Patents by Inventor Youhei Nagahama

Youhei Nagahama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a semiconductor using a rigid substrate
    Patent number: 7781259
    Abstract: In a method of manufacturing a semiconductor device of the invention, a rigid substrate which supports one or more semiconductor elements on a surface of the substrate and is clamped between an upper mold and a lower mold of an encapsulation mold at a time of resin encapsulation is provided, so that a vent-end edge portion of the substrate corresponding to a vent end of the encapsulation mold has a thickness smaller than a thickness of other portions of the substrate. The substrate is disposed in the encapsulation mold, and resin is injected into a cavity between the upper mold and the substrate to encapsulate the semiconductor elements with the resin.
    Type: Grant
    Filed: September 7, 2006
    Date of Patent: August 24, 2010
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Youhei Nagahama, Katsunori Wako, Yuichi Asano, Masanori Takahashi, Haruo Kojima, Masamichi Fujimoto, Hiroshi Ohtsubo, Yuki Yasuda
  • Semiconductor device and method for manufacturing the same
    Publication number: 20070010046
    Abstract: In a method of manufacturing a semiconductor device of the invention, a rigid substrate which supports one or more semiconductor elements on a surface of the substrate and is clamped between an upper mold and a lower mold of an encapsulation mold at a time of resin encapsulation is provided, so that a vent-end edge portion of the substrate corresponding to a vent end of the encapsulation mold has a thickness smaller than a thickness of other portions of the substrate. The substrate is disposed in the encapsulation mold, and resin is injected into a cavity between the upper mold and the substrate to encapsulate the semiconductor elements with the resin.
    Type: Application
    Filed: September 7, 2006
    Publication date: January 11, 2007
    Applicant: FUJITSU LIMITED
    Inventors: Youhei Nagahama, Katsunori Wako, Yuichi Asano, Masanori Takahashi, Haruo Kojima, Masamichi Fujimoto, Hiroshi Ohtsubo, Yuki Yasuda
  • Method of manufacturing a semiconductor device using a rigid substrate including the vent-end edge portion of the substrate has a thickness smaller than the other portions of the substrate
    Patent number: 7122402
    Abstract: In a method of manufacturing a semiconductor device of the invention, a rigid substrate which supports one or more semiconductor elements on a surface of the substrate and is clamped between an upper mold and a lower mold of an encapsulation mold at a time of resin encapsulation is provided, so that a vent-end edge portion of the substrate corresponding to a vent end of the encapsulation mold has a thickness smaller than a thickness of other portions of the substrate. The substrate is disposed in the encapsulation mold, and resin is injected into a cavity between the upper mold and the substrate to encapsulate the semiconductor elements with the resin.
    Type: Grant
    Filed: February 20, 2004
    Date of Patent: October 17, 2006
    Assignee: Fujitsu Limited
    Inventors: Youhei Nagahama, Katsunori Wako, Yuichi Asano, Masanori Takahashi, Haruo Kojima, Masamichi Fujimoto, Hiroshi Ohtsubo, Yuki Yasuda
  • Method of manufacturing a semiconductor device using a rigid substrate
    Publication number: 20050070051
    Abstract: In a method of manufacturing a semiconductor device of the invention, a rigid substrate which supports one or more semiconductor elements on a surface of the substrate and is clamped between an upper mold and a lower mold of an encapsulation mold at a time of resin encapsulation is provided, so that a vent-end edge portion of the substrate corresponding to a vent end of the encapsulation mold has a thickness smaller than a thickness of other portions of the substrate. The substrate is disposed in the encapsulation mold, and resin is injected into a cavity between the upper mold and the substrate to encapsulate the semiconductor elements with the resin.
    Type: Application
    Filed: February 20, 2004
    Publication date: March 31, 2005
    Applicant: FUJITSU LIMITED
    Inventors: Youhei Nagahama, Katsunori Wako, Yuichi Asano, Masanori Takahashi, Haruo Kojima, Masamichi Fujimoto, Hiroshi Ohtsubo, Yuki Yasuda