Patents by Inventor Youichi Haruta

Youichi Haruta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6471155
    Abstract: A method and an apparatus of winding a wire for a stator core in which, in order to wind a wire on a plurality of poles provided along an outer periphery of a stator core, a tension acting on the wire during the time when the wire between a pole on which the wire is wound and a wire support passes on each of side formers is made lower than a tension acting on the wire from the time when the wire between the pole on which the wire is to be wound and the wire support has passed on one of the side formers to the time when the wire starts to come into contact with the other thereof. Therefore, even a relatively thick wire can be wound while being prevented from getting bend marks, whereby a quality as a stator can be improved.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: October 29, 2002
    Assignee: Sawafuji Electric Co., Ltd.
    Inventors: Youichi Haruta, Kazuyoshi Kobayashi
  • Publication number: 20020017585
    Abstract: A method and an apparatus of winding a wire for a stator core in which, in order to wind a wire on a plurality of poles provided along an outer periphery of a stator core, a tension acting on the wire during the time when the wire between a pole on which the wire is wound and a wire support passes on each of side formers is made lower than a tension acting on the wire from the time when the wire between the pole on which the wire is to be wound and the wire support has passed on one of the side formers to the time when the wire starts to come into contact with the other thereof. Therefore, even a relatively thick wire can be wound while being prevented from getting bend marks, whereby a quality as a stator can be improved.
    Type: Application
    Filed: June 21, 2001
    Publication date: February 14, 2002
    Inventors: Youichi Haruta, Kazuyoshi Kobayashi
  • Patent number: 5811907
    Abstract: A small generator comprising a stator having slots on the inner circumferential surface thereof and generating windings wound on the slots, and a salient-pole type rotor freely rotating inside the stator, in which the stator has a plurality of recesses whose width is essentially the same as the width of openings of the slots and whose area is smaller than the area of the slots, provided at the same intervals as the circumferential intervals of the slots in the vicinity of the opening of the slots; the rotor has circular-arc shaped bulged portions formed outside a shaft hole on the rotor, and crimping portions whose width is smaller than the diameter of a shaft hole provided at the center of the bulged portions; the width of the magnetic path of the rotor winding portion is made more than twice as large as the minimum slot back length of the slots provided on the stator.
    Type: Grant
    Filed: October 23, 1996
    Date of Patent: September 22, 1998
    Assignee: Sawafuji Electric Co., Ltd.
    Inventors: Masahiro Fukuda, Tohru Yoshioka, Youichi Haruta, Tohru Nishikura
  • Patent number: 5544773
    Abstract: Provided is a method for making a multilayer printed circuit board having blind holes which comprises heat laminating a copper foil and an inner layer panel previously provided with circuit patterns on one or both sides thereof by processing a copper-clad laminate, a resin layer soluble in an aqueous alkali solution and having a flowability upon heating being present between said copper foil and said inner layer panel, forming via holes in the surface copper foil by etching and then dissolving the resin layer under said via holes with an aqueous alkali solution and removing the resin layer, thereby to form blind holes in which the copper foil on the inner layer panel is exposed. Further provided is a copper foil used for making multilayer printed circuit boards, which is provided with a resin layer soluble in an aqueous alkali solution and having flowability upon heating on its roughened surface.
    Type: Grant
    Filed: June 2, 1994
    Date of Patent: August 13, 1996
    Inventors: Youichi Haruta, Tomio Kambayashi, Hitoshi Kato, Hiromu Taguchi
  • Patent number: 4152477
    Abstract: A printed circuit board made by providing on an insulating substrate an adhesive coating comprising a butadiene-based rubber and a phenolic resin finely dispersed therein, etching the surface layer of said coating with an oxidizing agent to expose the microcapsules having phenolic resin shells, which have been formed during the setting of said adhesive coating, and forming a chemically deposited metal layer on said adhesive coating.
    Type: Grant
    Filed: January 17, 1977
    Date of Patent: May 1, 1979
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Youichi Haruta, Teruyo Noguchi, Hiroshi Yasuda, Hiroshi Sakata