Abstract: A method of manufacturing an electronic device includes a positioning step of positioning a first member supporting a laser diode with respect to a second member having a waveguide, a bonding step of bonding the first member and the second member together, and a checking step of checking the accuracy of positioning of the first member with respect to the second member. In the positioning step, the laser diode is energized to allow laser light to be emitted, and the laser light is allowed to be incident on the incidence end of the waveguide. In the bonding step, a bonding material is melted by irradiating the first member with heating light while the laser diode is not energized. In the checking step, the laser diode is energized again.

Abstract: A method of manufacturing an electronic device includes a positioning step of positioning a first member supporting a laser diode with respect to a second member having a waveguide, a bonding step of bonding the first member and the second member together, and a checking step of checking the accuracy of positioning of the first member with respect to the second member. In the positioning step, the laser diode is energized to allow laser light to be emitted, and the laser light is allowed to be incident on the incidence end of the waveguide. In the bonding step, a bonding material is melted by irradiating the first member with heating light while the laser diode is not energized. In the checking step, the laser diode is energized again.

Abstract: A method of manufacturing an electronic device includes a first bonding step of bonding an electronic component and a first member together via a first bonding layer and a second bonding step of bonding the first member and a second member together via a second bonding layer after the first bonding step. The second bonding layer includes a bonding material layer made of a bonding material. In the second bonding step, with the bonding material interposed between the first and second members before being bonded together, the bonding material is heated and melted using light traveling through the first member. The first member is made of Si. The light has a wavelength in the range of 1100 to 15000 nm.

Abstract: A method of manufacturing a thermally-assisted magnetic recording head includes: providing a light source unit including a light source; providing a substrate having a thermally-assisted magnetic recording head section thereon, the thermally-assisted magnetic recording head section including a magnetic pole, a plasmon generator, and an optical waveguide; inserting a metal between the light source unit and the substrate, and thus allowing the metal to be melted; and performing alignment between the light source unit and the thermally-assisted magnetic recording head section under application of pressure in a direction that allows the light source unit and the substrate to approach each other, while maintaining the metal melted.

Abstract: A method of manufacturing a thermally-assisted magnetic recording head includes: providing a light source unit including a laser diode; providing a slider having a thermally-assisted magnetic recording head section thereon, the thermally-assisted magnetic recording head section including a magnetic pole, an optical waveguide, and a plasmon generator, the magnetic pole and the optical waveguide both extending toward an air bearing surface, the plasmon generator being located between the magnetic pole and the optical waveguide; driving the laser diode to allow a light beam to be emitted therefrom, the light beam including both a TE polarization component and a TM polarization component; performing an alignment between the light source unit and the thermally-assisted magnetic recording head section, based on a light intensity distribution of the TE polarization component in the light beam which has been emitted from the laser diode and then passed through the optical waveguide; and bonding the light source unit