Patents by Inventor YOUHEI SECHI

YOUHEI SECHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11269130
    Abstract: A transparent resin composition includes a transparent resin and a light diffusing agent which has an average particle diameter of 220 nm or more and 300 nm or less, in which a content proportion of the light diffusing agent is more than 4.0 mass ppm and less than 20 mass ppm with respect to the total mass of the transparent resin composition.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: March 8, 2022
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Youhei Sechi, Tadayoshi Sawada, Takashi Ookubo
  • Publication number: 20210003768
    Abstract: A transparent resin composition includes a transparent resin and a light diffusing agent which has an average particle diameter of 220 nm or more and 300 nm or less, in which a content proportion of the light diffusing agent is more than 4.0 mass ppm and less than 20 mass ppm with respect to the total mass of the transparent resin composition.
    Type: Application
    Filed: September 4, 2020
    Publication date: January 7, 2021
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Youhei SECHI, Tadayoshi SAWADA, Takashi OOKUBO
  • Patent number: 9507077
    Abstract: A resin composition for a light guide article-preform is described, which enables the formation of a foamed layer having a large light scattering effect on the surface of a shaped article by laser irradiation processing at low cost. More specifically, the present invention relates to: a resin composition for a light guide article-preform, which contains a resin having a mass average molecular weight of 60,000 to 150,000, and has a 30% thermal mass reduction temperature of 310° C. or lower and a difference between a 40% thermal mass reduction temperature and a 20% thermal mass reduction temperature of 7° C. or less when a thermal mass measurement is performed with starting from the state at 100° C. under air at a temperature rising rate of 5° C./min.
    Type: Grant
    Filed: June 5, 2013
    Date of Patent: November 29, 2016
    Assignee: MITSUBISHI RAYON CO., LTD.
    Inventors: Fumiko Onuma, Minoru Shimizu, Kenji Yagi, Tomoyoshi Yamashita, Youhei Sechi, Yoshiya Kurachi, Shinji Saiki
  • Publication number: 20150338568
    Abstract: A resin composition for a light guide article-preform is described, which enables the formation of a foamed layer having a large light scattering effect on the surface of a shaped article by laser irradiation processing at low cost. More specifically, the present invention relates to: a resin composition for a light guide article-preform, which contains a resin having a mass average molecular weight of 60,000 to 150,000, and has a 30% thermal mass reduction temperature of 310° C. or lower and a difference between a 40% thermal mass reduction temperature and a 20% thermal mass reduction temperature of 7° C. or less when a thermal mass measurement is performed with starting from the state at 100° C. under air at a temperature rising rate of 5° C./min.
    Type: Application
    Filed: June 5, 2013
    Publication date: November 26, 2015
    Inventors: FUMIKO ONUMA, MINORU SHIMIZU, KENJI YAGI, TOMOYOSHI YAMASHITA, YOUHEI SECHI, YOSHIYA KURACHI, SHINJI SAIKI