Abstract: The present invention provides a mask blank including: a transparent substrate, a half-transparent layer for controlling a phase and a transmittance of the exposure light, formed on the transparent substrate, a middle layer formed on the half-transparent layer, and a light-shielding layer formed on the middle layer, wherein the light-shielding layer is constituted with a single metal material not including a transition metal; a film thickness of the light-shielding layer is 40 nm or less; and an optical density of a laminated body, in which three kinds of layers: the half-transparent layer, the middle layer, and the light-shielding layer are laminated, with respect to the exposure light is a value to the extent that the laminated body functions as a light-shielding region or more; the mask blank is used for producing a half tone type phase shift mask, and suitable for a lithography technique on a wafer from 40 nm half pitch and on for its high light-shielding property even thinning the light-shielding pattern

Abstract: The present invention provides a mask blank used to produce a halftone phase shift mask to which ArF excimer laser exposure light is to be applied. The present invention attains the object by providing the mask blank comprising a transparent substrate, and a light semitransmissive layer formed on the transparent substrate and made only of Si and N or a light semitransmissive layer formed on the transparent substrate and made only of Si, N and O, wherein the light semitransmissive layer has an extinction coefficient of 0.2 to 0.45 at a wavelength of ArF excimer laser exposure light, a refractive index of 2.3 to 2.7 at the wavelength of ArF excimer laser exposure light, and a transmittance of 15 to 38% at the wavelength of ArF excimer laser exposure light, and further has a layer thickness of 57 to 67 nm.

Abstract: The present invention provides a mask blank including: a transparent substrate, a half-transparent layer for controlling a phase and a transmittance of the exposure light, formed on the transparent substrate, a middle layer formed on the half-transparent layer, and a light-shielding layer formed on the middle layer, wherein the light-shielding layer is constituted with a single metal material not including a transition metal; a film thickness of the light-shielding layer is 40 nm or less; and an optical density of a laminated body, in which three kinds of layers: the half-transparent layer, the middle layer, and the light-shielding layer are laminated, with respect to the exposure light is a value to the extent that the laminated body functions as a light-shielding region or more; the mask blank is used for producing a half tone type phase shift mask, and suitable for a lithography technique on a wafer from 40 nm half pitch and on for its high light-shielding property even thinning the light-shielding pattern

Abstract: The present invention provides a mask blank used to produce a halftone phase shift mask to which ArF excimer laser exposure light is to be applied. The present invention attains the object by providing the mask blank comprising a transparent substrate, and a light semitransmissive layer formed on the transparent substrate and made only of Si and N or a light semitransmissive layer formed on the transparent substrate and made only of Si, N and O, wherein the light semitransmissive layer has an extinction coefficient of 0.2 to 0.45 at a wavelength of ArF excimer laser exposure light, a refractive index of 2.3 to 2.7 at the wavelength of ArF excimer laser exposure light, and a transmittance of 15 to 38% at the wavelength of ArF excimer laser exposure light, and further has a layer thickness of 57 to 67 nm.