Patents by Inventor Youichirou Hamada

Youichirou Hamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadframe and method of manufacturing the same
    Patent number: 7521295
    Abstract: A leadframe is plated with palladium only to a surface of a metal plate on which semiconductors elements are to be mounted and a surface of the metal plate to be placed on a substrate, and is not plated with palladium to lead portions, pad portions, other portions except for the surfaces to be plated and the side surface, of the leadframe, thereby, the amount of use of palladium is reduced to minimum and a cheap leadframe can be provided.
    Type: Grant
    Filed: February 15, 2007
    Date of Patent: April 21, 2009
    Assignee: Sumitomo Metal Mining Co., Ltd.
    Inventors: Ichinori Iitani, Youichirou Hamada
  • Lead frame and its manufacturing method
    Patent number: 7235868
    Abstract: A leadframe is plated with palladium only to a surface of a metal plate on which semiconductors elements are to be mounted and a surface of the metal plate to be placed on a substrate, and is not plated with palladium to lead portions, pad portions, other portions except for the surfaces to be plated and the side surface, of the leadframe, thereby, the amount of use of palladium is reduced to minimum and a cheap leadframe can be provided.
    Type: Grant
    Filed: July 9, 2002
    Date of Patent: June 26, 2007
    Assignee: Sumitomo Metal Mining Co., Ltd.
    Inventors: Ichi Iitani, Youichirou Hamada
  • Leadframe and method of manufacturing the same
    Publication number: 20070141756
    Abstract: A leadframe is plated with palladium only to a surface of a metal plate on which semiconductors elements are to be mounted and a surface of the metal plate to be placed on a substrate, and is not plated with palladium to lead portions, pad portions, other portions except for the surfaces to be plated and the side surface, of the leadframe, thereby, the amount of use of palladium is reduced to minimum and a cheap leadframe can be provided.
    Type: Application
    Filed: February 15, 2007
    Publication date: June 21, 2007
    Inventors: Ichinori Iitani, Youichirou Hamada
  • Leadframe and method of manufacturing the same
    Publication number: 20050153482
    Abstract: A leadframe is plated with palladium only to a surface of a metal plate on which semiconductors elements are to be mounted and a surface of the metal plate to be placed on a substrate, and is not plated with palladium to lead portions, pad portions, other portions except for the surfaces to be plated and the side surface, of the leadframe, thereby, the amount of use of palladium is reduced to minimum and a cheap leadframe can be provided.
    Type: Application
    Filed: March 10, 2005
    Publication date: July 14, 2005
    Inventors: Ichinori IItani, Youichirou Hamada
  • Lead frame and its manufacturing method
    Publication number: 20040169261
    Abstract: A leadframe is plated with palladium only to a surface of a metal plate on which semiconductors elements are to be mounted and a surface of the metal plate to be placed on a substrate, and is not plated with palladium to lead portions, pad portions, other portions except for the surfaces to be plated and the side surface, of the leadframe, thereby, the amount of use of palladium is reduced to minimum and a cheap leadframe can be provided.
    Type: Application
    Filed: January 7, 2004
    Publication date: September 2, 2004
    Inventors: Ichinori Iitani, Youichirou Hamada