Abstract: Disclosed herein are mixed oxide compositions containing mixed oxides of cerium, zirconium, and a mixture of iron and strontium. These compositions optionally also may contain additional rare earth dopants. These mixed oxide compositions surprisingly exhibit enhanced low temperature oxygen storage capacity (OSC), even after aging at elevated temperatures. These mixed oxide compositions importantly contain iron and strontium (as oxides) and this mixture of iron and strontium surprisingly provides the mixed oxide composition with improved OSC even after aging at elevated temperatures, in particular improved OSC at lower temperatures. The compositions may be used as catalytic carriers which may be used in gas exhaust purification catalysts.

Abstract: A chip packaging structure and a chip packaging method are provided. The chip packaging structure includes a first substrate, an image sensing chip, a supporting member, a second substrate, and an encapsulant. The image sensing chip is disposed on an upper surface of the first substrate, and the image sensing chip has an image sensing region. The supporting member is disposed on an upper surface of the image sensing chip and surrounds the image sensing region. The supporting member is formed by stacking microstructures with each other, so that the supporting member has pores. The second substrate is disposed on an upper surface of the supporting member, and the second substrate, the supporting member, and the image sensing chip define an air cavity. The encapsulant is attached to the upper surface of the first substrate and a side surface of the second substrate and filled into the pores.

Abstract: Various solutions for Internet of Things (IoT) signal transmission with respect to reader apparatus and an IoT device are described. A reader apparatus may transmit a message to an IoT device through an in-band frequency or a guard band frequency in a frequency spectrum for an orthogonal frequency division multiplexing (OFDM) signal. A start of the transmission is aligned with a boundary of an OFDM symbol of the OFDM signal. The reader apparatus may receive a backscattered IoT signal from the IoT device through the in-band frequency or the guard band frequency.

Abstract: Various solutions for on-off keying (OOK) signal generation with respect to reader apparatus and an Internet of Things (IoT) device are described. A reader apparatus may generate an OOK signal with a discrete Fourier transform spread orthogonal frequency division multiplexing (DFT-s-OFDM) waveform or with a cyclic prefix-OFDM (CP-OFDM) waveform. The reader apparatus may transmit the OOK signal to an IoT device.

Abstract: A method for transmitting a downlink (DL) frequency-domain aggregation physical layer protocol data unit (FD-A-PPDU), wherein the DL FD-A-PPDU at least comprises a first PPDU and a second PPDU, and the method includes: performing a frequency-domain (FD) mask coefficient setting operation upon at least one field comprised in the first PPDU and at least one field comprised in the second PPDU according to a frequency sub-block, in order to generate a masked FD-A-PPDU, wherein the at least one field comprised in the first PPDU corresponds to the at least one field comprised in the second PPDU; and transmitting the masked FD-A-PPDU.

Abstract: Various solutions for on-off keying (OOK) signal generation with respect to reader apparatus and an Internet of Things (IoT) device are described. A reader apparatus may generate an OOK signal with an orthogonal frequency-division multiplexing (OFDM) waveform, wherein a start of an OOK signal transmission is aligned with a boundary of a symbol of the OFDM waveform. The reader apparatus may transmit the OOK signal to an IoT device.

Abstract: A semiconductor package includes a carrier, a package module and a second package body. The package module is disposed on the carrier and includes a first substrate, a first electronic element, a first conductive wire and a first package body. The first substrate has a first electrical surface facing the carrier and a second electrical surface opposite to the first electrical surface. The first electronic element is disposed on the first electrical surface. The first conductive wire connects the electronic element with the first electrical surface of the first substrate. The first package body encapsulates the first electrical surface, the first electronic element and the first solder wire. The second package body encapsulates the package module and a portion of the carrier.

Abstract: Various schemes pertaining to coordinated time-division multiple-access (C-TDMA) protocols, transmission opportunity (TXOP) sharing modes for time allocation, and exchange of parameters in multi-access point (multi-AP) systems are described. An apparatus (e.g., a sharing access point (AP)) acquires a TXOP. The apparatus also triggers one or more shared APs to participate in C-TDMA communications with respectively associated stations (STAs) within the TXOP.

