Patents by Inventor Youhei Inoue

Youhei Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10604629
    Abstract: A polyamide acid composition and a polyimide composition are obtained from a tetracarboxylic acid compound containing an aromatic tetracarboxylic acid compound having a naphthalene skeleton and a diamine compound containing an aromatic diamine compound having a biphenyl skeleton.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: March 31, 2020
    Assignee: JFE CHEMICAL CORPORATION
    Inventors: Youhei Inoue, Hiroaki Mori
  • Patent number: 10174165
    Abstract: There is provided a polyimide composition that is useful for electronic substrate materials, retains high heat resistance and mechanical strength intrinsic to polyimides, and has a lower dielectric constant and dielectric loss tangent. A polyimide composition for use in electronic substrate materials, containing a polyimide produced by polymerization between a diamine component containing 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindan and an acid component containing 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride.
    Type: Grant
    Filed: April 20, 2015
    Date of Patent: January 8, 2019
    Assignee: JFE CHEMICAL CORPORATION
    Inventors: Youhei Inoue, Hiroaki Mori
  • Publication number: 20180105648
    Abstract: A polyamide acid composition and a polyimide composition are obtained from a tetracarboxylic acid compound containing an aromatic tetracarboxylic acid compound having a naphthalene skeleton and a diamine compound containing an aromatic diamine compound having a biphenyl skeleton.
    Type: Application
    Filed: April 11, 2016
    Publication date: April 19, 2018
    Applicant: JFE CHEMICAL CORPORATION
    Inventors: Youhei INOUE, Hiroaki MORI
  • Publication number: 20170044321
    Abstract: There is provided a polyimide composition that is useful for electronic substrate materials, retains high heat resistance and mechanical strength intrinsic to polyimides, and has a lower dielectric constant and dielectric loss tangent. A polyimide composition for use in electronic substrate materials, containing a polyimide produced by polymerization between a diamine component containing 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindan and an acid component containing 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride.
    Type: Application
    Filed: April 20, 2015
    Publication date: February 16, 2017
    Applicant: JFE CHEMICAL CORPORATION
    Inventors: Youhei INOUE, Hiroaki MORI
  • Publication number: 20130211040
    Abstract: A polyimide and a polyimide film obtained by reacting: an aromatic diamine, and 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride, pyromellitic acid dianhydride, p-phenylenediamine and 4,4?-diaminodiphenyl ether, the amount of the component (I) being 0.1 to 10.0 mol % and the amount of the components (II) being 99.9 to 90.0 mol % based on the total amount of the component (I) and the components (II) (in Formula (1), R1, R2, R3 and R4 are each independently selected from the group consisting of a hydrogen atom, a halogen atom, a nitrogen-containing group, a linear or branched alkyl group with 1 to 12 carbon atoms, a linear or branched alkenyl group with 2 to 12 carbon atoms, a linear or branched alkoxy group with 1 to 12 carbon atoms, a hydroxyl group, a nitrile group, a nitro group, a carboxyl group, a carbamoyl group and an aromatic group with 6 to 12 carbon atoms).
    Type: Application
    Filed: September 5, 2011
    Publication date: August 15, 2013
    Applicant: JFE CHEMICAL CORPORATION
    Inventors: Hiroaki Nakao, Youhei Inoue, Masanori Kobayashi