Patents by Inventor Youhong Wu
Youhong Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240109895Abstract: An oxaspiro substituted pyrrolopyrazole derivative, an intermediate thereof, and a preparation method therefor.Type: ApplicationFiled: December 29, 2021Publication date: April 4, 2024Applicants: SHANGHAI HAIYAN PHARMACEUTICAL TECHNOLOGY CO., LTD., YANGTZE RIVER PHARMACEUTICAL GROUP CO., LTD.Inventors: Zhenya ZENG, Chao KAN, Qingfu GAO, Yixiao FENG, Bo WU, Xingsong ZHANG, Youhong MA, Kejun SUN
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Patent number: 11109481Abstract: A method for manufacturing a printed wiring board includes forming a base insulating layer, forming a conductor layer on the base layer, forming a solder resist layer on the base layer such that the resist layer covers the conductor layer, forming first opening exposing a first pad of the conductor layer, forming second opening exposing a second pad of the conductor layer and having diameter smaller than diameter of the first opening, forming a first bump on the first pad, and forming a second bump on the second pad such that the second bump has diameter smaller than diameter of the first bump. The first bump includes a first base plating layer and a first top plating layer, and the second bump includes a second base plating layer and a second top plating layer having upper surface higher than the uppermost position of upper surface of the first top layer.Type: GrantFiled: February 14, 2020Date of Patent: August 31, 2021Assignee: IBIDEN CO., LTD.Inventors: Youhong Wu, Koji Sato, Yoshihiro Kodera
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Patent number: 11083086Abstract: A printed wiring board includes a base insulating layer, a conductor layer including first and second pads, a solder resist layer covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, a first bump including base plating layer in the first opening and top plating layer on the first base layer, and a second bump including base plating layer in the second opening and top plating layer on the base layer. The second opening has smaller diameter than the first opening, and the second bump has smaller diameter than the first bump. The first base layer has flat upper surface or first recess having depth of 20 ?m or less in upper central portion. The second base layer has flat upper surface, raised portion in upper central portion, or second recess shallower than the first recess in the upper central portion.Type: GrantFiled: February 6, 2019Date of Patent: August 3, 2021Assignee: IBIDEN CO., LTD.Inventor: Youhong Wu
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Publication number: 20200266075Abstract: A method for manufacturing a printed wiring board includes forming a base insulating layer, forming a conductor layer on the base layer, forming a solder resist layer on the base layer such that the resist layer covers the conductor layer, forming first opening exposing a first pad of the conductor layer, forming second opening exposing a second pad of the conductor layer and having diameter smaller than diameter of the first opening, forming a first bump on the first pad, and forming a second bump on the second pad such that the second bump has diameter smaller than diameter of the first bump. The first bump includes a first base plating layer and a first top plating layer, and the second bump includes a second base plating layer and a second top plating layer having upper surface higher than the uppermost position of upper surface of the first top layer.Type: ApplicationFiled: February 14, 2020Publication date: August 20, 2020Applicant: IBIDEN CO., LTD.Inventors: Youhong WU, Koji Sato, Yoshihiro Kodera
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Publication number: 20190246496Abstract: A printed wiring board includes a base insulating layer, a conductor layer including first and second pads, a solder resist layer covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, a first bump including base plating layer in the first opening and top plating layer on the first base layer, and a second bump including base plating layer in the second opening and top plating layer on the base layer. The second opening has smaller diameter than the first opening, and the second bump has smaller diameter than the first bump. The first base layer has flat upper surface or first recess having depth of 20 ?m or less in upper central portion. The second base layer has flat upper surface, raised portion in upper central portion, or second recess shallower than the first recess in the upper central portion.Type: ApplicationFiled: February 6, 2019Publication date: August 8, 2019Applicant: IBIDEN CO., LTD.Inventor: Youhong WU
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Patent number: 9526168Abstract: A printed wiring board includes an inner conductive-circuit layer, an insulation layer structure including a first insulation layer laminated on inner conductive-circuit layer and a second insulation layer laminated on the first insulation layer, and an outermost conductive-circuit layer laminated on the insulation layer structure and including connection portions such that the connection portions are positioned to mount a component on the insulation layer structure. The second insulation layer is interposed between the first insulation layer and the outermost conductive-circuit layer and has a thickness which is smaller than a thickness of the first insulation layer such that an outer surface of the second insulation layer on an outermost conductive-circuit-layer side is flatter than an inner surface of the second insulation layer on a first insulation-layer side.Type: GrantFiled: May 22, 2015Date of Patent: December 20, 2016Assignee: IBIDEN CO., LTD.Inventor: Youhong Wu
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Publication number: 20150342039Abstract: A printed wiring board includes an inner conductive-circuit layer, an insulation layer structure including a first insulation layer laminated on inner conductive-circuit layer and a second insulation layer laminated on the first insulation layer, and an outermost conductive-circuit layer laminated on the insulation layer structure and including connection portions such that the connection portions are positioned to mount a component on the insulation layer structure. The second insulation layer is interposed between the first insulation layer and the outermost conductive-circuit layer and has a thickness which is smaller than a thickness of the first insulation layer such that an outer surface of the second insulation layer on an outermost conductive-circuit-layer side is flatter than an inner surface of the second insulation layer on a first insulation-layer side.Type: ApplicationFiled: May 22, 2015Publication date: November 26, 2015Applicant: IBIDEN CO., LTD.Inventor: Youhong WU
