Patents by Inventor Youichi Yokote

Youichi Yokote has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component module and method for manufacturing the same
    Patent number: 7808796
    Abstract: An electronic component module comprises a circuit board having a cavity in one principal surface thereof. The electronic component module also comprises a first semiconductor device accommodated within the cavity and a second semiconductor device disposed on the one principal surface of the circuit board so as to cover the first semiconductor device in plan view. The electronic component module further comprises a resin material disposed to cover at least a side surface of the second semiconductor device.
    Type: Grant
    Filed: September 10, 2007
    Date of Patent: October 5, 2010
    Assignees: Kyocera Corporation, Kyocera Kinseki Corporation
    Inventors: Hidefumi Hatanaka, Tsutomu Adachi, Youichi Yokote, Miho Imashioya, Tomohiko Taniguchi
  • Electronic Component Module and Method for Manufacturing the Same
    Publication number: 20080192443
    Abstract: An electronic component module comprises a circuit board having a cavity in one principal surface thereof. The electronic component module also comprises a first semiconductor device accommodated within the cavity and a second semiconductor device disposed on the one principal surface of the circuit board so as to cover the first semiconductor device in plan view. The electronic component module further comprises a resin material disposed to cover at least a side surface of the second semiconductor device.
    Type: Application
    Filed: September 10, 2007
    Publication date: August 14, 2008
    Applicants: KYOCERA CORPORATION, KYOCERA KINSEKI CORPORATION
    Inventors: Hidefumi HATANAKA, Tsutomu ADACHI, Youichi YOKOTE, Miho IMASHIOYA, Tomohiko TANIGUCHI