Patents by Inventor Youhei AIKOU

Youhei AIKOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic module
    Patent number: 10168499
    Abstract: In an electronic module 30, a groove 3 is disposed in a single side surface A of an electronic device 20 that faces an outer principal surface 33 of a circuit board 31. In the groove 3, an end portion of a mounting electrode 2 near a joining body 21 is located further toward an insulating substrate 1 than an end portion 3 of the groove 3 near the joining body 21. A fillet F of a joining material 41 is disposed in a region of the groove 3 near the joining body 21. Owing to the fillet F, the reliability of connection between the electronic device 20 and the circuit board 31 can be increased.
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: January 1, 2019
    Assignee: KYOCERA CORPORATION
    Inventor: Youhei Aikou
  • ELECTRONIC MODULE
    Publication number: 20170285281
    Abstract: In an electronic module 30, a groove 3 is disposed in a single side surface A of an electronic device 20 that faces an outer principal surface 33 of a circuit board 31. In the groove 3, an end portion of a mounting electrode 2 near a joining body 21 is located further toward an insulating substrate 1 than an end portion 3 of the groove 3 near the joining body 21. A fillet F of a joining material 41 is disposed in a region of the groove near the joining body 21. Owing to the fillet F, the reliability of connection between the electronic device 20 and the circuit board 31 can be increased.
    Type: Application
    Filed: September 3, 2015
    Publication date: October 5, 2017
    Applicant: KYOCERA Corporation
    Inventor: Youhei AIKOU