Patents by Inventor Youichi Kodaira

Youichi Kodaira has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stamp making unit and package therefor
    Patent number: 5915299
    Abstract: A stamp making unit is provided having a structure such that gel photosensitive resin for forming a stamping surface can be protected appropriately and non-cured portions of the photosensitive resin can easily be removed after the stamping surface has been formed. A package capable of satisfactorily storing a stamp making unit of the foregoing type is also provided. The stamp making unit uses photosensitive resin as a base material for forming a stamping surface of a stamp which changes from a gel state to a solid state due to received light. The stamping unit comprises a stock member, photosensitive resin bonded to a surface of the stock member on which the stamping surface is formed and a cover member bonded to a surface of the photosensitive resin having light transmission properties. Adhesion between the photosensitive resin in the gel state and the stock member is weaker than adhesion between the photosensitive resin in the gel state and the cover member.
    Type: Grant
    Filed: March 28, 1996
    Date of Patent: June 29, 1999
    Assignee: Seiko Epson Corporation
    Inventors: Hiroshi Kuriyama, Youichi Kodaira, Kozo Gyoda
  • Stamp material, stamp making method using the stamp material and stamp manufactured by the stamp making method
    Patent number: 5771808
    Abstract: There are provided a stamp material from which a stamp can be simply made and which, in particular, permits the unexposed portion of a photoconductive resin to be easily removed in a making process, a stamp making method and a stamp. The stamp material comprises a face of a seal forming member having a photosensitive resin which is changed from a liquid to a solid in response to a received light and a stamp stock for holding the face of a seal forming member. With this arrangement, the portion of the photoconductive resin to which a light is irradiated is cured and adhered to the stamp stock and the portion thereof to which the light is not irradiated flows out or can be simply exfoliated without being cured.
    Type: Grant
    Filed: November 12, 1996
    Date of Patent: June 30, 1998
    Assignee: Seiko Epson Corporation
    Inventors: Hiroshi Kuriyama, Youichi Kodaira
  • Stamp unit and method of preparing stamp unit
    Patent number: 5669304
    Abstract: A stamp unit and a method of preparing the same are provided in which a liquid photosensitive resin is used as the base material for stamp formation and the ease with which the material is handled during transportation, storage and stamp formation is facilitated. The stamp unit uses a liquid photosensitive resin which changes from liquid to solid upon receiving rays of light as the base material for stamp face formation.
    Type: Grant
    Filed: March 28, 1996
    Date of Patent: September 23, 1997
    Assignee: Seiko Epson Corporation
    Inventors: Hiroshi Kuriyama, Youichi Kodaira, Haruyuki Miyasaka, Hideki Horiuochi