Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a station (STA). In certain configurations, the STA transmits a request-to-send (RTS) frame in an enhanced long range (ELR) format for obtaining a transmission opportunity (TXOP). The STA receives a first clear-to-send (CTS) frame in the ELR format or a non-ELR format responding to the RTS frame. In response to receiving the first CTS frame, the STA transmits data in the ELR format in the TXOP. In certain configurations, the STA further receives an acknowledgement in the same format as the first CTS frame for responding to the data being transmitted. In certain configurations, prior to transmitting the RTS frame, the STA transmits a CTS-to-Self frame in the non-ELR format.

Abstract: A wafer cleaning method for cleaning contaminants on a wafer is provided, wherein the backside of the wafer has a clear area and an unclear area, and the contaminants are located in the unclear area. The wafer cleaning method includes inspecting the backside of the wafer and generating an inspection signal by an inspection device. The wafer cleaning method includes generating a control signal according to the inspection signal by a process module, wherein the control signal includes movement information of a brush element according to coordinates of the contaminants obtained from the inspection signal. The wafer cleaning method includes controlling the brush element to clean the contaminants on the backside of the wafer according to the control signal by a control device along a predetermined path.

Abstract: A wafer cleaning system and method are provided. A brush element is configured to clean a backside of the wafer. The backside has a clear area and an unclear area, and some contaminants are located in the unclear area. A control device performs a first cleaning process to the brush element when the brush element is located at the clear area, and the control device performs a second cleaning process when the brush element is located at the unclear area. The contaminants are cleaned by an enhanced cleaning process. Since the contaminants are cleaned, the backside of the wafer is flatter, and quality of the exposed photoresist on the wafer is improved.

Abstract: A wafer cleaning system and method are provided. A brush element is configured to clean a backside of the wafer. The backside has a clear area and an unclear area, and some contaminants are located in the unclear area. A control device performs a first cleaning process to the brush element when the brush element is located at the clear area, and the control device performs a second cleaning process when the brush element is located at the unclear area. The contaminants are cleaned by an enhanced cleaning process. Since the contaminants are cleaned, the backside of the wafer is flatter, and quality of the exposed photoresist on the wafer is improved.

Abstract: Embodiments of a wafer cleaning system and method are provided. A brush element is configured to clean a backside of the wafer. The backside has a clear area and an unclear area, and some contaminants are located in the unclear area. A control device performs a first cleaning process to the brush element when the brush element is located at the clear area, and the control device performs a second cleaning process when the brush element is located at the unclear area. The contaminants are cleaned by an enhanced cleaning process. Since the contaminants are cleaned, the backside of the wafer is flatter, and quality of the exposed photoresist on the wafer is improved.

Abstract: Embodiments of a photoresist supply system including a photoresist nozzle device are provided. The photoresist nozzle device includes a tube including a first segment, a curved segment connected to the first segment, and a second segment connected to the curved segment. The photoresist nozzle device also includes a nozzle connected to the second segment.

Abstract: A cup-wash device is provided. The cup-wash device includes a supporting disk and a base disposed on the supporting disk. The base includes a catchment groove, a first dispensing opening formed on an edge of the base, and a first channel connected with the catchment groove and the first dispensing opening. The cup-wash device also includes a cover disposed on the base and covering the first channel, and the cover has an injection opening connected to the catchment groove.

Abstract: Embodiments of mechanisms for processing a wafer are provided. A method for processing a wafer includes placing the wafer into a processing assembly and heating the wafer. The method also includes producing an exhaust flow from the processing assembly via a fluid-conduit assembly. The method further includes detecting an exhaust pressure of the exhaust flow in the fluid-conduit assembly and producing a first signal and a second signal corresponding to the exhaust pressure. In addition, the method includes regulating the exhaust flow in response to the first signal and controlling the processing assembly in response to the second signal.

Abstract: A cup-wash device is provided. The cup-wash device includes a supporting disk and a base disposed on the supporting disk. The base includes a catchment groove, a first dispensing opening formed on an edge of the base, and a first channel connected with the catchment groove and the first dispensing opening. The cup-wash device also includes a cover disposed on the base and covering the first channel, and the cover has an injection opening connected to the catchment groove.

Abstract: Embodiments of a wafer cleaning system and method are provided. A brush element is configured to clean a backside of the wafer. The backside has a clear area and an unclear area, and some contaminants are located in the unclear area. A control device performs a first cleaning process to the brush element when the brush element is located at the clear area, and the control device performs a second cleaning process when the brush element is located at the unclear area. The contaminants are cleaned by an enhanced cleaning process. Since the contaminants are cleaned, the backside of the wafer is flatter, and quality of the exposed photoresist on the wafer is improved.

Abstract: Embodiments of mechanisms for processing a wafer are provided. A method for processing a wafer includes placing the wafer into a processing assembly and heating the wafer. The method also includes producing an exhaust flow from the processing assembly via a fluid-conduit assembly. The method further includes detecting an exhaust pressure of the exhaust flow in the fluid-conduit assembly and producing a first signal and a second signal corresponding to the exhaust pressure. In addition, the method includes regulating the exhaust flow in response to the first signal and controlling the processing assembly in response to the second signal.

Abstract: Embodiments of a photoresist supply system including a photoresist nozzle device are provided. The photoresist nozzle device includes a tube including a first segment, a curved segment connected to the first segment, and a second segment connected to the curved segment. The photoresist nozzle device also includes a nozzle connected to the second segment.