Patents by Inventor Youichi Tsunoda

Youichi Tsunoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inexpensive resin molded semiconductor device
    Patent number: 5982026
    Abstract: In a resin molded semiconductor device, a metal lead frame includes an island and leads, and the leads have bulged terminal portions. Also, a semiconductor chip is mounted on the island, and external terminals are adhered to the bulged terminal portions opposite to the semiconductor chip. Further, an envelope of resin encapsulates the metal lead frame, the semiconductor chip and a part of each of the external terminals.
    Type: Grant
    Filed: July 16, 1997
    Date of Patent: November 9, 1999
    Assignee: NEC Corporation
    Inventor: Youichi Tsunoda
  • Molding die used for sealing semiconductor chips with good productivity and lead-frame used for mounting semiconductor chips
    Patent number: 5741530
    Abstract: A molding die has a plurality of cavity groups each occupying four corners of a rectangular area for accommodating semiconductor chips mounted on a lead-frame, pots each occupying a central area of the rectangular area and a plurality of runner groups each having straight runners equal in length and connecting the pot to the cavities in the four corners, and molten resin concurrently reaches the cavities in the four corners so as to produce semiconductor devices without non-filling or partially filling cavity.
    Type: Grant
    Filed: January 25, 1996
    Date of Patent: April 21, 1998
    Assignee: NEC Corporation
    Inventor: Youichi Tsunoda