Patents by Inventor Youhei KISHIMOTO

Youhei KISHIMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate fixing apparatus and substrate working apparatus
    Patent number: 9668393
    Abstract: A substrate fixing apparatus includes a back-up member which is located between a pair of conveying members arranged at a distance from each other in a plan view and is below a film-like substrate conveyed along the conveyance path and supported from below by the pair of conveying members. An elevation driver moves at least one of a back-up member and a substrate pressing member upward and downward. The elevation driver elevates the back-up member and/or lowers the substrate pressing member together with the pair of conveying members, thereby separating the substrate upward from the pair of conveying members while supporting the substrate from below by the back-up member and pressing the surface of the outer peripheral part of the substrate downward by the substrate pressing member to correct warpage of the outer peripheral part of the substrate.
    Type: Grant
    Filed: February 5, 2014
    Date of Patent: May 30, 2017
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Youhei Kishimoto
  • SUBSTRATE FIXING APPARATUS, SUBSTRATE WORKING APPARATUS AND SUBSTRATE FIXING METHOD
    Publication number: 20140215813
    Abstract: A substrate fixing apparatus includes a back-up member which is located between a pair of conveying members arranged at a distance from each other in a plan view and is below a film-like substrate conveyed along the conveyance path and supported from below by the pair of conveying members. An elevation driver moves at least one of a back-up member and a substrate pressing member upward and downward. The elevation driver elevates the back-up member and/or lowers the substrate pressing member together with the pair of conveying members, thereby separating the substrate upward from the pair of conveying members while supporting the substrate from below by the back-up member and pressing the surface of the outer peripheral part of the substrate downward by the substrate pressing member to correct warpage of the outer peripheral part of the substrate.
    Type: Application
    Filed: February 5, 2014
    Publication date: August 7, 2014
    Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Youhei KISHIMOTO