Abstract: A semiconductor package includes a die attach pad; a plurality of lead terminals disposed around the die attach pad; a semiconductor die mounted on the die attach pad; a molding compound encapsulating the plurality of lead terminals, the semiconductor die, and the die attach pad; and a step cut sawn into the molding compound along a perimeter of a bottom surface of the semiconductor package. The step cut penetrates through an entire thickness of each of the plurality of lead terminals, whereby each of the plurality of lead terminals has at least an exposed outer end at the step cut.

Abstract: A Wi-Fi communication method includes: performing resource allocation for multi-user transmission orthogonal frequency division multiple access (OFDMA) according to a regulated frequency band boundary and a resource unit (RU) type, and sending information indicative of the resource allocation, where the RU type includes at least one of regular RU (rRU) and distributed-tone RU (dRU), the resource allocation indicates RUs or multiple RUs (MRUs) allocated in a channel, the channel is across the regulated frequency band boundary, and an RU or MRU allocated per user in the channel is not across the regulated frequency band boundary when using rRU.

Abstract: A laser processing device includes a laser source, a zoom assembly for converging a laser light emitted by the laser source, a scanning galvanometer assembly for receiving the converged laser light exiting from the zoom assembly and emitting the laser light at a preset angle, and a reflection assembly arranged between the scanning galvanometer assembly and a workpiece. The zoom assembly includes a plurality of lens groups, the reflection assembly includes a plurality of reflectors for reflecting the laser light emitted by the scanning galvanometer assembly to the workpiece. A distance between any two lens groups of the plurality of lens groups is adjustable to adjust a position of a principle plane of the zoom assembly, thereby adjusting a focus position reflected to the workpiece.

Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a station (STA). In certain configurations, the STA transmits a request-to-send (RTS) frame in an enhanced long range (ELR) format for obtaining a transmission opportunity (TXOP). The STA receives a first clear-to-send (CTS) frame in the ELR format or a non-ELR format responding to the RTS frame. In response to receiving the first CTS frame, the STA transmits data in the ELR format in the TXOP. In certain configurations, the STA further receives an acknowledgement in the same format as the first CTS frame for responding to the data being transmitted. In certain configurations, prior to transmitting the RTS frame, the STA transmits a CTS-to-Self frame in the non-ELR format.

Abstract: Disclosed herein are device and method for performing a total internal reflection scattering (TIRS) measurement to a sample slide. The device comprises a first reflective plate having a first opening; a second reflective plate having second and third openings and disposed on top of the first reflective plate thereby forming a slot therebetween for accommodating the sample slide, wherein the first opening of the first reflective plate is disposed directly underneath the second opening of the second reflective plate; a white light source disposed in the space formed by the third opening of the second reflective plate and configured to emit a white light into the slot; and a first blackout layer disposed on top of the third opening thereby covering the white light source and keeping the emitted white light from leaking. When the sample slide is inserted into the slot, the white light source illuminates the sample slide so as to achieve the TIRS measurement to the sample slide.

Abstract: Techniques pertaining to efficient and flexible frequency domain (FD) aggregated physical-layer protocol data unit (FD-A-PPDU) with the same and/or mixed WiFi generations transmission are described. An apparatus (e.g., a station (STA)) performs a wireless communication by: (i) transmitting a FD-A-PPDU or (ii) receiving the FD-A-PPDU. The wireless communication is performed in a 160 MHz, 240 MHz, 320 MHz, 480 MHz or 640 MHz bandwidth with 80 MHz being a minimum size of each of multiple PPDUs of the FD-A-PPDU. The FD-A-PPDU may be a 160 MHz, 240 MHz, 320 MHz, 480 MHz or 640 MHz FD-A-PPDU. The FD-A-PPDU may include PPDUs having a same PPDU format or different PPDU formats of different WiFi generations and utilizing a minimum size of 80 MHz non-overlapping frequency subblocks as a base building block.

