, Junfang Ji, Carlo M. Croce, Hui-chuan Sun, Zhao-you Tang
-
Publication number: 20150041207Abstract: A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bound by the first bonding pad, and a second signal via in a central portion of a space bound by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground vias are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots.Type: ApplicationFiled: April 17, 2014Publication date: February 12, 2015Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: SHAO-YOU TANG, PO-CHUAN HSIEH
-
Publication number: 20140337704Abstract: A system and a method for converting between data formats converts air flow data from a thermal simulation tool into a format readable by a DC power analyzing tool. Air flow data associated with the locations of certain points on a printed circuit board are taken and an EXCEL document including Main, Data, and Final worksheets is created. The data to be converted is obtained, and the data imported into the Data worksheet. Parameters in the Main worksheet to set an analysis area of the printed circuit board are set, and air flow data associated with the analysis areas from the Data worksheet are obtained and divided into groups, according to the parameters set in the Main worksheet. An equivalence value for each group of data is calculated and the equivalence values are saved in the Final worksheet for reading by the DC power analyzing tool.Type: ApplicationFiled: May 9, 2014Publication date: November 13, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: SHAO-YOU TANG, PO-CHUAN HSIEH, WEI-CHIEH CHOU
-
Publication number: 20140291007Abstract: An EBG (electromagnetic bandgap) device with a stacked structure includes a first ground plane, a first power plane, a via, a second power plane, a second ground plane; a third power plane, and several ground vias. The first ground plane, the second power plane, and the second ground plane are connected through the several ground vias. The ground vias and the second power plane do not have actually electrical connection. The first ground plane, the first power plane, the second power plane, and the via form a first EBG structure and the first ground plane, the second ground plane, the third power plane and the several ground vias form a second EBG structure.Type: ApplicationFiled: August 21, 2013Publication date: October 2, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: SHAO-YOU TANG
-
Publication number: 20140209369Abstract: A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bound by the first bonding pad, and a second signal via in a central portion of a space bound by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground via are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots.Type: ApplicationFiled: January 16, 2014Publication date: July 31, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: SHAO-YOU TANG, PO-CHUAN HSIEH
-
Publication number: 20140182893Abstract: A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bounded by the first bonding pad, and a second signal via in a central portion of a space bounded by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground via are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots.Type: ApplicationFiled: December 18, 2013Publication date: July 3, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: SHAO-YOU TANG, PO-CHUAN HSIEH
-
Publication number: 20140153200Abstract: A printed circuit board includes a ground layer, a metal board, a via, and a power layer. The metal board is arranged between the ground layer and the power layer. The via is electrically connected between the metal board and the power layer. The power layer is made of a number of wires.Type: ApplicationFiled: November 22, 2013Publication date: June 5, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: SHAO-YOU TANG
-
Publication number: 20120329672Abstract: Provided herein are microarrays, kits, methods and compositions for the diagnosis, prognosis and treatment of Hepatocellular carcinoma (HCC). Also provided are methods of identifying anti-HCC agents.Type: ApplicationFiled: August 27, 2012Publication date: December 27, 2012Inventors: Carlo M. Croce, Xin W. Wang, Anuradha Budhu, Zhao-you Tang
-
Patent number: 8252538Abstract: Provided herein are methods and compositions for the diagnosis, prognosis and treatment of Hepatocellular carcinoma (HCC). Also provided are methods of identifying anti-HCC agents.Type: GrantFiled: November 1, 2007Date of Patent: August 28, 2012Assignees: The Ohio State University, The United States of America as represented by the Secretary of the Department of Health and Human Services National Institute of Health, Office of Technology Transfer, Liver Cancer Institute and Zhongshan Hospital, Fudan UniversityInventors: Carlo M. Croce, Xin W. Wang, Anuradha Budhu, Zhao-you Tang
-
Publication number: 20110124521Abstract: It is disclosed herein that expression of microRNA-26 is decreased in hepatocellular (HCC) tumor tissue relative to non-cancerous tissue, and that a low level of microRNA-26 is associated with a poor clinical outcome. It is also disclosed herein that a low expression level of microRNA-26 is correlated with a favorable response to interferon (IFN)-? therapy in HCC patients. Thus, provided herein is a method of predicting the clinical outcome of a patient diagnosed with HCC comprising detecting the level of microRNA-26 expression in a sample obtained from the patient. Also provided is a method of selecting a patient diagnosed with HCC as a candidate for IFN-? therapy, comprising detecting the level of microRNA-26 expression in a sample obtained from the patient. A method of identifying therapeutic agents for the treatment of HCC, comprising screening candidate agents in vitro to select an agent that increases expression of microRNA-26 in HCC cells are also provided.Type: ApplicationFiled: June 11, 2009Publication date: May 26, 2011Applicants: THE OHIO STATE UNIVERSITY, FUDAN UNIVERSITY, OF HEALTH AND HUMAN SERVICESInventors: Xin W. Wang, Junfang Ji, Carlo M. Croce, Hui-Chuan Sun, Zhao-you Tang
-
Publication number: 20100120898Abstract: Provided herein are methods and compositions for the diagnosis, prognosis and treatment of Hepatocellular carcinoma (HCC). Also provided are methods of identifying anti-HCC agents.Type: ApplicationFiled: November 1, 2007Publication date: May 13, 2010Applicants: The Ohio State University Research Foundation, Department of Health and Human ServicesInventors: Carlo M. Croce, Xin W. Wang, Anuradha Budhu, Zhao-you Tang
-
Patent number: 6380195Abstract: A composition for preventing and/or treating heart failure and ventricular dysfunction in a warm blooded animal comprising a therapeutically effective amount of an endothelin antagonist of the formula: is disclosedType: GrantFiled: February 22, 2000Date of Patent: April 30, 2002Assignee: Banyu Pharmaceutical Co., Ltd.Inventors: Joseph J. Lynch, Jr., You-Tang Shen
-
Patent number: 6158438Abstract: A method of chronically instrumenting an animal enabling one to simulate congestive heart failure. This invention also relates to method for assessing the effects of a test compound on cardiac function and systemic vascular dynamics.Type: GrantFiled: February 4, 1999Date of Patent: December 12, 2000Assignee: Merck & Co., Inc.Inventor: You-Tang Shen