Abstract: The substrate processing apparatus includes: a plurality of processing modules; a transfer mechanism; a controller; and a setting unit. The processing module processes with respect to the substrate. The transfer mechanism transfers the substrate ejected from the transfer container. The controller outputs control signals for transferring the substrate to the plurality of processing modules along a previously set transfer path through the transfer mechanism sequentially, and for processing with respect to the substrate in the processing module of a transfer destination based on a processing recipe in which a processing order and a processing condition are set. The setting unit sets a content of a non-recipe operation except for operations set in the processing recipe and a performing timing for performing the non-recipe operation by a control operation of the controller every processing module. The non-recipe operation is performed with respect to the processing modules.

Abstract: A method of lowering a temperature of a substrate table uses a substrate W processing system including a first substrate table 2b; one or more processing chambers 1b, in each of which the first substrate table 2b is disposed, the processing chamber being configured to perform a predetermined process, with the substrate being placed on the first substrate table 2b; a substrate transfer apparatus 31 configured to transfer the substrate to the processing chamber 1b; a transfer chamber in which the substrate transfer apparatus 31 is disposed; and a second substrate table configured to cool the substrate. The method of lowering a temperature of a substrate table comprises the steps of first transfer in which the substrate W placed on the first substrate table 2b is transferred to the second substrate table by the substrate transfer apparatus 31, and second transfer in which the substrate placed on the second substrate table is transferred to the first substrate table 2b.

Abstract: The substrate processing apparatus includes: a plurality of processing modules; a transfer mechanism; a controller; and a setting unit. The processing module processes with respect to the substrate. The transfer mechanism transfers the substrate ejected from the transfer container. The controller outputs control signals for transferring the substrate to the plurality of processing modules along a previously set transfer path through the transfer mechanism sequentially, and for processing with respect to the substrate in the processing module of a transfer destination based on a processing recipe in which a processing order and a processing condition are set. The setting unit sets a content of a non-recipe operation except for operations set in the processing recipe and a performing timing for performing the non-recipe operation by a control operation of the controller every processing module. The non-recipe operation is performed with respect to the processing modules.

Abstract: A processing system for performing a predetermined process on a target object includes one or more processing apparatuses that process the target object and a controller that controls the processing apparatuses. Here, the controller performs a control to select any one of a shutdown state in which a multiple number of end devices of the processing apparatuses are all stopped and a standby state in which some or all of the end devices are ready to perform a process on the target object, when the controller is shut down.

Abstract: A method of lowering a temperature of a substrate table uses a substrate W processing system including a first substrate table 2b; one or more processing chambers 1b, in each of which the first substrate table 2b is disposed, the processing chamber being configured to perform a predetermined process, with the substrate being placed on the first substrate table 2b; a substrate transfer apparatus 31 configured to transfer the substrate to the processing chamber 1b; a transfer chamber in which the substrate transfer apparatus 31 is disposed; and a second substrate table configured to cool the substrate. The method of lowering a temperature of a substrate table comprises the steps of first transfer in which the substrate W placed on the first substrate table 2b is transferred to the second substrate table by the substrate transfer apparatus 31, and second transfer in which the substrate placed on the second substrate table is transferred to the first substrate table 2b.

Abstract: A processing system for performing a predetermined process on a target object includes one or more processing apparatuses that process the target object and a controller that controls the processing apparatuses. Here, the controller performs a control to select any one of a shutdown state in which a multiple number of end devices of the processing apparatuses are all stopped and a standby state in which some or all of the end devices are ready to perform a process on the target object, when the controller is shut down.

Abstract: A plasma processing apparatus includes a process container configured to accommodate a target substrate and to be vacuum-exhausted. A first electrode and a second electrode are disposed opposite each other within the process container. A process gas supply unit is configured to supply a process gas into the process container. An RF power supply is configured to apply an RF power to the first electrode or second electrode to generate plasma of the process gas. A DC power supply is configured to apply a DC voltage to the first electrode or second electrode. A control section is configured to control the RF power supply and the DC power supply such that the DC power supply causes the DC voltage applied therefrom to reach a voltage set value, when or after the RF power supply starts applying the RF power.

Abstract: A substrate processing apparatus, which includes a plurality of process chambers for processing a substrate and a transfer part for carrying in and carrying out the substrate to and from the plurality of process chambers, includes a transfer history recording part, a process history recording part, and an alarm history recording part. The transfer history recording part relates history information concerning a transfer of the substrate by the transfer part to each substrate, and records the history information as first history information. The process history recording part relates history information concerning a process state of the substrate in each of the plurality of process chambers to each substrate subject to be processed, and records the history information as second history information.

Abstract: A plasma processing apparatus includes a process container configured to accommodate a target substrate and to be vacuum-exhausted. A first electrode and a second electrode are disposed opposite each other within the process container. A process gas supply unit is configured to supply a process gas into the process container. An RF power supply is configured to apply an RF power to the first electrode or second electrode to generate plasma of the process gas. A DC power supply is configured to apply a DC voltage to the first electrode or second electrode. A control section is configured to control the RF power supply and the DC power supply such that the DC power supply causes the DC voltage applied therefrom to reach a voltage set value, when or after the RF power supply starts applying the RF power.

Abstract: A substrate processing apparatus, which includes a plurality of process chambers for processing a substrate and a transfer part for carrying in and carrying out the substrate to and from the plurality of process chambers, includes a transfer history recording part, a process history recording part, and an alarm history recording part. The transfer history recording part relates history information concerning a transfer of the substrate by the transfer part to each substrate, and records the history information as first history information. The process history recording part relates history information concerning a process state of the substrate in each of the plurality of process chambers to each substrate subject to be processed, and records the history information as second history information.