Patents by Inventor Youichi Hoshikawa

Youichi Hoshikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing board
    Patent number: 10396020
    Abstract: A board includes a plate-shaped member having a first wiring pattern, a first resin layer formed on a first surface of the plate-shaped member, the first surface having the first wiring pattern, a second resin layer stacked on the first resin layer, and a component fixed to the second resin layer in which a second wiring pattern formed on a second surface of the component is buried.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: August 27, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Kei Fukui, Youichi Hoshikawa, Hiromitsu Kobayashi, Hidehiko Fujisaki, Seigo Yamawaki, Masateru Koide, Manabu Watanabe, Daisuke Mizutani, Tomoyuki Akahoshi
  • BOARD AND METHOD OF MANUFACTURING BOARD
    Publication number: 20180315687
    Abstract: A board includes a plate-shaped member having a first wiring pattern, a first resin layer formed on a first surface of the plate-shaped member, the first surface having the first wiring pattern, a second resin layer stacked on the first resin layer, and a component fixed to the second resin layer in which a second wiring pattern formed on a second surface of the component is buried.
    Type: Application
    Filed: April 19, 2018
    Publication date: November 1, 2018
    Applicant: FUJITSU LIMITED
    Inventors: Kei FUKUI, Youichi Hoshikawa, Hiromitsu KOBAYASHI, Hidehiko Fujisaki, Seigo Yamawaki, Masateru Koide, MANABU WATANABE, Daisuke Mizutani, Tomoyuki AKAHOSHI