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Patent number: 8800143Abstract: A method of manufacturing a multi-layer printed wiring board including forming a core substrate, forming a first interlayer insulation layer over the core substrate, forming a first filled via in the first interlayer insulation layer, the first filled via having a bottom portion having a first diameter, forming a second interlayer insulation layer over the first interlayer insulation layer, and forming a second filled via in the second interlayer insulation layer, the second filled via having a bottom portion having a second diameter smaller than the first diameter.Type: GrantFiled: June 9, 2011Date of Patent: August 12, 2014Assignee: IBIDEN Co., Ltd.Inventor: Youhong Wu
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Patent number: 8367943Abstract: A multilayered printed wiring board has a core substrate having a through hole opening with a radius R, a through hole structure formed at the through hole opening and including a lid-shaped conductive structure, a first interlaminar resin insulation layer formed over the core substrate and having a first via hole structure with a bottom radius r, and a second interlaminar resin insulation layer formed over the first interlaminar resin insulation layer and having a second via hole structure. The lid-shaped conductive structure is formed over the core substrate at an end portion of the through-hole opening and covering the end portion of the through-hole opening. The first via hole structure is formed on the lid-shaped conductive structure and has an electroless plated film and an electrolytic plated film. The second via hole structure has an electroless plated film and an electrolytic plated film.Type: GrantFiled: July 31, 2007Date of Patent: February 5, 2013Assignee: IBIDEN Co., Ltd.Inventors: Youhong Wu, Masanori Tamaki
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Publication number: 20110232086Abstract: A method of manufacturing a multi-layer printed wiring board including forming a core substrate, forming a first interlayer insulation layer over the core substrate, forming a first filled via in the first interlayer insulation layer, the first filled via having a bottom portion having a first diameter, forming a second interlayer insulation layer over the first interlayer insulation layer, and forming a second filled via in the second interlayer insulation layer, the second filled via having a bottom portion having a second diameter smaller than the first diameter.Type: ApplicationFiled: June 9, 2011Publication date: September 29, 2011Applicant: IBIDEN CO., LTD.Inventor: Youhong Wu
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Patent number: 8003896Abstract: A multi-layer printed wiring board has a core substrate, a first interlayer insulation layer formed over the core substrate, a first filled via formed in the first interlayer insulation layer, a second interlayer insulation layer formed over the first interlayer insulation layer, and a second filled via formed in the second interlayer insulation layer. The first filled via has a bottom portion having a first diameter. The second filled via has a bottom portion having a second diameter smaller than the first diameter.Type: GrantFiled: August 2, 2007Date of Patent: August 23, 2011Assignee: IBIDEN Co., Ltd.Inventor: Youhong Wu
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Publication number: 20080314632Abstract: A multilayered printed wiring board has a core substrate having a through hole opening with a radius R, a through hole structure formed at the through hole opening and including a lid-shaped conductive structure, a first interlaminar resin insulation layer formed over the core substrate and having a first via hole structure with a bottom radius r, and a second interlaminar resin insulation layer formed over the first interlaminar resin insulation layer and having a second via hole structure. The lid-shaped conductive structure is formed over the core substrate at an end portion of the through-hole opening and covering the end portion of the through-hole opening. The first via hole structure is formed on the lid-shaped conductive structure and has an electroless plated film and an electrolytic plated film. The second via hole structure has an electroless plated film and an electrolytic plated film.Type: ApplicationFiled: July 31, 2007Publication date: December 25, 2008Applicant: IBIDEN CO., LTDInventors: Youhong WU, Masanori Tamaki
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Patent number: 7402760Abstract: A multi-layer printed wiring board has a core substrate, a throughhole structure, a first interlayer insulation layer, a first via, a second interlayer insulation layer and a second via. The core substrate has a throughhole opening, and the throughhole structure is formed in the throughhole opening. The first interlayer insulation layer is formed over the core substrate. The first via is formed in the first interlayer insulation layer and has a bottom portion having a first radius. The second interlayer insulation layer is formed over the first interlayer insulation layer and the first via. The second via is formed in the second interlayer insulation layer and has a bottom portion having a second radius greater than the first radius.Type: GrantFiled: August 2, 2007Date of Patent: July 22, 2008Assignee: IBIDEN Co., Ltd.Inventor: Youhong Wu
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Publication number: 20080060840Abstract: A multi-layer printed wiring board has a core substrate, a throughhole structure, a first interlayer insulation layer, a first via, a second interlayer insulation layer and a second via. The core substrate has a throughhole opening, and the throughhole structure is formed in the throughhole opening. The first interlayer insulation layer is formed over the core substrate. The first via is formed in the first interlayer insulation layer and has a bottom portion having a first radius. The second interlayer insulation layer is formed over the first interlayer insulation layer and the first via. The second via is formed in the second interlayer insulation layer and has a bottom portion having a second radius greater than the first radius.Type: ApplicationFiled: August 2, 2007Publication date: March 13, 2008Applicant: IBIDEN CO., LTDInventor: Youhong WU
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Publication number: 20080053693Abstract: A multi-layer printed wiring board has a core substrate, a first interlayer insulation layer formed over the core substrate, a first filled via formed in the first interlayer insulation layer, a second interlayer insulation layer formed over the first interlayer insulation layer, and a second filled via formed in the second interlayer insulation layer. The first filled via has a bottom portion having a first diameter. The second filled via has a bottom portion having a second diameter smaller than the first diameter.Type: ApplicationFiled: August 2, 2007Publication date: March 6, 2008Applicant: IBIDEN CO., LTDInventor: Youhong WU