Abstract: Provided is a welding joining method for joining end portions of first and second pipes made of polyamide resin by bonding the end portions to each other by pressure in a molten state. The welding joining method includes: a placing step of placing an infrared radiation lamp between the first and second pipes placed to face each other at an interval; a heating and melting step of heating and melting the end portions of the first and second pipes by emitting infrared; and a pressure bonding step of cooling down the molten end portions in a state where the molten end portions are bonded to each other by pressure.

Abstract: Provided is a welding joining method for joining end portions of first and second pipes made of polyamide resin by bonding the end portions to each other by pressure in a molten state. The welding joining method includes: a placing step of placing an infrared radiation lamp between the first and second pipes placed to face each other at an interval; a heating and melting step of heating and melting the end portions of the first and second pipes by emitting infrared; and a pressure bonding step of cooling down the molten end portions in a state where the molten end portions are bonded to each other by pressure.

Abstract: Provided is a forming mold for a pressure container liner including a female serration on an upper face of a top portion. The forming mold includes an insert including a recessed-projecting portion by which the female serration is to be formed. The insert includes a lower layer and an upper layer divided from each other in the up-down direction. Bolt holes are formed in respective radial central parts of the upper layer and the lower layer. Gaps on contacting faces between the upper layer and the lower layer are set to a size that allows gas to pass through the gaps but does not allow nylon resin to pass through the gaps. An air-discharge passage via which a vicinal area of the recessed-projecting portion is connected to the bolt holes is formed on the contacting faces.

Abstract: An infrared welding device successively joins component members of a liner to one another. The infrared welding device is equipped with collet chucks that hold domes and a pipe slidably and coaxially with gaps created therebetween respectively, infrared radiation lamps that melt end portions of the domes and end portions of the pipe through heating respectively, vertical operation mechanisms that move the infrared radiation lamps between insertion positions and retreat positions respectively, and a pressing mechanism and a pressure-receiving mechanism that press the end portions of the domes against the end portions of the pipe respectively.

Abstract: Provided is a welding joining method for joining end portions of first and second pipes made of polyamide resin by bonding the end portions to each other by pressure in a molten state. The welding joining method includes: a placing step of placing an infrared radiation lamp between the first and second pipes placed to face each other at an interval; a heating and melting step of heating and melting the end portions of the first and second pipes by emitting infrared; and a pressure bonding step of cooling down the molten end portions in a state where the molten end portions are bonded to each other by pressure.

Abstract: Disclosed is a technique capable of preventing an encapsulating material from covering a heat-dissipating surface of a semiconductor module, which releases heat of a switching element. Specifically disclosed a step for manufacturing a semiconductor module including a submodule having a collector and an emitter with heat-dissipating surfaces, including a step for placing the submodule in the cavity so that the submodule is pressed by the pressing device while covering the heat-dissipating surface of the emitter with the pressing device and covering the heat-dissipating surface of the collector with the lower mold, and a step for feeding the encapsulating material to the cavity by moving the piston so that the pressure of the cavity measured by the pressure measuring device does not exceed the pressure at which the pressing device presses the submodule.

Abstract: Disclosed is a technique capable of preventing an encapsulating material from covering a heat-dissipating surface of a semiconductor module, which releases heat of a switching element. Specifically disclosed a step for manufacturing a semiconductor module including a submodule having a collector and an emitter with heat-dissipating surfaces, including a step for placing the submodule in the cavity so that the submodule is pressed by the pressing device while covering the heat-dissipating surface of the emitter with the pressing device and covering the heat-dissipating surface of the collector with the lower mold, and a step for feeding the encapsulating material to the cavity by moving the piston so that the pressure of the cavity measured by the pressure measuring device does not exceed the pressure at which the pressing device presses the submodule.

Abstract: A condenser for a power module combines a plurality of aluminum materials to form a casing equipped with a channel for coolant therein, thus making it possible to keep material costs low. Moreover, thanks to the excellent workability of the aluminum materials, it is possible to adopt a configuration with a complex concave-convex configuration for a superior heat radiation performance. A channel for coolant with high heat radiation performance can also be structured inside the casing. The relatively thick bottom plate secures the rigidity required by the casing, while the relatively thin top plate can have a rigidity intentionally structured lower. In this manner, stress generated on joining surfaces of the condenser and an insulative substrate can be mitigated due to active deformation of the top plate.

Abstract: A condenser for a power module combines a plurality of aluminum materials to form a casing equipped with a channel for coolant therein, thus making it possible to keep material costs low. Moreover, thanks to the excellent workability of the aluminum materials, it is possible to adopt a configuration with a complex concave-convex configuration for a superior heat radiation performance. A channel for coolant with high heat radiation performance can also be structured inside the casing. The relatively thick bottom plate secures the rigidity required by the casing, while the relatively thin top plate can have a rigidity intentionally structured lower. In this manner, stress generated on joining surfaces of the condenser and an insulative substrate can be mitigated due to active deformation of the top plate.

Abstract: An insulating circuit board includes an insulating plate, a circuit board joined to a first surface of the insulating plate, and a metal plate joined to a second surface of the insulating plate. The circuit board is formed from an Al alloy having a purity of 99.98% or more or pure Al, and the metal plate is formed from an Al alloy having a purity of 98.00% or more and 99.90% or less. The thickness (a) of the circuit board is 0.2 mm or more and 0.8 mm or less, the thickness (b) of the metal plate is 0.6 mm or more and 1.5 mm or less, and the thicknesses satisfy the expression of a/b?1. An insulating circuit board having a cooling sink includes cooling sink joined via a second solder layer. The second solder layer contains Sn as its main component, and has a Young's modulus, 35 GPa or more, a 0.2% proof stress of, 30 MPa or more, and a tensile strength of, 40 MPa or more. The cooling sink is formed from, pure Al or an Al alloy.

Abstract: A throttle device for applying a back pressure to a high viscosity point in an airless paint supply system. The throttle device comprises a tube member having an inner through hole and an elongated core member inserted in the tube member and extending along the length of the tube member. A support means supports the core member relative to the tube member and a clearance is provided between the tube member and the core member to constitute a passage for the paint, the clearance being equal to or larger than 1.5 millimeters, and the length of the tube member being selected in relation to the clearance so as to cause a required loss of pressure.

Abstract: An air atomizing electrostatic coating gun which atomizers a liquid paint by using air flows and thereafter applying atomized liquid paint to an object to be coated by using an electrostatic force. In this coating gun, all of a rod valve, a driving piston, an air cylinder and valve support members of a needle valve device are made of insulating materials having good insulating properties, and an electrode for charging paint particles is attached to the valve. A nozzle-needle valve assembly which is integrally constructed by attaching a paint nozzle to a cylindrical extension of the air cylinder which is formed at a front end portion thereof, is inserted and fitted into a generally cylindrical cavity in a front end portion of the gun body from the front side thereof.

Abstract: An electrostatic painting gun for painting minute places which are hard to reach is disclosed. The electrostatic painting gun includes a bent rod-shaped gun and a bracket which are arranged so as to form a trapezoid-like pocket space. The trapezoid-like pocket space serves to provide the electrostatic painting gun with better accessibility to the minute places.