Abstract: A multi-antenna system for harvesting energy and transmitting data includes an energy storing unit, antenna transmission units, and a load unit. Each antenna transmission unit includes an antenna module, a splitting module, an energy generation module, and a data processing module. The splitting module splits a wireless signal received by the antenna module into a first splitting signal and a second splitting signal and transmits the first splitting signal to an energy generation module to convert the first splitting signal into electrical energy stored in an energy storing unit and provided to the data processing module. The energy storing unit provides the electrical energy for the load unit. The data processing module receives one of the second splitting signals, converts it into a control signal, and transmits the control signal to the load unit. The load unit operates according to the control signal.

Abstract: A chip packaging structure and a chip packaging method are provided. The chip packaging structure includes a first substrate, an image sensing chip, a supporting member, a second substrate, and an encapsulant. The image sensing chip is disposed on an upper surface of the first substrate, and the image sensing chip has an image sensing region. The supporting member is disposed on an upper surface of the image sensing chip and surrounds the image sensing region. The supporting member is formed by stacking microstructures with each other, so that the supporting member has pores. The second substrate is disposed on an upper surface of the supporting member, and the second substrate, the supporting member, and the image sensing chip define an air cavity. The encapsulant is attached to the upper surface of the first substrate and a side surface of the second substrate and filled into the pores.

Abstract: Techniques pertaining to enhanced long range (ELR) waveform structures and signal (SIG) subfield in wireless communications are described. An apparatus (e.g., a station (STA)) performs an ELR wireless communication by: (i) transmitting an ELR physical-layer protocol data unit (PPDU); or (ii) receiving the ELR PPDU. The ELR PPDU includes a waveform structure with backward and forward compatibilities with different generations of Wi-Fi standards.

Abstract: A package substrate and a method for fabricating a chip assembly are provided. The method includes: providing a substrate, which has an upper substrate surface and a lower substrate surface, the upper substrate surface is divided into a plurality of scribe line regions that define a plurality of die-bonding regions, and any adjacent two of the die-bonding regions are separated by the scribe line regions. The die-bonding region is provided with a substrate conductor and a core material body, the substrate conductor penetrates the substrate and has upper and lower conductive ends exposed on the upper and lower substrate surfaces, respectively, and the core material body is disposed adjacent to the substrate conductor in the substrate. The method further includes: fixing chips in the die-bonding regions, respectively; and performing a dicing process along a plurality of scribe lines defined by the scribe line regions to form chip assemblies.

Abstract: A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a sensor chip and a package cover. The substrate has first and second substrate surfaces that are opposite to each other. The sensing chip is disposed on the first substrate surface and has a sensing area. The package cover includes a molding layer, a supporting layer and a light-transmitting layer. The molding layer surrounds the sensing area and is disposed on the first board surface. The supporting layer surrounds the sensing area and is disposed on the molding layer. The light-transmitting layer is disposed on the supporting layer and covers the substrate, the sensor chip, the molding layer and the supporting layer. The light-transmitting layer, the supporting layer, and the molding layer are formed to surround an enclosed space, and the sensing area is located in the enclosed space.

Abstract: Disclosed herein are device and method for performing a total internal reflection scattering (TIRS) measurement to a sample slide. The device comprises a first reflective plate having a first opening; a second reflective plate having second and third openings and disposed on top of the first reflective plate thereby forming a slot therebetween for accommodating the sample slide, wherein the first opening of the first reflective plate is disposed directly underneath the second opening of the second reflective plate; a white light source disposed in the space formed by the third opening of the second reflective plate and configured to emit a white light into the slot; and a first blackout layer disposed on top of the third opening thereby covering the white light source and keeping the emitted white light from leaking. When the sample slide is inserted into the slot, the white light source illuminates the sample slide so as to achieve the TIRS measurement to the sample slide.