Patents by Inventor Youich Kogure

Youich Kogure has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for sealedly forming envelope
    Patent number: 5693111
    Abstract: A method for sealedly forming an envelope and an apparatus therefor capable of sealedly bonding an anode substrate and a cathode substrate to each other while preventing misregistration therebetween. A sealing glass material is arranged on a periphery of one of the substrates and the other substrate is put on the one substrate. Then, both substrates are registered with each other and then a laser beam is downwardly irradiated on the sealing glass material through the anode substrate to locally melt the sealing glass material, to thereby temporarily bond both substrates to each other. Then, both substrates are heated in an oven, to thereby sealedly bonded to each other, resulting in sealedly forming an envelope.
    Type: Grant
    Filed: July 6, 1995
    Date of Patent: December 2, 1997
    Assignee: Futaba Denshi Kogyo K.K.
    Inventors: Akira Kadowaki, Shigeo Itoh, Youich Kogure, Takeshi Tonegawa